公开(公告)号：US20190030677A1

公开(公告)日：2019-01-31

申请号：US16037783

申请日：2018-07-17

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  David J. LISCHKA ,  Erik RONDUM ,  Jay GURUSAMY ,  Robert D. TOLLES ,  Steven M. ZUNIGA ,  Steven M. REEDY ,  Wai- Ming KAN

IPC: B24B37/24 ,  B24B37/005

Abstract: Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In one implementation, a method of polishing a substrate is provided. The method comprises advancing a polishing material across a surface of a platen. The polishing material has a polishing surface and an opposing backside surface and the backside surface has a pattern of identifying features formed thereon. The method further comprises sensing the movement of the pattern of identifying features past a detector assembly. The method further comprises controlling a position of the polishing material relative to the platen based on data received from the sensed movement of the pattern of identifying features.

公开(公告)号：US20210175106A1

公开(公告)日：2021-06-10

申请号：US17180570

申请日：2021-02-19

Applicant: Applied Materials, Inc.

Inventor： Earl HUNTER ,  Russell DUKE ,  Amitabh PURI ,  Steven M. REEDY

IPC: H01L21/67 ,  H04W12/06 ,  G05B19/042 ,  G05B19/418 ,  G06K7/10 ,  H04L29/06 ,  B24B1/00 ,  B24B37/005 ,  B24B37/20 ,  B24B37/30

Abstract: Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components, including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example, radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.

公开(公告)号：US20180158707A1

公开(公告)日：2018-06-07

申请号：US15810628

申请日：2017-11-13

Applicant: Applied Materials, Inc.

Inventor： Earl HUNTER ,  Russell DUKE ,  Amitabh PURI ,  Steven M. REEDY

IPC: H01L21/67 ,  H04W12/06 ,  H04L29/06 ,  G06K7/10 ,  G05B19/418

CPC classification number: H01L21/67294 ,  B24B1/00 ,  B24B37/005 ,  B24B37/20 ,  B24B37/30 ,  G05B19/0425 ,  G05B19/4183 ,  G05B2219/31322 ,  G05B2219/45031 ,  G06K7/10366 ,  H04L63/0492 ,  H04W12/06

Abstract: Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.