公开(公告)号：US20240282605A1

公开(公告)日：2024-08-22

申请号：US18172149

申请日：2023-02-21

申请人： Applied Materials, Inc.

发明人： Rupankar CHOUDHURY ,  Sanjay G. KAMATH ,  Sridhar BACHU

IPC分类号： H01L21/67 ,  F24F13/14 ,  F24F13/32 ,  H01L21/673

CPC分类号： H01L21/6719 ,  F24F13/1413 ,  F24F13/1486 ,  F24F13/32 ,  H01L21/67383 ,  H01L21/67393

摘要： An apparatus and system for minimizing particle return to the processing area of a processing chamber are disclosed herein. In one example, a particle shield for a semiconductor vacuum processing chamber includes an annular ring, a plurality of rib supports, and a plurality of louver fins. The annular ring has top surface, a bottom surface, and a plurality of cutaways. The top surface has an upper outer portion and a lower inner portion. The plurality of rib supports are disposed on and supported by the lower inner portion. The plurality of louver fins have a truncated conical shape, a bottom surface of the louver fins supported in a recess formed in a top surface of the rib supports. Each of the plurality of louver fins are disposed between adjacent concentric louver fins that have an outer diameter greater than an inner diameter of the outwardly adjacent louver fin.

公开(公告)号：US20180323093A1

公开(公告)日：2018-11-08

申请号：US15970496

申请日：2018-05-03

申请人： Applied Materials, Inc.

发明人： Yizhen ZHANG ,  Rupankar CHOUDHURY ,  Jay D. PINSON, II ,  Jason M. SCHALLER ,  Hanish Kumar PANAVALAPPIL KUMARANKUTTY

IPC分类号： H01L21/67 ,  C23C16/46 ,  C23C16/458 ,  G02B6/42

摘要： Embodiments described herein include integrated systems used to directly monitor a substrate temperature during a plasma enhanced deposition process and methods related thereto. In one embodiment, a substrate support assembly includes a support shaft, a substrate support disposed on the support shaft, and a substrate temperature monitoring system for measuring a temperature of a substrate to be disposed on the substrate support. The substrate temperature monitoring system includes a optical fiber tube, a light guide coupled to the optical fiber tube, and a cooling assembly disposed about a junction of the optical fiber tube and the light guide. Herein, at least a portion of the light guide is disposed in an opening extending through the support shaft and into the substrate support and the cooling assembly maintains the optical fiber tube at a temperature of less than about 100° C. during substrate processing.

公开(公告)号：US20160068951A1

公开(公告)日：2016-03-10

申请号：US14522350

申请日：2014-10-23

申请人： Applied Materials, Inc.

发明人： Danny D. WANG ,  Jun Tae CHOI ,  Rupankar CHOUDHURY ,  Zhong Qiang HUA ,  Juan Carlos ROCHA-ALVAREZ ,  Jason Michael LAMB

IPC分类号： C23C16/44 ,  C23C16/50

CPC分类号： C23C16/4409 ,  B01J3/002 ,  B01J3/006 ,  C23C16/455 ,  C23C16/507

摘要： Alignment systems employing actuators provide relative displacement between lid assemblies of process chambers and substrates, and related methods are disclosed. A process chamber includes chamber walls defining a process volume in which a substrate may be placed and the walls support a lid assembly of the process chamber. The lid assembly contains at least one of an energy source and a process gas dispenser. Moreover, an alignment system may include at least one each of a bracket, an interface member, and an actuator. By attaching the bracket to the chamber wall and securing the interface member to the lid assembly, the actuator may communicate with the bracket and the interface member to provide relative displacement between the chamber wall and the lid assembly. In this manner, the lid assembly may be positioned relative to the substrate to improve process uniformity across the substrate within the process chamber.

摘要翻译： 使用致动器的对准系统提供了处理室和衬底的盖组件之间的相对位移，并且公开了相关方法。 处理室包括限定其中可以放置基底的处理体积的室壁，并且壁支撑处理室的盖组件。 盖组件包含能量源和工艺气体分配器中的至少一个。 此外，对准系统可以包括托架，接口构件和致动器中的至少一个。 通过将支架附接到室壁并将接口构件固定到盖组件，致动器可以与支架和接口构件连通，以在室壁和盖组件之间提供相对的位移。 以这种方式，盖组件可以相对于衬底定位，以提高处理室内的衬底上的工艺均匀性。

公开(公告)号：US20200219698A1

公开(公告)日：2020-07-09

申请号：US16678081

申请日：2019-11-08

申请人： Applied Materials, Inc.

发明人： Zheng John YE ,  Abhijit KANGUDE ,  Luke BONECUTTER ,  Rupankar CHOUDHURY ,  Jay D. PINSON, II

IPC分类号： H01J37/32 ,  H01L21/67 ,  H01L21/683

摘要： Embodiments of the present disclosure generally relate to a semiconductor processing apparatus. More specifically, embodiments of the disclosure relate to generating and controlling plasma. A process chamber includes a chamber body that includes one or more chamber walls and defines a processing region. The process chamber also includes two or more inductively driven radio frequency (RF) coils in a concentric axial alignment, the RF coils arranged near the chamber walls to strike and sustain a plasma inside the chamber body, where at least two of the two or more RF coils are in a recursive configuration.

公开(公告)号：US20200181772A1

公开(公告)日：2020-06-11

申请号：US16691259

申请日：2019-11-21

申请人： Applied Materials, Inc.

发明人： Luke BONECUTTER ,  Yunzhe YANG ,  Rupankar CHOUDHURY ,  Abhijit KANGUDE

IPC分类号： C23C16/44 ,  C23C16/458

摘要： Embodiments described herein relate to apparatus and techniques for mechanical isolation and thermal insulation in a process chamber. In one embodiment, an insulating layer is disposed between a dome assembly and a gas ring. The insulating layer is configured to maintain a temperature of the dome assembly and prevent thermal energy transfer from the dome assembly to the gas ring. The insulating layer provides mechanical isolation of the dome assembly from the gas ring. The insulating layer also provides thermal insulation between the dome assembly and the gas ring. The insulating layer may be fabricated from a polyimide containing material, which substantially reduces an occurrence of deformation of the insulating layer.

公开(公告)号：US20190390334A1

公开(公告)日：2019-12-26

申请号：US16561329

申请日：2019-09-05

申请人： Applied Materials, Inc.

发明人： Danny D. WANG ,  Jason Michael LAMB ,  Jun Tae CHOI ,  Rupankar CHOUDHURY ,  Zhong Qiang HUA ,  Juan Carlos ROCHA-ALVAREZ

IPC分类号： C23C16/44

摘要： Alignment systems employing actuators provide relative displacement between lid assemblies of process chambers and substrates, and related methods are disclosed. A process chamber includes chamber walls defining a process volume in which a substrate may be placed and the walls support a lid assembly of the process chamber. The lid assembly contains at least one of an energy source and a process gas dispenser. Moreover, an alignment system may include at least one each of a bracket, an interface member, and an actuator. By attaching the bracket to the chamber wall and securing the interface member to the lid assembly, the actuator may communicate with the bracket and the interface member to provide relative displacement between the chamber wall and the lid assembly. In this manner, the lid assembly may be positioned relative to the substrate to improve process uniformity across the substrate within the process chamber.

公开(公告)号：US20170148654A1

公开(公告)日：2017-05-25

申请号：US15347519

申请日：2016-11-09

申请人： Applied Materials, Inc.

发明人： Khokan C. PAUL ,  Jay D. PINSON, II ,  Juan Carlos ROCHA-ALVAREZ ,  Hari K. PONNEKANTI ,  Rupankar CHOUDHURY ,  Shekhar ATHANI ,  Sandeep KUMPALA ,  Hanish Kumar PANAVALAPPIL KUMARANKUTTY

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01L21/687 ,  G05B19/04 ,  G05B19/401

CPC分类号： H01L21/67253 ,  G05B19/041 ,  G05B19/401 ,  G05B2219/31459 ,  G05B2219/40066 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67389 ,  H01L21/67724 ,  H01L21/67775 ,  H01L21/68707 ,  H01L21/68764

摘要： Implementations of the present disclosure generally relate to an improved factory interface that is coupled to an on-board metrology housing configured for measuring film properties of a substrate. In one implementation, an apparatus comprises a factory interface, and a metrology housing removably coupled to the factory interface through a load port, the metrology housing comprises an on-board metrology assembly for measuring properties of a substrate to be transferred into the metrology housing.