公开(公告)号：US20130101241A1

公开(公告)日：2013-04-25

申请号：US13648082

申请日：2012-10-09

Applicant: Applied Materials, Inc.

Inventor： TAO HOU ,  Jeonghoon OH ,  Tom K. CHO ,  Andrzej MATLOSZ ,  Frank F. HOOSHDARAN ,  Yao-Hung YANG

IPC: F16C29/02 ,  C23C16/458

CPC classification number: C23C16/4586 ,  C23C16/505 ,  F16C29/02 ,  H01L21/68742

Abstract: A bushing assembly for supporting a substrate within a processing chamber is generally provided. In one aspect, the bushing assembly comprises a tubular body having an outer perimeter and an aperture extending therethrough, a first ring having a first inner edge, the first ring disposed in the aperture in an upper portion of the tubular body, and a second ring having a second inner edge, the second ring disposed in the aperture in a lower portion of the tubular body. In another aspect, the first inner edge has a first radius of curvature, and the second inner edge has a second radius of curvature. In another aspect, a first inner edge diameter, a second inner edge diameter, the first radius of curvature, and the second radius of curvature are selected such that a support pin extending through the aperture contacts the bushing assembly on at most two points.

Abstract translation: 通常提供用于在处理室内支撑衬底的衬套组件。 在一个方面，套管组件包括具有外周边和延伸穿过其的孔的管状体，第一环具有第一内边缘，第一环设置在管状体的上部中的孔中，第二环 具有第二内边缘，所述第二环设置在所述管状体的下部中的所述孔中。 在另一方面，第一内边缘具有第一曲率半径，并且第二内边缘具有第二曲率半径。 在另一方面，选择第一内边缘直径，第二内边缘直径，第一曲率半径和第二曲率半径，使得延伸穿过孔的支撑销在最多两点处接触衬套组件。

公开(公告)号：US20210035767A1

公开(公告)日：2021-02-04

申请号：US16525465

申请日：2019-07-29

Applicant: Applied Materials, Inc.

Inventor： Gang Grant PENG ,  Wai-Fan YAU ,  David W. GROECHEL ,  Frank F. HOOSHDARAN ,  Tom K. CHO ,  Yao-Hung YANG

IPC: H01J9/24 ,  B23K26/082 ,  B23K26/12 ,  B23K26/352

Abstract: Embodiments of the present disclosure generally relate to a method for forming and treating a component in semiconductor manufacturing. In one embodiment, a method for treating a chamber component used in vacuum processing includes obtaining the chamber component including a recess formed in a surface of the chamber component, the surface being fabricated from a metal, and the recess has a depth ranging from about 0.5 mm to about 10 mm and a width ranging from about 1 mm to about 15 mm. The method further includes polishing the bottom surface of the recess using a laser to form a polished bottom surface having an Ra number of 1 micron or less. The laser can achieve high quality surface finishing.