公开(公告)号：US20220339755A1

公开(公告)日：2022-10-27

申请号：US17851497

申请日：2022-06-28

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Charles C. GARRETSON ,  Eric LAU ,  Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Edwin C. SUAREZ ,  Huanbo ZHANG ,  Brian J. BROWN

IPC: B24B37/32 ,  H01L21/687

Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

公开(公告)号：US20150027491A1

公开(公告)日：2015-01-29

申请号：US13951913

申请日：2013-07-26

Applicant: Applied Materials, Inc.

Inventor： Clinton SAKATA ,  Hui CHEN ,  Jim K. ATKINSON ,  Tomohiko KITAJIMA ,  Brian J. BROWN

IPC: H01L21/67

CPC classification number: H01L21/67046

Abstract: A buff module and method for using the same are provided. In one embodiment, a buff module includes housing having an interior volume, a plurality of drive rollers and a pair of buff heads. The drive rollers are arranged to rotate a substrate within the interior volume on a substantially horizontal axis. The buff heads are disposed in the housing, each buff head rotatable on an axis substantially aligned with the horizontal axis and movable to a position substantially parallel with the horizontal axis.

Abstract translation: 提供了一种buff模块及其使用方法。 在一个实施例中，抛光模块包括具有内部容积的壳体，多个驱动辊和一对抛光头。 驱动辊被布置成在基本上水平的轴线上旋转内部容积内的基板。 抛光头设置在壳体中，每个抛光头可在与水平轴线基本上对准的轴上旋转并且可移动到基本上与水平轴线平行的位置。

公开(公告)号：US20240359291A1

公开(公告)日：2024-10-31

申请号：US18139091

申请日：2023-04-25

Applicant: Applied Materials, Inc.

Inventor： Wei LU ,  Shih-Haur SHEN ,  David Maxwell GAGE ,  Jimin ZHANG ,  Taketo SEKINE ,  Haosheng WU ,  Kun XU ,  Jianshe TANG ,  Brian J. BROWN

IPC: B24B49/10 ,  B24B37/34

CPC classification number: B24B49/10 ,  B24B37/345 ,  H01L21/68

Abstract: A method of processing a substrate includes polishing a front surface of a substrate on a first pad coupled to a first platen. The method further includes transferring the substrate from the first pad to a second pad coupled to a second platen with a carrier head. The method further includes moving the carrier head to a scan position to place an edge of the substrate above an orientation sensor disposed at a rotational center of the second pad. The method further includes scanning the edge of the substrate with the orientation sensor to produce a signal. The method further includes analyzing the signal to locate a reference mark of the substrate to determine a rotational orientation of the substrate relative to the carrier head.

公开(公告)号：US20190099857A1

公开(公告)日：2019-04-04

申请号：US16149939

申请日：2018-10-02

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Charles C. GARRETSON ,  Eric LAU ,  Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Edwin C. SUAREZ ,  Huanbo ZHANG ,  Brian J. BROWN

IPC: B24B37/32 ,  H01L21/687

Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

公开(公告)号：US20170323810A1

公开(公告)日：2017-11-09

申请号：US15659417

申请日：2017-07-25

Applicant: Applied Materials, Inc.

Inventor： Brian J. BROWN

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/67034 ,  H01L21/67057

Abstract: An apparatus for drying of wet substrates in a post CMP cleaning apparatus is provided. The apparatus provides a waterfall or shallow reservoir of rinsing solution, such as DIW, through which a substrate may be lifted. A solvent vapor may be provided at the rinsing solution interface on the substrate, such as in a Marangoni process. In certain embodiments, the volume of solution through which the substrate is lifted is reduced, which may provide for reduced or eliminated particle reattachment to the substrate.

公开(公告)号：US20240332037A1

公开(公告)日：2024-10-03

申请号：US18130407

申请日：2023-04-03

Applicant: Applied Materials, Inc.

Inventor： Brian J. BROWN

IPC: H01L21/67 ,  B08B1/00 ,  B08B1/04 ,  B08B3/02 ,  B08B3/08 ,  B24B53/017 ,  H01L21/02

CPC classification number: H01L21/67046 ,  B08B1/12 ,  B08B1/32 ,  B08B1/50 ,  B08B3/02 ,  B08B3/08 ,  B24B53/017 ,  H01L21/02096

Abstract: A chemical mechanical polishing (CMP) system include apparatus and methods to clean brushes used to scrub substrates, including brush cleaning using periodic chemical treatment. One or more embodiments include a method of operating the CMP system to rotate a first one or more scrubber brushes while the first one or more scrubber brushes are in contact with a first substrate, performing, concurrent with the rotating during the first time duration, a cleaning operation for a second one or more scrubber brushes, performing, during a second time duration of the cleaning cycle, the cleaning operation for the first one or more scrubber brushes, and rotating, concurrent with the performing the cleaning operation during the second time duration, the second one or more scrubber brushes while the second one or more scrubber brushes are in contact with a second substrate.

公开(公告)号：US20240047238A1

公开(公告)日：2024-02-08

申请号：US18381261

申请日：2023-10-18

Applicant: Applied Materials, Inc.

Inventor： Wei LU ,  Jimin ZHANG ,  Jianshe TANG ,  Brian J. BROWN

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/02087 ,  H01L21/68721 ,  H01L21/67248

Abstract: The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

公开(公告)号：US20160083676A1

公开(公告)日：2016-03-24

申请号：US14840146

申请日：2015-08-31

Applicant: Applied Materials, Inc.

Inventor： Ekaterina MIKHAYLICHENKO ,  Brian J. BROWN ,  Fred C. REDEKER

IPC: C11D17/00 ,  B08B1/00 ,  B08B3/12 ,  C11D3/04 ,  C11D1/14 ,  C11D3/20 ,  C11D3/37 ,  B08B3/04 ,  B08B3/02

CPC classification number: C11D1/146 ,  C11D3/3753 ,  C11D3/3773 ,  C11D11/0047 ,  C11D17/003 ,  H05K3/0085

Abstract: Embodiments of the present apparatus and methods for post CMP clean. More particularly, embodiments provide apparatus and methods for removing nano sized particles. One embodiment provides a method for cleaning a substrate. The method includes exposing the substrate to a viscoelastic fluid to remove small particles from the substrate. The viscoelastic fluid comprising a viscosity adjustor and an aqueous base.

Abstract translation: 本发明的CMP清洗装置和方法的实施例。 更具体地，实施方案提供了用于去除纳米尺寸颗粒的装置和方法。 一个实施例提供了一种清洁衬底的方法。 该方法包括将基底暴露于粘弹性流体以从基底去除小颗粒。 该粘弹性流体包括粘度调节剂和碱性水溶液。

公开(公告)号：US20240253183A1

公开(公告)日：2024-08-01

申请号：US18401306

申请日：2023-12-29

Applicant: Applied Materials, Inc.

Inventor： Priscilla Michelle Diep LAROSA ,  Haosheng WU ,  Jimin ZHANG ,  Taketo SEKINE ,  Chen-Wei CHANG ,  Jianshe TANG ,  Brian J. BROWN ,  Wei LU ,  Ekaterina A. MIKHAYLICHENKO ,  Huanbo ZHANG ,  Jeonghoon OH ,  Eric LAU ,  Andrew NAGENGAST ,  Takashi FUJIKAWA ,  Thomas H. OSTERHELD ,  Steven M. ZUNIGA

IPC: B24B57/02 ,  B24B37/015 ,  B24B53/017

CPC classification number: B24B57/02 ,  B24B37/015 ,  B24B53/017

Abstract: A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense fluid, such as a polishing fluid or water, and/or provide a vacuum pressure. The second fluid delivery arm is configured to dispense a fluid or vacuum pressure onto the polishing pad to effect the polishing rate at the edge of the substrate.

公开(公告)号：US20220379428A1

公开(公告)日：2022-12-01

申请号：US17335868

申请日：2021-06-01

Applicant: Applied Materials, Inc.

Inventor： Jimin ZHANG ,  Brian J. BROWN ,  Eric LAU ,  Ekaterina MIKHAYLICHENKO ,  Jeonghoon OH ,  Gerald J. ALONZO

IPC: B24B37/10 ,  B24B37/04 ,  H01L21/306

Abstract: Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate. An exemplary method includes rotating a substrate about a first axis in a first direction and urging a surface of the substrate against a polishing surface of a polishing pad while rotating the substrate, wherein rotating the substrate about the first axis includes rotating the substrate a first angle at a first rotation rate, and then rotating the substrate a second angle at a second rotation rate, and the first rotation rate is different from the second rotation rate.