公开(公告)号：US20240027896A1

公开(公告)日：2024-01-25

申请号：US17872546

申请日：2022-07-25

Applicant: Applied Materials, Inc.

Inventor： Shih-Hao Kuo ,  Hsiu-Jen Wang ,  Ulrich Mueller ,  Jang Fung Chen

IPC: G03F7/00 ,  G03F7/20

CPC classification number: G03F7/0002 ,  G03F7/20 ,  G03F7/70358 ,  G03F7/70975

Abstract: Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.

公开(公告)号：US20250076768A1

公开(公告)日：2025-03-06

申请号：US18555896

申请日：2023-04-17

Applicant: Applied Materials, Inc.

Inventor： Zhongchuan Zhang ,  Rendong Lin ,  Meenaradchagan Vishnu ,  Tamer Coskun ,  Ulrich Mueller ,  Thomas L. Laidig ,  Jang Fung Chen

IPC: G03F7/20 ,  G03F9/00

Abstract: Embodiments of the disclosure relate to digital lithography system and related methods, the system including at least one light source configured to emit a light beam onto a substrate via a lens, at least one image sensor, configured to detect a reflected light beam from the substrate via the lens, at least one motor configured to move the lens to focus the light beam onto the substrate, and a controller in communication with the at least one light source, the at least one image sensor and the at least one motor, wherein the controller is to actuate the at least one motor to move the lens in response to at least one signal from the at least one image sensor.

公开(公告)号：US20250076753A1

公开(公告)日：2025-03-06

申请号：US18765710

申请日：2024-07-08

Applicant: Applied Materials, Inc.

Inventor： Shih-Hao Kuo ,  Hsiu-Jen Wang ,  Ulrich Mueller ,  Jang Fung Chen

IPC: G03F7/00 ,  G03F7/20

Abstract: Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.

公开(公告)号：US12032284B2

公开(公告)日：2024-07-09

申请号：US17872546

申请日：2022-07-25

Applicant: Applied Materials, Inc.

Inventor： Shih-Hao Kuo ,  Hsiu-Jen Wang ,  Ulrich Mueller ,  Jang Fung Chen

IPC: G03F7/00 ,  G03F7/20

CPC classification number: G03F7/0002 ,  G03F7/20 ,  G03F7/70358 ,  G03F7/70975

Abstract: Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.

公开(公告)号：US20230288822A1

公开(公告)日：2023-09-14

申请号：US17693356

申请日：2022-03-12

Applicant: Applied Materials, Inc.

Inventor： Ulrich Mueller ,  Hsiu-Jen Wang ,  Shih-Hao Kuo ,  Jang Fung Chen

IPC: G03F9/00 ,  G01B11/27 ,  G03F7/20

CPC classification number: G03F9/7015 ,  G01B11/272 ,  G03F7/70441

Abstract: Actual physical locations of dies on a substrate package may be identified without using a full metrology scan of the substrate. Instead, one or more cameras may be used to efficiently locate the approximate location of any of the alignment features based on their expected positioning in the design file for the packages are substrate. The cameras may then be moved to locations where alignment features should be, and images may be captured to determine the actual location of the alignment feature. These actual locations of the alignment features may then be used to identify coordinates for the dies, as well as rotations and/or varying heights of the dies on the packages. A difference between the expected location from the design file and the actual physical location may be used to adjust instructions for the digital lithography system to compensate for the misalignment of the dies.

公开(公告)号：US20250076767A1

公开(公告)日：2025-03-06

申请号：US18486726

申请日：2023-10-13

Applicant: Applied Materials, Inc.

Inventor： Ulrich Mueller ,  Thomas L. Laidig ,  Rudolf C. Brunner

IPC: G03F7/20

Abstract: A digital lithography system includes a stage configured to support a substrate, a bridge disposed above the stage, and a first lithographic processing unit coupled to the bridge. The first lithographic processing unit coupled to the bridge can include a scanning unit, a lithographic exposure unit, and an optical system shared by the scanning unit and the lithographic exposure unit. The scanning unit is to use the optical system to generate measurements of the substrate during a measurement operation, and the lithographic exposure unit is to use the optical system to perform digital lithographic exposure of the substrate using the optical system during an exposure operation.