公开(公告)号：US20210175106A1

公开(公告)日：2021-06-10

申请号：US17180570

申请日：2021-02-19

Applicant: Applied Materials, Inc.

Inventor： Earl HUNTER ,  Russell DUKE ,  Amitabh PURI ,  Steven M. REEDY

IPC: H01L21/67 ,  H04W12/06 ,  G05B19/042 ,  G05B19/418 ,  G06K7/10 ,  H04L29/06 ,  B24B1/00 ,  B24B37/005 ,  B24B37/20 ,  B24B37/30

Abstract: Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components, including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example, radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.

公开(公告)号：US20180158707A1

公开(公告)日：2018-06-07

申请号：US15810628

申请日：2017-11-13

Applicant: Applied Materials, Inc.

Inventor： Earl HUNTER ,  Russell DUKE ,  Amitabh PURI ,  Steven M. REEDY

IPC: H01L21/67 ,  H04W12/06 ,  H04L29/06 ,  G06K7/10 ,  G05B19/418

CPC classification number: H01L21/67294 ,  B24B1/00 ,  B24B37/005 ,  B24B37/20 ,  B24B37/30 ,  G05B19/0425 ,  G05B19/4183 ,  G05B2219/31322 ,  G05B2219/45031 ,  G06K7/10366 ,  H04L63/0492 ,  H04W12/06

Abstract: Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.