公开(公告)号：US20130274931A1

公开(公告)日：2013-10-17

申请号：US13623034

申请日：2012-09-19

Applicant: APPLE INC.

Inventor： Shravan BHARADWAJ ,  David I. MORGENSTERN

IPC: G01B5/02

CPC classification number: B29C59/16 ,  B23K26/0093 ,  B23K26/032 ,  B23K26/0622 ,  B23K26/356 ,  G01B5/02 ,  G01B21/02 ,  G06F1/1601 ,  G06F1/181

Abstract: Systems which may be employed to adjust the shape of computer housing are provided. The systems may include a measurement apparatus that measures the positions of points on the housing. A determining apparatus may determine an offset between the position of the points and reference values. An adjustment apparatus may apply a laser to the computer housing having parameters based on the offset at each of the points. The adjustment apparatus can rely upon a laser beam that impinges on the surface of the computer housing causing a shock wave that, in turn, creates a force that elastically deforms the computer housing. This process may be repeated or otherwise continued until the offset is within a predetermined range of acceptable values.

Abstract translation: 提供了可用于调整计算机外壳形状的系统。 系统可以包括测量装置，其测量壳体上的点的位置。 确定装置可以确定点的位置和参考值之间的偏移。 调整装置可以对具有参数的计算机外壳施加激光，该参数基于每个点处的偏移。 调节装置可以依赖于冲击在计算机壳体的表面上的激光束，导致冲​​击波，这又产生使计算机外壳弹性变形的力。 该过程可以重复或以其他方式继续，直到偏移在可接受值的预定范围内。

公开(公告)号：US20200100383A1

公开(公告)日：2020-03-26

申请号：US16583155

申请日：2019-09-25

Applicant: Apple Inc.

Inventor： Daniel D. HERSHEY ,  Christoph M. PISTOR ,  Bartley K. ANDRE ,  Richard D. KOSOGLOW ,  Michael D. MCBROOM ,  Shravan BHARADWAJ ,  Jonathan L. BERK ,  Houtan R. FARAHANI ,  James M. CUSEO ,  William R. ALLAN, II ,  David C. PARELL ,  Eric A. KNOPF ,  Seth G. MCFARLAND

IPC: H05K7/16 ,  H05K7/14 ,  H05K9/00

Abstract: A rack system for one or more computing systems is described. The rack system may include support structures, or rack structures, and a housing affixed or un-affixed to the support structures. The rack system may include rails, including telescoping rails, affixed to the support structures and coupled to the computing system. When the rack system is in a closed position, the computing system is positioned within the housing. When the rack system is in an open position, the computing system is removed from the housing and the components of the computing system are accessible. In the open position, only components on one surface of the circuit board are accessible. However, the computing system can rotate, thereby placing the components on the opposing surface of the circuit board in an accessible position. Alternatively, the housing can be affixed to the computing system, and include modifications for access to the computing system.

公开(公告)号：US20170092400A1

公开(公告)日：2017-03-30

申请号：US15247723

申请日：2016-08-25

Applicant: Apple Inc.

Inventor： Shravan BHARADWAJ

IPC: H01F7/02 ,  H01F1/057 ,  H01F1/053 ,  H01F41/02 ,  H01F13/00

CPC classification number: H01F7/021 ,  B29C64/153 ,  H01F1/0536 ,  H01F1/057 ,  H01F13/003 ,  H01F41/0253 ,  H01F41/0273

Abstract: A unibody magnetic structure having layers of variably magnetized material is disclosed. The unibody magnetic structure can be formed by way of additive manufacturing, such as by a stereolithographic (SLA) process or a selective laser sintering (SLS) process. The SLA process can involve forming the structure from a molten pool of polymer material, with the material having a magnetic component dissolved therein. The SLS process can involve sintering the structure from a powder having a magnetic component. As each layer is formed, the layer can be selectively magnetized with a given polarity and strength. The magnetization of each formed layer can vary, such that the final structure comprises numerous layers having different shapes and sizes, as well as different levels and polarities of magnetization.

公开(公告)号：US20140087628A1

公开(公告)日：2014-03-27

申请号：US13627998

申请日：2012-09-26

Applicant: APPLE INC.

Inventor： Shravan BHARADWAJ

IPC: B24B49/02 ,  B24B51/00 ,  B24B49/12

CPC classification number: B24B19/26 ,  B24B27/0038 ,  B24B49/12

Abstract: The described embodiment relates generally to the development of a finishing process for a device housing. The device housing can be formed of a thermoplastic, or a metal such as aluminum or stainless steel. A method and an apparatus are described for accurately measuring the amount of material removed during a finishing process. More particularly embodiments described within this application disclose a method of accurately measuring material removal during a finishing process across a curved or spline shaped surface by drilling an array of pockets along a surface of the device housing, where the drilled pockets can be used to measure material removal rates with a high degree of accuracy.

Abstract translation: 所描述的实施例大体上涉及开发用于装置壳体的精加工工艺。 装置壳体可以由热塑性材料或诸如铝或不锈钢的金属形成。 描述了一种用于精确测量在精加工过程中去除的材料的量的方法和装置。 在本申请中描述的更具体的实施例公开了一种通过沿着装置壳体的表面钻一个凹穴阵列来精确地测量穿过弯曲或花键状表面的整理过程中的材料去除的方法，其中钻孔可用于测量材料 去除率高精度。