-
公开(公告)号:US11853042B2
公开(公告)日:2023-12-26
申请号:US17177978
申请日:2021-02-17
Applicant: Applied Materials, Inc.
Inventor: Garrett Ho-Yee Sin , Sidharth Bhatia , Katty Marie Lydia Gamon Guyomard , Shawyon Jafari , Heng-Cheng Pai , Pramod Nambiar , Paul Lukas Brillhart , Ilker Durukan
IPC: G05B19/418 , G06N20/00 , G01N33/00 , G06F30/398 , G06F119/22 , G06F119/18
CPC classification number: G05B19/41875 , G01N33/00 , G06F30/398 , G06N20/00 , G01N2033/0095 , G05B2219/31264 , G05B2219/32179 , G05B2219/45031 , G06F2119/18 , G06F2119/22
Abstract: A method includes receiving part data associated with a corresponding part of substrate processing equipment, sensor data associated with one or more corresponding substrate processing operations performed by the substrate processing equipment to produce one or more corresponding substrates, and metrology data associated with the one or more corresponding substrates produced by the one or more corresponding substrate processing operations performed by the substrate processing equipment that includes the corresponding part. The method further includes generating sets of aggregated part-sensor-metrology data including a corresponding set of part data, a corresponding set of sensor data, and a corresponding set of metrology data. The method further includes causing analysis of the sets of aggregated part-sensor-metrology data to generate one or more outputs to perform a corrective action associated with the corresponding part of the substrate processing equipment.
-
公开(公告)号:US20240061409A1
公开(公告)日:2024-02-22
申请号:US18495724
申请日:2023-10-26
Applicant: Applied Materials, Inc.
Inventor: Garrett Ho-Yee Sin , Sidharth Bhatia , Katty Marie Lydia Gamon Guyomard , Shawyon Jafari , Heng-Cheng Pai , Pramod Nambiar , Paul Lukas Brillhart , Ilker Durukan
IPC: G05B19/418 , G06N20/00 , G01N33/00 , G06F30/398
CPC classification number: G05B19/41875 , G06N20/00 , G01N33/00 , G06F30/398 , G06F2119/22
Abstract: A method includes identifying sets of part data associated with substrate processing equipment. Each of the sets of part data includes corresponding part values and a corresponding part identifier. Each of the sets of part data is associated with hardware parameters of a corresponding equipment part of substrate processing equipment. The method further includes generating sets of aggregated data. Each of the sets of aggregated data includes a corresponding set of part data of the sets of part data and a corresponding set of additional non-part data of sets of non-part data. The method further includes causing, based on the sets of aggregated data, performance of a corrective action associated with the substrate processing equipment.
-
公开(公告)号:US20220260978A1
公开(公告)日:2022-08-18
申请号:US17177978
申请日:2021-02-17
Applicant: Applied Materials, Inc.
Inventor: Garrett Ho-Yee Sin , Sidharth Bhatia , Katty Marie Lydia Gamon Guyomard , Shawyon Jafari , Heng-Cheng Pai , Pramod Nambiar , Paul Lukas Brillhart , Ilker Durukan
IPC: G05B19/418 , G06N20/00 , G01N33/00 , G06F30/398
Abstract: A method includes receiving part data associated with a corresponding part of substrate processing equipment, sensor data associated with one or more corresponding substrate processing operations performed by the substrate processing equipment to produce one or more corresponding substrates, and metrology data associated with the one or more corresponding substrates produced by the one or more corresponding substrate processing operations performed by the substrate processing equipment that includes the corresponding part. The method further includes generating sets of aggregated part-sensor-metrology data including a corresponding set of part data, a corresponding set of sensor data, and a corresponding set of metrology data. The method further includes causing analysis of the sets of aggregated part-sensor-metrology data to generate one or more outputs to perform a corrective action associated with the corresponding part of the substrate processing equipment.
-
公开(公告)号:US11592812B2
公开(公告)日:2023-02-28
申请号:US16791081
申请日:2020-02-14
Applicant: Applied Materials, Inc.
Inventor: Sidharth Bhatia , Garrett H. Sin , Heng-Cheng Pai , Pramod Nambiar , Ganesh Balasubramanian , Irfan Jamil
IPC: G05B23/02 , G05B19/418 , G06F11/34 , G06F11/30 , G05B19/404 , G06N20/00 , G06N3/08
Abstract: Methods, systems, and non-transitory computer readable medium are described for sensor metrology data integration. A method includes receiving sets of sensor data and sets of metrology data. Each set of sensor data includes corresponding sensor values associated with producing corresponding product by manufacturing equipment and a corresponding sensor data identifier. Each set of metrology data includes corresponding metrology values associated with the corresponding product manufactured by the manufacturing equipment and a corresponding metrology data identifier. The method further includes determining common portions between each corresponding sensor data identifier and each corresponding metrology data identifier. The method further includes, for each of the sensor-metrology matches, generating a corresponding set of aggregated sensor-metrology data and storing the sets of aggregated sensor-metrology data to train a machine learning model. The trained machine learning model is capable of generating one or more outputs for performing a corrective action associated with the manufacturing equipment.
-
公开(公告)号:US20230205196A1
公开(公告)日:2023-06-29
申请号:US18114915
申请日:2023-02-27
Applicant: Applied Materials, Inc.
Inventor: Sidharth Bhatia , Garrett H. Sin , Heng-Cheng Pai , Pramod Nambiar , Ganesh Balasubramanian , Irfan Jamil
IPC: G05B23/02 , G05B19/418 , G06F11/34 , G06F11/30 , G05B19/404
CPC classification number: G05B23/0286 , G05B19/404 , G05B19/4183 , G05B19/4184 , G05B19/41875 , G05B19/41885 , G05B23/024 , G05B23/0294 , G06F11/3089 , G06F11/3447 , G06F11/3466 , G06F11/3495 , G06N20/00
Abstract: A method includes identifying sets of sensor data associated with wafers processed via wafer processing equipment and identifying sets of metrology data associated with the wafers processed via the wafer processing equipment. The method further includes generating sets of aggregated sensor-metrology data, each of the sets of aggregated sensor-metrology data including a respective set of sensor data and a respective set of metrology data. The method further includes causing, based on the sets of aggregated sensor-metrology data, performance of a corrective action associated with the wafer processing equipment.
-
公开(公告)号:US11157661B2
公开(公告)日:2021-10-26
申请号:US16716274
申请日:2019-12-16
Applicant: Applied Materials, Inc.
Inventor: Vinayak Veer Vats , Sidharth Bhatia , Garrett Ho-Yee Sin , Pramod Nambiar , Hang Yu , Sanjay Kamath , Deenesh Padhi , Heng-Cheng Pai
IPC: G06F30/12 , G06F16/904 , G06F16/903 , G06F119/18
Abstract: A process development visualization tool generates a first visualization of a parameter associated with a manufacturing process, and provides a GUI control element associated with a process variable of the manufacturing process, wherein the GUI control element has a first setting associated with a first value for the process variable. The process development tool receives a user input to adjust the GUI control element from the first setting to a second setting, determines a second value for the process variable based on the second setting, and determines a second set of values for the parameter that are associated with the second value for the process variable. The process development tool then generates a second visualization of the parameter, wherein the second visualization represents the second set of values for the parameter that are associated with the second value for the process variable.
-
公开(公告)号:US20200264335A1
公开(公告)日:2020-08-20
申请号:US16791081
申请日:2020-02-14
Applicant: Applied Materials, Inc.
Inventor: Sidharth Bhatia , Garrett H. Sin , Heng-Cheng Pai , Pramod Nambiar , Ganesh Balasubramanian , Irfan Jamil
Abstract: Methods, systems, and non-transitory computer readable medium are described for sensor metrology data integration. A method includes receiving sets of sensor data and sets of metrology data. Each set of sensor data includes corresponding sensor values associated with producing corresponding product by manufacturing equipment and a corresponding sensor data identifier. Each set of metrology data includes corresponding metrology values associated with the corresponding product manufactured by the manufacturing equipment and a corresponding metrology data identifier. The method further includes determining common portions between each corresponding sensor data identifier and each corresponding metrology data identifier. The method further includes, for each of the sensor-metrology matches, generating a corresponding set of aggregated sensor-metrology data and storing the sets of aggregated sensor-metrology data to train a machine learning model. The trained machine learning model is capable of generating one or more outputs for performing a corrective action associated with the manufacturing equipment.
-
-
-
-
-
-