公开(公告)号：US20160040040A1

公开(公告)日：2016-02-11

申请号：US14456356

申请日：2014-08-11

Applicant: Applied Materials, Inc.

Inventor： Arup Purkayastha ,  Prerna Goradia ,  Ranga Rao Arnepalli ,  Robert Jan Visser ,  Rajeev Bajaj

IPC: C09G1/02 ,  H01L21/321 ,  B24B37/04

CPC classification number: C09G1/02 ,  B24B37/044 ,  H01L21/3212

Abstract: A slurry for selective chemical mechanical polishing of a copper layer is disclosed. The slurry includes either porous zeolite abrasive particles of substantially homogeneous composition having an average pore diameter of approximately 0.1-6 nanometers or hexagonal boron nitride abrasive particles. The slurry also includes an organic complexing compound that is 0.1-25 wt. % of the slurry, an oxidizer that is 0.1-10 wt. % of the slurry, and a solvent. A chemical mechanical polishing method for using the slurry is also disclosed.

Abstract translation: 公开了一种用于铜层的选择性化学机械抛光的浆料。 浆料包括具有约0.1-6纳米的平均孔径或六方氮化硼磨料颗粒的基本上均匀组成的多孔沸石磨料颗粒。 该浆料还包括有机配位化合物，其为0.1-25wt。 ％的浆料，氧化剂为0.1-10重量％ ％的浆料和溶剂。 还公开了一种使用该浆料的化学机械抛光方法。