公开(公告)号：US20240136159A1

公开(公告)日：2024-04-25

申请号：US18088417

申请日：2022-12-23

Applicant: Applied Materials, Inc.

Inventor： Harish Varma PENMETHSA ,  Ying WANG ,  Xundong DAI ,  Alejandro LIZARRAGA MALDONADO ,  Chin Seng LAU

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01J37/32651 ,  H01J37/32568 ,  H01J37/32715 ,  H01L21/6836 ,  H01L21/68721 ,  H01J37/32082 ,  H01J2237/3343 ,  H01L2221/68327

Abstract: Embodiments of process kits for use in a substrate process chamber are provided herein. A process kit for a substrate process chamber including: a cover ring configured to extend over unprotected dicing tape of a tape frame substrate during use and having a central opening configured to expose a semiconductor wafer supported on the dicing tape during use; and a metallic shield disposed adjacent to at least a portion of a lower surface of the cover ring such that the metallic shield at least partially lines the lower surface.