公开(公告)号：US20240136159A1

公开(公告)日：2024-04-25

申请号：US18088417

申请日：2022-12-23

Applicant: Applied Materials, Inc.

Inventor： Harish Varma PENMETHSA ,  Ying WANG ,  Xundong DAI ,  Alejandro LIZARRAGA MALDONADO ,  Chin Seng LAU

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01J37/32651 ,  H01J37/32568 ,  H01J37/32715 ,  H01L21/6836 ,  H01L21/68721 ,  H01J37/32082 ,  H01J2237/3343 ,  H01L2221/68327

Abstract: Embodiments of process kits for use in a substrate process chamber are provided herein. A process kit for a substrate process chamber including: a cover ring configured to extend over unprotected dicing tape of a tape frame substrate during use and having a central opening configured to expose a semiconductor wafer supported on the dicing tape during use; and a metallic shield disposed adjacent to at least a portion of a lower surface of the cover ring such that the metallic shield at least partially lines the lower surface.

公开(公告)号：US20230288916A1

公开(公告)日：2023-09-14

申请号：US17692671

申请日：2022-03-11

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Xundong DAI ,  Guan Huei SEE ,  Ruiping WANG ,  Michael R. RICE ,  Hari Kishen PONNEKANTI ,  Nirmalya MAITY

IPC: G05B19/418 ,  H01L21/687 ,  H01L21/67

CPC classification number: G05B19/418 ,  H01L21/67121 ,  H01L21/68771 ,  H01L21/68778 ,  G05B2219/45031

Abstract: Apparatus for extending substrate queue time for hybrid bonding by preserving plasma activation. In some embodiments, the apparatus may include an environmentally controllable space with a support for holding a die or a substrate, a gas velocity accelerator that recirculates one or more gases laterally across the support, a filter, a humidifier apparatus that is fluidly connected to the environmentally controllable space, wherein the humidifier apparatus enables controllable humidity levels within the environmentally controllable space, a pressurizing apparatus fluidly connected to the humidifier apparatus on an output and fluidly connected to at least one gas supply on an input, a relative humidity (RH) sensor positioned within the environmentally controllable space, and an environment controller in communication with at least the humidifier apparatus and the RH sensor, wherein the environment controller is configured to maintain an RH level of approximately 80% to approximately 95%.

公开(公告)号：US20250092559A1

公开(公告)日：2025-03-20

申请号：US18970445

申请日：2024-12-05

Applicant: Applied Materials, Inc.

Inventor： Kwan Wook ROH ,  Xundong DAI ,  Keith Edward YPMA ,  Scott A. WEHRMANN

IPC: C25D21/14 ,  C25D3/38 ,  C25D7/12 ,  C25D17/00 ,  C25D21/02

Abstract: Electrochemical deposition systems and methods are described that have enhanced crystallization prevention features. The systems may include a bath vessel operable to hold an electrochemical deposition fluid having a metal salt dissolved in water. The systems may also include sensors including a thermometer and concentration sensor operable to measure characteristics of the electrochemical deposition fluid. The systems further include a computer configured to perform operations that include receiving system data from the electrochemical system and generating a control signal to change a characteristic of the electrochemical deposition fluid to prevent crystallization of a metal salt in the fluid. The computer generates the control signal based on processing that may include comparing an actual metal salt concentration in the electrochemical deposition fluid to a theoretical solubility limit for the metal salt in the fluid.