公开(公告)号：US12131922B1

公开(公告)日：2024-10-29

申请号：US17089585

申请日：2020-11-04

申请人： Apple Inc.

发明人： Andreas Bibl ,  John A. Higginson ,  Patrick J. Czarnota ,  Paul A. Parks ,  Nile A. Light

IPC分类号： H01L21/68 ,  B65G47/90 ,  H01L21/67 ,  H01L21/683 ,  B25J7/00 ,  B25J9/00 ,  B25J15/00

CPC分类号： H01L21/67144 ,  B65G47/90 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6831 ,  B25J7/00 ,  B25J9/0015 ,  B25J15/0085

摘要： A micro device transfer tool and methods of operation in which the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is included for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is included for sensing position of various system components during alignment or pick and place processes.

公开(公告)号：US11480742B1

公开(公告)日：2022-10-25

申请号：US17089509

申请日：2020-11-04

申请人： Apple Inc.

发明人： Patrick J. Czarnota ,  Paul A. Parks ,  Edmund L. Ma ,  Wei Wang

IPC分类号： G02B6/42 ,  G01D5/39 ,  G01D5/30 ,  H01L31/0232

摘要： A micro device transfer tool and methods of operation are described. In an embodiment, the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is described for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is described for sensing position of various system components during alignment or pick and place processes.

公开(公告)号：US10814496B2

公开(公告)日：2020-10-27

申请号：US15839691

申请日：2017-12-12

申请人： Apple Inc.

发明人： Andreas Bibl ,  Paul A. Parks ,  Stephen P. Bathurst ,  Jon A. Williams ,  John A. Higginson ,  Shenshen Zhao

IPC分类号： B25J15/00 ,  H01L21/677 ,  H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  B25J7/00 ,  B25J15/04

摘要： Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.

公开(公告)号：US20180194014A1

公开(公告)日：2018-07-12

申请号：US15839691

申请日：2017-12-12

申请人： Apple Inc.

发明人： Andreas Bibl ,  Paul A. Parks ,  Stephen P. Bathurst ,  Jon A. Williams ,  John A. Higginson ,  Shenshen Zhao

IPC分类号： B25J15/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683

CPC分类号： B25J15/0085 ,  B25J7/00 ,  B25J15/0033 ,  B25J15/0052 ,  B25J15/0408 ,  H01L21/67144 ,  H01L21/67288 ,  H01L21/67721 ,  H01L21/68 ,  H01L21/683

摘要： Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.