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1.
公开(公告)号:US20170365450A1
公开(公告)日:2017-12-21
申请号:US15625721
申请日:2017-06-16
Applicant: Applied Materials, Inc.
Inventor: Feng BI , Prashant Kumar KULSHRESHTHA , Kwangduk Douglas Lee , Paul CONNORS
Abstract: Embodiments of the invention generally relate to methods for removing a boron-carbon layer from a surface of a processing chamber using water vapor plasma treatment. In one embodiment, a method for cleaning a surface of a processing chamber includes positioning the pedestal at a first distance from the showerhead, and exposing a deposited boron-carbon layer to a first plasma process where the first plasma process comprises generating a plasma that comprises water vapor and a first carrier gas by biasing a showerhead that is disposed over a pedestal, and positioning the pedestal at a second distance from the showerhead and exposing the deposited boron-carbon layer to a second plasma process where the second plasma process comprises generating a plasma that comprises water vapor and a second carrier gas by biasing the showerhead and biasing a side electrode relative to the showerhead.
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公开(公告)号:US20170178758A1
公开(公告)日:2017-06-22
申请号:US15369219
申请日:2016-12-05
Applicant: Applied Materials, Inc.
Inventor: Sungwon HA , Paul CONNORS , Jianhua ZHOU , Juan Carlos ROCHA-ALVAREZ , Kwangduk Douglas LEE , Ziqing DUAN , Nicolas J. BRIGHT , Feng BI
IPC: G21F3/00 , C23C16/458 , C23C16/50 , C23C16/448
CPC classification number: C23C16/448 , C23C16/50 , H01J37/32724 , H01L21/67115 , H01L21/6719
Abstract: The present disclosure generally relates to a radiation shield for a process chamber which improves substrate temperature uniformity. The radiation shield may be disposed between a slit valve door of the process chamber and a substrate support disposed within the process chamber. In some embodiments, the radiation shield may be disposed under a heater of the process chamber. Furthermore, the radiation shield may block radiation and/or heat supplied from the process chamber, and in some embodiments, the radiation shield may absorb and/or reflect radiation, thus providing improved temperature uniformity as well as improving a planar profile of the substrate.
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