公开(公告)号：US20040163946A1

公开(公告)日：2004-08-26

申请号：US10744904

申请日：2003-12-23

Applicant: APPLIED MATERIALS, INC.

Inventor： Shou-Sung Chang ,  Stan D. Tsai ,  Donald J.K. Olgado ,  Liang-Yuh Chen ,  Alain Duboust ,  Ralph M. Wadensweiler

IPC: C25D017/00

CPC classification number: B24B37/22 ,  B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/11 ,  B24B37/24 ,  B24B37/26 ,  B24B49/16 ,  B24B53/017 ,  C25D17/10 ,  H01L21/32125

Abstract: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.

Abstract translation: 提供了用于处理基板的垫组件的实施例。 焊盘组件包括处理层，其具有适于处理衬底的工作表面，耦合到处理层的下层并设置在处理层下方的电极，以及具有设置在处理层的工作表面下方和下方的上表面的电极 。 电极的上表面至少部分地暴露于工作表面，以在电极的上表面和工作表面之间提供电解质通路。

公开(公告)号：US20030213703A1

公开(公告)日：2003-11-20

申请号：US10151538

申请日：2002-05-16

Applicant: Applied Materials, Inc.

Inventor： Yan Wang ,  Feng Q. Liu ,  Yongqi Hu ,  Alain Duboust ,  Liang-Yuh Chen ,  Paul D. Butterfield ,  Ralph M. Wadensweiler

IPC: B23H003/00

CPC classification number: B24B37/24 ,  B23H5/08 ,  B23H5/10 ,  B24B37/042

Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a pad assembly having a conductive pad, a backing and a conductive layer adapted to be biased by a power source. In another embodiment, an apparatus for polishing a substrate includes a pad assembly disposed in a basin. The basin has two electrodes coupled to opposite poles of a power source. Each electrode extends partially through a respective aperture formed in the pad assembly. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

Abstract translation: 提供了一种用于抛光衬底表面的方法和装置。 一方面，一种用于抛光衬底的装置包括具有导电垫，背衬和适于被电源偏置的导电层的焊盘组件。 在另一个实施例中，用于抛光衬底的装置包括设置在盆中的衬垫组件。 盆地具有耦合到电源的相对极的两个电极。 每个电极部分地延伸穿过形成在垫组件中的相应孔。 该设备可以是电化学抛光站的一部分，其可以可选地是包括化学机械抛光站的系统的一部分。