High-dimensional multi-distributed importance sampling for circuit yield analysis

    公开(公告)号:US11768986B2

    公开(公告)日:2023-09-26

    申请号:US17438716

    申请日:2020-03-13

    申请人: XENERGIC AB

    IPC分类号: G06F119/22 G06F30/33

    CPC分类号: G06F30/33 G06F2119/22

    摘要: A computer-implemented method for simulation of an integrated circuit for yield analysis includes: a) for plurality of variables, generating initial sampling sets by sampling from provided distributions related to physical properties of circuits; b) selecting at least one sample from each initial set randomly and combining into initial simulation set; c) running initial simulation of operation of circuit, applying initial simulation set, the operation having passing/failing criterion; d) if fails: storing samples of initial set into initial sampling distributions for each variable; e) repeating steps b)-d) until sufficient failures obtained; f) building importance sampling distribution based on each initial sampling distribution, the importance distribution having lower, center, upper portions; g) generating secondary simulation set by drawing samples from importance sampling distribution for each variable; h) simulating circuit by applying the secondary set; i) repeating steps g)-h); j) mapping resulting yields to provided distributions, to obtain a yield.

    Method of generating an operation procedure for a simulation of a mechatronic system

    公开(公告)号:US11630931B2

    公开(公告)日:2023-04-18

    申请号:US16948126

    申请日:2020-09-03

    摘要: A computer-implemented method of generating an operation procedure for a simulation of a system, in particular a mechatronic system is disclosed. A source node has at least one source parameter (Ps) and a first simulation system with at least one first simulation node is determined, wherein the first simulation node includes at least one input parameter (Pi) and at least one output parameter (Pa). The first simulation node includes a simulation function for determining the output parameter (Pa) based on the input parameter (Pi) of the first node. When the input parameter (Pi) is available based on the source parameter (Ps), a global operation graph is built describing a link between the source node and the first simulation node for describing an operating procedure of the simulation of the system.

    Method and apparatus for path routing

    公开(公告)号:US11314918B1

    公开(公告)日:2022-04-26

    申请号:US17080161

    申请日:2020-10-26

    摘要: A method for path routing according to an embodiment of the present disclosure may include selecting a first start point and a first end point with which path routing is performed in a circular frame generated by connecting all points included in one or more start point sets included in a layer, one or more end point sets paired with the start point set, and one or more edge point pair sets to one closed curve, generating a connectivity graph by connecting edge points included in one or more nodes corresponding to segments obtained by dividing the circular frame into one or more regions, and connecting the first start point and the first end point based on a cost for connecting the first start point and the first end point calculated using the connectivity graph.

    Yield load pull system-based IC design method and system thereof

    公开(公告)号:US11062072B1

    公开(公告)日:2021-07-13

    申请号:US16912006

    申请日:2020-06-25

    摘要: A yield load pull system-based integrated circuit design method and a system thereof are provided. The method includes: setting a yield-related threshold; setting a source impedance; configuring a sweep range of a Smith chart; determining load impedance points within the sweep range of the Smith chart; acquiring impedance information; determining output characteristics of a plurality of sample devices at each load impedance point of the determined load impedance points, based on the source impedance and the impedance information corresponding to each load impedance point, by invoking a harmonic balance simulator embedded in an Advanced Design System, where the output characteristics comprise: a large-signal gain, an output power and a power-added efficiency; determining a device yield for each load impedance point; for each output characteristic calculating a mean value across the plurality of sample devices, at each load impedance point; and determining a best load impedance; conducting IC design.

    Methods and systems for efficient identification of glitch failures in integrated circuits

    公开(公告)号:US10690722B1

    公开(公告)日:2020-06-23

    申请号:US16271265

    申请日:2019-02-08

    申请人: Pranav Ashar

    摘要: Methods and systems are described to efficiently identify the potential for failures in integrated circuits (ICs) caused by glitches. In an IC based on synchronous operation, the operation of the multiplicity of inputs, storage elements and observed outputs in said IC are synchronized to one or more clocks that determine the specific times at which inputs change, outputs are observed, and stored values are updated. Almost all ICs are based on synchronous operation. When input values to a logic circuit in an IC change, the effects of said changes propagate through paths in said logic circuit in a delayed manner such that each of said paths may have a different delay. Said different delays can cause a wire in a logic circuit to have transient values (termed “glitch”) before settling to a final value consistent with the input values being applied to said logic circuit. An IC is likely to function erroneously, referred to as having a “glitch failure”, when a glitch value is observed at an output or captured by a storage element. Glitch failures are difficult and expensive to diagnose in a manufactured IC. To raise the productivity of IC development, it is imperative that any potential glitch failure in an IC be detected prior to manufacture. Said detection is hard because a typical IC has a very large number of logic circuits to analyze for glitch failure. To be practical, said analysis must have high performance and high accuracy. Said high performance requiring that said analysis should complete in acceptable run time even for the largest ICs. Said high accuracy requires that said analysis should identify all potential for glitch failure (100% recall), and minimize the number of logic circuits erroneously reported as having glitch failure potential (high precision). Whereas the glitch phenomenon, the potential for glitch failure and methods for detecting glitch failures in pre-manufacture IC models are well known, achievement of high performance with high accuracy has not yet been addressed in prior art. Whereas conventional methods for glitch checking are inefficient and insufficiently accurate, the methods and systems described in the present invention achieve new levels of performance, scalability and accuracy in said detection of glitch failures in an IC. Said methods and systems are based on a novel dissection of glitch-checking requirements into a multiplicity of individual steps, which said steps executed in a systematic sequence deliver high performance and accuracy.