公开(公告)号：US12094716B2

公开(公告)日：2024-09-17

申请号：US17473821

申请日：2021-09-13

Applicant: Applied Materials, Inc.

Inventor： Leonard M. Tedeschi ,  Kartik Ramaswamy ,  Benjamin C E Schwarz ,  Changgong Wang ,  Vahid Firouzdor ,  Sumanth Banda ,  Teng-Fang Kou

IPC: H01L21/02 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/683

CPC classification number: H01L21/3065 ,  H01J37/32862 ,  H01L21/02274 ,  H01L21/31116 ,  H01L21/6833 ,  H01J2237/332 ,  H01J2237/334

Abstract: Methods of semiconductor processing may include forming a plasma of a carbon-containing material within a processing region of a semiconductor processing chamber. The methods may include depositing a carbon-containing material on a backside of a substrate housed within the processing region of the semiconductor processing chamber. A front side of the substrate may be maintained substantially free of carbon-containing material. The methods may include performing an etch process on the front-side of the substrate. The methods may include removing the carbon-containing material from the backside of the substrate.

公开(公告)号：US20230077578A1

公开(公告)日：2023-03-16

申请号：US17473821

申请日：2021-09-13

Applicant: Applied Materials, Inc.

Inventor： Leonard M. Tedeschi ,  Kartik Ramaswamy ,  Benjamin CE Schwarz ,  Changgong Wang ,  Vahid Firouzdor ,  Sumanth Banda ,  Teng-Fang Kou

IPC: H01L21/3065 ,  H01L21/02 ,  H01L21/311 ,  H01L21/683 ,  H01J37/32

Abstract: Methods of semiconductor processing may include forming a plasma of a carbon-containing material within a processing region of a semiconductor processing chamber. The methods may include depositing a carbon-containing material on a backside of a substrate housed within the processing region of the semiconductor processing chamber. A front side of the substrate may be maintained substantially free of carbon-containing material. The methods may include performing an etch process on the front-side of the substrate. The methods may include removing the carbon-containing material from the backside of the substrate.