公开(公告)号：US10814496B2

公开(公告)日：2020-10-27

申请号：US15839691

申请日：2017-12-12

申请人： Apple Inc.

发明人： Andreas Bibl ,  Paul A. Parks ,  Stephen P. Bathurst ,  Jon A. Williams ,  John A. Higginson ,  Shenshen Zhao

IPC分类号： B25J15/00 ,  H01L21/677 ,  H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  B25J7/00 ,  B25J15/04

摘要： Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.

公开(公告)号：US20180194014A1

公开(公告)日：2018-07-12

申请号：US15839691

申请日：2017-12-12

申请人： Apple Inc.

发明人： Andreas Bibl ,  Paul A. Parks ,  Stephen P. Bathurst ,  Jon A. Williams ,  John A. Higginson ,  Shenshen Zhao

IPC分类号： B25J15/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683

CPC分类号： B25J15/0085 ,  B25J7/00 ,  B25J15/0033 ,  B25J15/0052 ,  B25J15/0408 ,  H01L21/67144 ,  H01L21/67288 ,  H01L21/67721 ,  H01L21/68 ,  H01L21/683

摘要： Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.