公开(公告)号：US20160002779A1

公开(公告)日：2016-01-07

申请号：US14738610

申请日：2015-06-12

Applicant: Applied Materials, Inc.

Inventor： XING LIN ,  Bozhi YANG ,  Jianhua ZHOU ,  Dale R. DUBOIS ,  Juan Carlos ROCHA-ALVAREZ ,  Ramprakash SANKARAKRISHNAN

IPC: C23C16/458 ,  C23C16/50 ,  H01L21/687

CPC classification number: H01L21/687 ,  C23C16/4586 ,  C23C16/50 ,  H01J37/32577 ,  H01J37/32724 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/68792

Abstract: A method and apparatus for a heated pedestal is provided. In one embodiment, the heated pedestal includes a body comprising a ceramic material, a plurality of heating elements encapsulated within the body, and one or more grooves formed in a surface of the body adjacent each of the plurality of heating elements, at least one side of the grooves being bounded by a ceramic plate.

Abstract translation: 提供了一种用于加热基座的方法和装置。 在一个实施例中，被加热的基座包括一个主体，该主体包括陶瓷材料，多个加热元件封装在主体内，以及一个或多个凹槽，其形成在与该多个加热元件中的每一个相邻的本体的表面中，至少一个侧面 的凹槽由陶瓷板限定。

公开(公告)号：US20190051551A1

公开(公告)日：2019-02-14

申请号：US16121844

申请日：2018-09-05

Applicant: APPLIED MATERIALS, INC.

Inventor： XING LIN ,  DOUGLAS A. BUCHBERGER, JR. ,  XIAOPING ZHOU ,  ANDREW NGUYEN ,  ANCHEL SHEYNER

IPC: H01L21/683 ,  H01L21/67 ,  H01J37/32

Abstract: Apparatus for processing a substrate is disclosed herein. In some embodiments, a substrate support may include a substrate support having a support surface for supporting a substrate the substrate support having a central axis; a first electrode disposed within the substrate support to provide RF power to a substrate when disposed on the support surface; an inner conductor coupled to the first electrode about a center of a surface of the first electrode opposing the support surface, wherein the inner conductor is tubular and extends from the first electrode parallel to and about the central axis in a direction away from the support surface of the substrate support; an outer conductor disposed about the inner conductor; and an outer dielectric layer disposed between the inner and outer conductors, the outer dielectric layer electrically isolating the outer conductor from the inner conductor. The outer conductor may be coupled to electrical ground.