公开(公告)号：US11813712B2

公开(公告)日：2023-11-14

申请号：US17036623

申请日：2020-09-29

申请人： Applied Materials, Inc.

发明人： Aniruddh Jagdish Khanna ,  Jason G. Fung ,  Puneet Narendra Jawali ,  Rajeev Bajaj ,  Adam Wade Manzonie ,  Nandan Baradanahalli Kenchappa ,  Veera Raghava Reddy Kakireddy ,  Joonho An ,  Jaeseok Kim ,  Mayu Yamamura

IPC分类号： B24B37/02 ,  B24B37/04 ,  B24B37/20

CPC分类号： B24B37/20 ,  B24B37/042

摘要： Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.