公开(公告)号：US20250069926A1

公开(公告)日：2025-02-27

申请号：US18236554

申请日：2023-08-22

Applicant: Applied Materials, Inc.

Inventor： Arunkumar Ramachandraiah ,  Paul Reuter ,  Devendra Holeyannavar ,  Steven Trey Tindel ,  Dean Hruzek ,  Jeffrey Hudgens ,  Maureen Breiling ,  Venkatesh Chinnaplar Rajappa ,  Micah E. Klaeser ,  Benjamin Johnston ,  Alton Wang ,  Wei Siang Chao ,  Chandrakant Sapkale ,  Shiva Prasad Kota ,  Latha Ramesh

IPC: H01L21/677 ,  B25J11/00 ,  G03F7/00 ,  H01L21/67 ,  H01L21/687

Abstract: Integrated substrate processing systems are disclosed that are able to achieve high-volume processing of substrates (e.g., greater than 120 substrates per hour) using environmentally sensitive processes and/or tools, such as photolithography processes and/or tools. In some embodiments, for example, the integrated substrate processing system may include an EFEM and a processing tool enclosure that are coupled together to form an integrated processing environment. The integrated substrate processing system may operate to maintain substantially uniform conditions (e.g., at a uniform temperature and relative humidity) throughout the integrated environment, and in some embodiments, may utilize an external air source, such as a remote air module (RAM), in order to do so. In some embodiments, high-volume processing of substrates may be further facilitated by employing specialized substrate handling robots and/or specially adapting the EFEM and/or processing tool enclosure.