公开(公告)号：US20250073850A1

公开(公告)日：2025-03-06

申请号：US18811633

申请日：2024-08-21

Applicant: Applied Materials, Inc.

Inventor： Haosheng WU ,  Shou-Sung CHANG ,  Priscilla DIEP ,  Hui CHEN ,  Chih Chung CHOU ,  Jeonghoon OH ,  Jianshe TANG ,  Brian J. BROWN

IPC: B24B53/017 ,  H01L21/306

Abstract: A chemical mechanical polishing chamber may include a platen disposed within the chemical mechanical polishing chamber, the platen configured to support a polishing pad. The chamber may also include a slurry delivery arm configured to deliver a slurry to the polishing pad during a chemical mechanical polishing process. The chamber may include an arm may include one or more brackets, mechanically attached to an internal side of the chemical mechanical polishing chamber and positioned over the platen. The chamber may include a plurality of nozzles configured to deliver a gas to the polishing pad, the plurality of nozzles mechanically attached to the one or more brackets of the arm, each of the plurality of nozzles oriented such that an air gap is disposed between adjacent nozzles of the plurality of nozzles such that air may be pulled from the air gap and propelled with the gas towards the polishing pad.