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公开(公告)号：USD954769S1
公开(公告)日：2022-06-14
申请号：US29736743
申请日：2020-06-02
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公开(公告)号：US20240025670A1
公开(公告)日：2024-01-25
申请号：US18375409
申请日：2023-09-29
摘要： A carrier includes a carrier body configured to be supported on a robot to transport one or more process kit rings within a substrate processing system. The carrier further includes fingers extending from the carrier body. The fingers are configured to support the one or more process kit rings. A first finger of the plurality of fingers includes an upper surface that forms a recess to receive the one or more process kit rings.
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公开(公告)号：US12027397B2
公开(公告)日：2024-07-02
申请号：US17206036
申请日：2021-03-18
IPC分类号： H01L21/673
CPC分类号： H01L21/67383
摘要： A set of one or more shelves is configured to be disposed within an enclosure system of a substrate processing system. The set of one or more shelves includes first upper surfaces disposed substantially in a first plane, carrier alignment features configured to align a carrier on the first upper surfaces, second upper surfaces disposed substantially in a second plane that is above the first plane, and process kit ring alignment features configured to align a process kit ring on the carrier above the second upper surfaces.
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公开(公告)号：USD980176S1
公开(公告)日：2023-03-07
申请号：US29736744
申请日：2020-06-02
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公开(公告)号：US20210296149A1
公开(公告)日：2021-09-23
申请号：US17206036
申请日：2021-03-18
IPC分类号： H01L21/673
摘要： A set of one or more shelves is configured to be disposed within an enclosure system of a substrate processing system. The set of one or more shelves includes first upper surfaces disposed substantially in a first plane, carrier alignment features configured to align a carrier on the first upper surfaces, second upper surfaces disposed substantially in a second plane that is above the first plane, and process kit ring alignment features configured to align a process kit ring on the carrier above the second upper surfaces.
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公开(公告)号：US20210292104A1
公开(公告)日：2021-09-23
申请号：US17205878
申请日：2021-03-18
摘要： A carrier includes a rigid body forming a plurality of openings and a plurality of fasteners configured to removably attach to the rigid body via the plurality of openings. A first set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The first set of fingers is configured to support first content during first transportation of the carrier within a substrate processing system. A second set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The second set of fingers is configured to support second content during second transportation of the carrier within the substrate processing system.
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