公开(公告)号：US11315754B2

公开(公告)日：2022-04-26

申请号：US16859974

申请日：2020-04-27

Applicant: APPLIED MATERIALS ISRAEL LTD.

Inventor： Ilya Blayvas ,  Gal Bruner ,  Yehuda Zur ,  Alexander Mairov ,  Ron Davidescu ,  Kfir Dotan ,  Alon Litman

IPC: G01N1/32 ,  H01J37/305

Abstract: A method of evaluating a region of a sample that includes alternating layers of different material. The method includes milling, with a focused ion beam, a portion of the sample that includes the alternating layers of different material; reducing the milling area; and repeating the milling and reducing steps multiple times during the delayering process until the process is complete.

公开(公告)号：US11598633B2

公开(公告)日：2023-03-07

申请号：US17378999

申请日：2021-07-19

Applicant: Applied Materials Israel Ltd.

Inventor： Alexander Mairov ,  Gal Bruner ,  Yehuda Zur

IPC: G01B15/02 ,  H01J37/302 ,  H01J37/304

Abstract: Analyzing a buried layer on a sample includes milling a spot on the sample using a charged particle beam of a focused ion beam (FIB) column to expose the buried layer along a sidewall of the spot. From a first perspective a first distance is measured between a first point on the sidewall corresponding to an upper surface of the buried layer and a second point on the sidewall corresponding to a lower surface of the buried layer. From a second perspective a second distance is measured between the first point on the sidewall corresponding to the upper surface of the buried layer and the second point on the sidewall corresponding to the lower surface of the buried layer. A thickness of the buried layer is determined using the first distance and the second distance.

公开(公告)号：US20210335571A1

公开(公告)日：2021-10-28

申请号：US16859974

申请日：2020-04-27

Applicant: APPLIED MATERIALS ISRAEL LTD.

Inventor： Ilya Blayvas ,  Gal Bruner ,  Yehuda Zur ,  Alexander Mairov ,  Ron Davidescu ,  Kfir Dotan ,  Alon Litman

IPC: H01J37/305 ,  G01N1/32

Abstract: A method of evaluating a region of a sample that includes alternating layers of different material. The method includes milling, with a focused ion beam, a portion of the sample that includes the alternating layers of different material; reducing the milling area; and repeating the milling and reducing steps multiple times during the delayering process until the process is complete.

公开(公告)号：US20230019567A1

公开(公告)日：2023-01-19

申请号：US17378999

申请日：2021-07-19

Applicant: Applied Materials Israel Ltd.

Inventor： Alexander Mairov ,  Gal Bruner ,  Yehuda Zur

IPC: G01B15/02

Abstract: Analyzing a buried layer on a sample includes milling a spot on the sample using a charged particle beam of a focused ion beam (FIB) column to expose the buried layer along a sidewall of the spot. From a first perspective a first distance is measured between a first point on the sidewall corresponding to an upper surface of the buried layer and a second point on the sidewall corresponding to a lower surface of the buried layer. From a second perspective a second distance is measured between the first point on the sidewall corresponding to the upper surface of the buried layer and the second point on the sidewall corresponding to the lower surface of the buried layer. A thickness of the buried layer is determined using the first distance and the second distance.

公开(公告)号：US11280749B1

公开(公告)日：2022-03-22

申请号：US17079297

申请日：2020-10-23

Applicant: APPLIED MATERIALS ISRAEL LTD.

Inventor： Yehuda Zur ,  Alexander Mairov

IPC: G01N23/2251 ,  H01J37/305 ,  H01J37/20 ,  H01J37/28 ,  H01J37/30

Abstract: A method of evaluating a region of a sample that includes a plurality of holes, wherein the method includes: taking a first image of the region by scanning the region with a first charged particle beam; evaluating the first image to determine a first center-to-center distance between first and second holes in the plurality of holes; milling a diagonal cut in an area within the region that includes the second hole at an angle such that an upper surface of the sample in the milled area where the second hole is located is recessed with respect to an upper surface of the sample where the first hole is located; thereafter, taking a second image of the region by scanning the region with the first charged particle beam; evaluating the second image to determine a second center-to-center distance between first and second holes in the plurality of holes; and comparing the second center-to-center distance to the first center-to-center distance.