公开(公告)号：US20230141012A1

公开(公告)日：2023-05-11

申请号：US17522635

申请日：2021-11-09

Applicant: Applied Materials, Inc.

Inventor： Kostiantyn Achkasov ,  Peter Reimer ,  Shawn Thanhson Le ,  Sohrab Zokaei

IPC: H01L21/67 ,  G05B19/418

CPC classification number: H01L21/67276 ,  G05B19/41875 ,  H01J37/32917

Abstract: Exemplary diagnostic wafers for a semiconductor processing chamber may include a wafer body defining a plurality of recesses. The diagnostic wafers may include at least one data logging puck positionable within one of the plurality of recesses. The diagnostic wafers may include at least one battery puck positionable within one of the plurality of recesses. The diagnostic wafers may include at least one sensor puck positionable within one of the plurality of recesses.

公开(公告)号：US20230187176A1

公开(公告)日：2023-06-15

申请号：US17551698

申请日：2021-12-15

Applicant: Applied Materials, Inc.

Inventor： Kartik Ramaswamy ,  Kostiantyn Achkasov ,  Nicolas J. Bright ,  Fernando M. Silveira ,  Yang Yang ,  Yue Guo

IPC: H01J37/32

CPC classification number: H01J37/32247 ,  H01J37/32091 ,  H01J37/321

Abstract: A semiconductor processing system may include a semiconductor processing chamber configured to execute a recipe on a semiconductor wafer. The system may include a first plasma source to provide plasma to the semiconductor processing chamber and to be duty cycled during an execution of the recipe. The system may also include a second plasma source configured to maintain the plasma in the semiconductor processing chamber while the first plasma source is duty cycled.