公开(公告)号：US20240003181A1

公开(公告)日：2024-01-04

申请号：US17856576

申请日：2022-07-01

Applicant: APPLIED MATERIALS, INC.

Inventor： James Christopher Hansen ,  Douglas B. Baumgarten ,  Paul Reuter

IPC: E06B7/23

CPC classification number: E06B7/2307

Abstract: The disclosure describes devices and systems for a seal, and methods for using said seal. A seal includes a base portion configured to couple to a groove formed by an edge surface of a first component. The seal further includes a sealing portion extending from the base portion. The sealing portion is configured to create an airtight seal between the first component and a sealing surface of a second component responsive to a threshold sealing force being applied against the sealing portion. The seal further includes a retaining portion substantially perpendicular to the base portion. A surface of the retaining portion is configured to push against the edge surface of the first component responsive to the threshold sealing force being applied against the sealing portion.

公开(公告)号：US20250069926A1

公开(公告)日：2025-02-27

申请号：US18236554

申请日：2023-08-22

Applicant: Applied Materials, Inc.

Inventor： Arunkumar Ramachandraiah ,  Paul Reuter ,  Devendra Holeyannavar ,  Steven Trey Tindel ,  Dean Hruzek ,  Jeffrey Hudgens ,  Maureen Breiling ,  Venkatesh Chinnaplar Rajappa ,  Micah E. Klaeser ,  Benjamin Johnston ,  Alton Wang ,  Wei Siang Chao ,  Chandrakant Sapkale ,  Shiva Prasad Kota ,  Latha Ramesh

IPC: H01L21/677 ,  B25J11/00 ,  G03F7/00 ,  H01L21/67 ,  H01L21/687

Abstract: Integrated substrate processing systems are disclosed that are able to achieve high-volume processing of substrates (e.g., greater than 120 substrates per hour) using environmentally sensitive processes and/or tools, such as photolithography processes and/or tools. In some embodiments, for example, the integrated substrate processing system may include an EFEM and a processing tool enclosure that are coupled together to form an integrated processing environment. The integrated substrate processing system may operate to maintain substantially uniform conditions (e.g., at a uniform temperature and relative humidity) throughout the integrated environment, and in some embodiments, may utilize an external air source, such as a remote air module (RAM), in order to do so. In some embodiments, high-volume processing of substrates may be further facilitated by employing specialized substrate handling robots and/or specially adapting the EFEM and/or processing tool enclosure.

公开(公告)号：US11993978B2

公开(公告)日：2024-05-28

申请号：US17856576

申请日：2022-07-01

Applicant: APPLIED MATERIALS, INC.

Inventor： James Christopher Hansen ,  Douglas Brian Baumgarten ,  Paul Reuter

IPC: E06B7/23 ,  H01L21/67

CPC classification number: E06B7/2307 ,  H01L21/67155

Abstract: The disclosure describes devices and systems for a seal, and methods for using said seal. A seal includes a base portion configured to couple to a groove formed by an edge surface of a first component. The seal further includes a sealing portion extending from the base portion. The sealing portion is configured to create an airtight seal between the first component and a sealing surface of a second component responsive to a threshold sealing force being applied against the sealing portion. The seal further includes a retaining portion substantially perpendicular to the base portion. A surface of the retaining portion is configured to push against the edge surface of the first component responsive to the threshold sealing force being applied against the sealing portion.

公开(公告)号：US11610794B2

公开(公告)日：2023-03-21

申请号：US16656191

申请日：2019-10-17

Applicant: APPLIED MATERIALS, INC.

Inventor： Paul Reuter ,  Dean C. Hruzek ,  Nir Merry ,  John C. Menk ,  Douglas B. Baumgarten

IPC: H01L21/673 ,  H01L21/67 ,  B01D53/04

Abstract: Electronic device processing assemblies including an equipment front end module (EFEM) with at least one side storage pod attached thereto are described. The side storage pod has a side storage container. In some embodiments, an exhaust conduit extends between the chamber and a pod plenum that can contain a chemical filter proximate thereto. A supplemental fan may draw purge gas from the pod plenum through the chemical filter and route the gas through a return duct to an upper plenum of the EFEM. Methods and side storage pods in accordance with these and other embodiments are also disclosed.

公开(公告)号：US20250167027A1

公开(公告)日：2025-05-22

申请号：US18517791

申请日：2023-11-22

Applicant: Applied Materials, Inc.

Inventor： Srinivas Poshatrahalli Gopalakrishna ,  Shivaraj Nara Manjunath ,  Devendra Channappa Holeyannavar ,  Paul Reuter ,  Douglas Baumgarten ,  Sushant Koshti ,  Amit Kumar Biswas ,  Nithiyanantham Balasubramaniam ,  Latha Ramesh ,  Navya Talluri

IPC: H01L21/673 ,  G01N19/10 ,  G01N33/00 ,  G06F30/27 ,  H01L21/67

Abstract: A method for monitoring inside parameters of a substrate carrier. The method includes receiving a first substrate carrier, supplying a fluid, at a first flow rate, through an inlet of the first substrate carrier, and at least partially purging the fluid through an outlet of the first substrate carrier for a first period of time. The method further includes measuring, using a first sensor disposed at the outlet, a first value of a first property of an exhaust from the substrate carrier at the outlet of the first substrate carrier, and determining, based at least in part on the first value of the first property, a second value of the first property inside the first substrate carrier.