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公开(公告)号：US10695804B2
公开(公告)日：2020-06-30
申请号：US15879677
申请日：2018-01-25
Applicant: Applied Materials, Inc.
Inventor： Roman M. Mostovoy , Suketu Arun Parikh , Todd Egan
Abstract: Embodiments described herein relate to a cleaning device and methods for cleaning an object. In one embodiment, the object is cleaned by moving a clean head along a surface of the object. Supercritical carbon dioxide fluid is delivered by supercritical carbon dioxide fluid vessel to the surface of the object. The supercritical carbon dioxide fluid and contamination material are removed from the object by a vacuum pump to a detector. One or more measurements of the contamination material are determined by the detector. Samples of the contamination material are collected by a collector. A contamination level of the surface of the object is determined by an analyzer.
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公开(公告)号：US12014902B2
公开(公告)日：2024-06-18
申请号：US17887992
申请日：2022-08-15
Applicant: Applied Materials, Inc.
Inventor： Jong Yun Kim , Kim Seong Sim , Roman M. Mostovoy , Won Ho Sung , Pei-Chia Chen
IPC: H01J37/32 , C23C16/44 , C23C16/458 , C23C16/52
CPC classification number: H01J37/3244 , C23C16/4405 , C23C16/4583 , C23C16/52 , H01J37/32357 , H01J37/32862 , H01J37/32477 , H01J2237/24507 , H01J2237/3321
Abstract: Embodiments described herein relate to process systems for cleaning semiconductor process chamber components. The process systems include a process chamber having process chamber components. The process chamber components include a substrate support disposed within a chamber volume of the process chamber. A gas distribution assembly faces the substrate support. A gas baffle is fluidly coupled to the gas distribution assembly. A sensor system is coupled to the process chamber and is configured to monitor at least one characteristic of the volume of the process chamber. A dynamic gas assist is fluidly coupled to the gas baffle and is communicatively coupled to the sensor.
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