公开(公告)号：US20170148654A1

公开(公告)日：2017-05-25

申请号：US15347519

申请日：2016-11-09

Applicant: Applied Materials, Inc.

Inventor： Khokan C. PAUL ,  Jay D. PINSON, II ,  Juan Carlos ROCHA-ALVAREZ ,  Hari K. PONNEKANTI ,  Rupankar CHOUDHURY ,  Shekhar ATHANI ,  Sandeep KUMPALA ,  Hanish Kumar PANAVALAPPIL KUMARANKUTTY

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/687 ,  G05B19/04 ,  G05B19/401

CPC classification number: H01L21/67253 ,  G05B19/041 ,  G05B19/401 ,  G05B2219/31459 ,  G05B2219/40066 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67389 ,  H01L21/67724 ,  H01L21/67775 ,  H01L21/68707 ,  H01L21/68764

Abstract: Implementations of the present disclosure generally relate to an improved factory interface that is coupled to an on-board metrology housing configured for measuring film properties of a substrate. In one implementation, an apparatus comprises a factory interface, and a metrology housing removably coupled to the factory interface through a load port, the metrology housing comprises an on-board metrology assembly for measuring properties of a substrate to be transferred into the metrology housing.