公开(公告)号：US20140273752A1

公开(公告)日：2014-09-18

申请号：US14200149

申请日：2014-03-07

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Rixin PENG ,  Mario CORNEJO ,  Thomas BREZOCZKY ,  Fred REDEKER ,  Thomas H. OSTERHELD

IPC: B24B53/017 ,  B24B37/04

CPC classification number: B24B49/18 ,  B24B37/042 ,  B24B53/017

Abstract: A method and apparatus for conditioning a polishing pad used in a substrate polishing process. In one embodiment, a method for conditioning a polishing pad utilized to polish a substrate is provided. The method includes providing relative motion between an optical device and a polishing pad having a polishing medium disposed thereon, and scanning a processing surface of the polishing pad with a laser beam to condition the processing surface, wherein the laser beam has a wavelength that is substantially transparent to the polishing medium, but is reactive with the material of the polishing pad.

Abstract translation: 一种用于调整用于衬底抛光工艺中的抛光垫的方法和装置。 在一个实施例中，提供了一种用于调节用于抛光衬底的抛光垫的方法。 该方法包括提供光学装置与其上布置有抛光介质的抛光垫之间的相对运动，以及用激光束扫描抛光垫的处理表面以调节处理表面，其中激光束具有基本上 对抛光介质透明，但与抛光垫的材料反应。