公开(公告)号：US11869754B2

公开(公告)日：2024-01-09

申请号：US16563352

申请日：2019-09-06

Applicant: Applied Materials, Inc.

Inventor： Tina Dhekial-Phukan ,  Michael Nichols

IPC: H01J37/32 ,  H01L21/67 ,  C23C16/455 ,  C23C16/52

CPC classification number: H01J37/32816 ,  C23C16/45557 ,  C23C16/52 ,  H01J37/32449 ,  H01J37/32926 ,  H01J37/32981 ,  H01L21/67253

Abstract: System and methods of improving dynamic pressure response during recipe step transitions. An exemplary method may include changing at least one of a plurality of recipe parameters in accordance with a processing recipe while running the processing recipe on a semiconductor substrate in a processing chamber. The method may further include measuring a pressure response in the processing chamber responsive to the changing of the at least one of the plurality of recipe parameters, and determining a response error based on the pressure response and a model pressure response calculated based on the processing recipe. The method may further include, in response to determining that the response error may be greater than a threshold value, calculating an adjustment to an operation of a valve downstream of the processing chamber when changing the at least one of the plurality of recipe parameters in accordance with the processing recipe in subsequent runs.

公开(公告)号：US20210074526A1

公开(公告)日：2021-03-11

申请号：US16563352

申请日：2019-09-06

Applicant: Applied Materials, Inc.

Inventor： Tina Dhekial-Phukan ,  Michael Nichols

IPC: H01J37/32 ,  H01L21/67 ,  C23C16/455 ,  C23C16/52

Abstract: System and methods of improving dynamic pressure response during recipe step transitions. An exemplary method may include changing at least one of a plurality of recipe parameters in accordance with a processing recipe while running the processing recipe on a semiconductor substrate in a processing chamber. The method may further include measuring a pressure response in the processing chamber responsive to the changing of the at least one of the plurality of recipe parameters, and determining a response error based on the pressure response and a model pressure response calculated based on the processing recipe. The method may further include, in response to determining that the response error may be greater than a threshold value, calculating an adjustment to an operation of a valve downstream of the processing chamber when changing the at least one of the plurality of recipe parameters in accordance with the processing recipe in subsequent runs.

公开(公告)号：US11556117B2

公开(公告)日：2023-01-17

申请号：US16659557

申请日：2019-10-21

Applicant: Applied Materials, Inc.

Inventor： Shahab Arabshahi ,  Michael Nichols

IPC: G05B19/418 ,  G06N3/08 ,  G05B13/02 ,  G06N3/04

Abstract: A method of detecting and classifying anomalies during semiconductor processing includes executing a wafer recipe a semiconductor processing system to process a semiconductor wafer; monitoring sensor outputs from a sensors that monitor conditions associated with the semiconductor processing system; providing the sensor outputs to models trained to identify when the conditions associated with the semiconductor processing system indicate a fault in the semiconductor wafer; receiving an indication of a fault from at least one of the models; and generating a fault output in response to receiving the indication of the fault.

公开(公告)号：US11894220B2

公开(公告)日：2024-02-06

申请号：US16591139

申请日：2019-10-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Michael Nichols ,  Tina Dhekial-Phukan ,  Venkata Ravishankar Kasibhotla ,  Ajit Balakrishna ,  Sanggyum Kim

IPC: H01J37/32 ,  H01L21/67

CPC classification number: H01J37/3299 ,  H01J37/32183 ,  H01J37/32449 ,  H01J37/32816 ,  H01J37/32926 ,  H01L21/67248 ,  H01L21/67253 ,  H01J2237/3321 ,  H01J2237/3341

Abstract: Methods and systems for processing substrates are provided. The system can include: a processing chamber configured to process a substrate based on a recipe; a plurality of sub-systems in operable communication with the processing chamber for controlling corresponding parameters associated with processing the substrate; and a controller in operable communication with the processing chamber and each of the plurality of sub-systems and configured to control each of the plurality of sub-systems and the processing chamber using information included in the recipe and feedback provided by at least one of the plurality of sub-systems. The controller is configured to compare information included in the recipe and feedback provided by at least one of the plurality of sub-systems with stored empirical information relating to the recipe and each of the plurality of sub-systems, and adjust at least one of the corresponding parameters associated with processing the substrate based on a determined comparison.

公开(公告)号：US20240153750A1

公开(公告)日：2024-05-09

申请号：US18408313

申请日：2024-01-09

Applicant: Applied Materials, Inc.

Inventor： Tina Dhekial-Phukan ,  Michael Nichols

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/52 ,  H01L21/67

CPC classification number: H01J37/32816 ,  C23C16/45557 ,  C23C16/52 ,  H01J37/32449 ,  H01J37/32926 ,  H01J37/32981 ,  H01L21/67253

Abstract: System and methods of improving dynamic pressure response during recipe step transitions. An exemplary method may include changing at least one of a plurality of recipe parameters in accordance with a processing recipe while running the processing recipe on a semiconductor substrate in a processing chamber. The method may further include measuring a pressure response in the processing chamber responsive to the changing of the at least one of the plurality of recipe parameters, and determining a response error based on the pressure response and a model pressure response calculated based on the processing recipe. The method may further include, in response to determining that the response error may be greater than a threshold value, calculating an adjustment to an operation of a valve downstream of the processing chamber when changing the at least one of the plurality of recipe parameters in accordance with the processing recipe in subsequent runs.

公开(公告)号：US20210116896A1

公开(公告)日：2021-04-22

申请号：US16659557

申请日：2019-10-21

Applicant: Applied Materials, Inc.

Inventor： Shahab Arabshahi ,  Michael Nichols

IPC: G05B19/418 ,  G06N3/08 ,  G06N3/04 ,  G05B13/02

Abstract: A method of detecting and classifying anomalies during semiconductor processing includes executing a wafer recipe a semiconductor processing system to process a semiconductor wafer; monitoring sensor outputs from a sensors that monitor conditions associated with the semiconductor processing system; providing the sensor outputs to models trained to identify when the conditions associated with the semiconductor processing system indicate a fault in the semiconductor wafer; receiving an indication of a fault from at least one of the models; and generating a fault output in response to receiving the indication of the fault.