公开(公告)号：US20190006287A1

公开(公告)日：2019-01-03

申请号：US15636408

申请日：2017-06-28

Applicant: Apple Inc.

Inventor： Paul A. Martinez ,  Ming Y. Tsai ,  Won Seop Choi

IPC: H01L23/552 ,  H01L49/02

CPC classification number: H01L23/552 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01L23/642 ,  H01L28/60

Abstract: Capacitor devices having multiple capacitors with similar nominal capacitances are described. The capacitors may be multilayer ceramic capacitors (MLCCs) and may be fabricated employing class 2 materials. The arrangement of the electrodes in the device may reduce relative variations between the capacitors of the device. The capacitor devices may be allow high performance and compact electrical circuits that may employ matched capacitors.

公开(公告)号：US10461040B2

公开(公告)日：2019-10-29

申请号：US15636408

申请日：2017-06-28

Applicant: Apple Inc.

Inventor： Paul A. Martinez ,  Ming Y. Tsai ,  Won Seop Choi

IPC: H01L23/552 ,  H01L23/64 ,  H01L49/02 ,  H01G4/30 ,  H01G4/248 ,  H01G4/232 ,  H01G4/12

Abstract: Capacitor devices having multiple capacitors with similar nominal capacitances are described. The capacitors may be multilayer ceramic capacitors (MLCCs) and may be fabricated employing class 2 materials. The arrangement of the electrodes in the device may reduce relative variations between the capacitors of the device. The capacitor devices may be allow high performance and compact electrical circuits that may employ matched capacitors.

公开(公告)号：US20200066457A1

公开(公告)日：2020-02-27

申请号：US16112500

申请日：2018-08-24

Applicant: Apple Inc.

Inventor： Ching Yu John Tam ,  James John Ashe ,  Gang Ning ,  Won Seop Choi ,  Meng Chi Lee ,  Parin Patel ,  Samuel Benjamin Schaevitz ,  Derek J. DiCarlo

IPC: H01G4/40 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30

Abstract: Capacitors, including multilayer ceramic capacitors, may be subject to faults and failures that create short circuits between their dielectrics. Capacitors having fuses that protect the capacitors or the electrical devices using the capacitors when such faults occur are described herein. Embodiments include the presence of monolithic and non-monolithic structures including the fuse. Embodiments also include capacitors with multiple fuses that may prevent or mitigate capacitor failure. Methods for manufacturing and using the capacitors are also described.

公开(公告)号：US20180061578A1

公开(公告)日：2018-03-01

申请号：US15694726

申请日：2017-09-01

Applicant: Apple Inc.

Inventor： Gang Ning ,  Paul A. Martinez ,  Amanda R. Rainer ,  Won Seop Choi ,  Gemin Li ,  Zhong-Qing Gong ,  Shawn X. Arnold

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/232 ,  H01G4/12 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1209 ,  H01G4/232 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/10015

Abstract: Passive component structures that may save space, are readily manufactured, and are easy to use. In one example, a passive component structure may include two capacitors, each formed as a group of plates separate and apart from the other. The two groups of plates may have a spacing layer between them.

公开(公告)号：US10811192B2

公开(公告)日：2020-10-20

申请号：US16146042

申请日：2018-09-28

Applicant: Apple Inc.

Inventor： Paul A. Martinez ,  Won Seop Choi ,  Gang Ning ,  Chirag V. Shah ,  Martin Schauer ,  Curtis C. Mead ,  Ming Yuan Tsai ,  Albert Wang

IPC: H01G4/005 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30

Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.

公开(公告)号：US20200105473A1

公开(公告)日：2020-04-02

申请号：US16146042

申请日：2018-09-28

Applicant: Apple Inc.

Inventor： Paul A. Martinez ,  Won Seop Choi ,  Gang Ning ,  Chirag V. Shah ,  Martin Schauer ,  Curtis C. Mead ,  Ming Yuan Tsai ,  Albert Wang

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G4/228

Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.