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1.发明授权公开(公告)号：US09530199B1
公开(公告)日：2016-12-27
申请号：US14798283
申请日：2015-07-13
Applicant: Applied Materials Israel Ltd.
Inventor： Yakov Weinberg , Ishai Schwarzband , Roman Kris , Itay Zauer , Ran Goldman , Olga Novak , Dhananjay Singh Rathore , Ofer Adan , Shimon Levi
CPC classification number: G06T7/0006 , G06K9/525 , G06T7/001 , G06T7/10 , G06T7/11 , G06T7/12 , G06T7/143 , G06T7/194 , G06T7/30 , G06T7/337 , G06T2207/10061 , G06T2207/20116 , G06T2207/30148
Abstract: A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combined expected image, and providing segmentation of the given image, thereby producing a segmented image, and maps of the layers of said multilayered structure. The method may further include determining overlay between any two selected layers of the multilayer structure by processing the maps of the two selected layers together with the expected images of said two selected layers.
Abstract translation: 用于确定多层结构的层之间的重叠的方法可以包括获得表示多层结构的给定图像，获得多层结构层的预期图像，提供多层结构的组合预期图像作为所述多层结构的预期图像的组合 执行给定图像对组合预期图像的注册，以及提供给定图像的分割，从而产生分割图像，以及所述多层结构层的映射。 该方法还可以包括通过将所选择的两个层的图与所述两个所选择的层的预期图像一起处理来确定多层结构的任何两个所选择的层之间的覆盖。
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公开(公告)号：US09824852B2
公开(公告)日：2017-11-21
申请号：US14985847
申请日：2015-12-31
Applicant: Applied Materials Israel Ltd.
Inventor： Roman Kris , Yakov Weinberg , Yan Ivanchenko , Ishai Schwarzband , Dan Lange , Arbel Englander , Efrat Noifeld , Ran Goldman , Ori Shoval
IPC: H01J37/22 , H01J37/28 , G01N23/225 , G01B15/04
CPC classification number: H01J37/222 , G01N23/2251 , G01N2223/401 , G01N2223/418 , G01N2223/6116 , G01N2223/646 , H01J37/28 , H01J2237/24592 , H01J2237/2813 , H01L22/12
Abstract: A Critical Dimensions Scanning Electron Microscope (CD-SEM) is described that comprises a unit for performing CD-SEM measurements of a semiconductor wafer, a BSE imaging unit for obtaining a Grey Level image (GL) of the wafer, and a unit for GL analysis and for processing the GL analysis results with reference to results of the CD-measurements.
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公开(公告)号：US10354376B2
公开(公告)日：2019-07-16
申请号：US15918570
申请日：2018-03-12
Applicant: Applied Materials Israel Ltd.
Inventor： Yakov Weinberg , Ishai Schwarzband , Roman Kris , Itay Zauer , Ran Goldman , Olga Novak , Dhananjay Singh Rathore , Ofer Adan , Shimon Levi
IPC: G06K9/00 , G06T7/00 , G06T7/194 , G06T7/10 , G06T7/30 , G06T7/11 , G06T7/12 , G06T7/143 , G06T7/33 , G06K9/52
Abstract: A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combined expected image, and providing segmentation of the given image, thereby producing a segmented image, and maps of the layers of said multilayered structure. The method may further include determining overlay between any two selected layers of the multilayer structure by processing the maps of the two selected layers together with the expected images of said two selected layers.
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公开(公告)号：US09916652B2
公开(公告)日：2018-03-13
申请号：US15390663
申请日：2016-12-26
Applicant: Applied Materials Israel Ltd.
Inventor： Yakov Weinberg , Ishai Schwarzband , Roman Kris , Itay Zauer , Ran Goldman , Olga Novak , Dhananjay Singh Rathore , Ofer Adan , Shimon Levi
CPC classification number: G06T7/0006 , G06K9/525 , G06T7/001 , G06T7/10 , G06T7/11 , G06T7/12 , G06T7/143 , G06T7/194 , G06T7/30 , G06T7/337 , G06T2207/10061 , G06T2207/20116 , G06T2207/30148
Abstract: A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combined expected image, and providing segmentation of the given image, thereby producing a segmented image, and maps of the layers of said multilayered structure. The method may further include determining overlay between any two selected layers of the multilayer structure by processing the maps of the two selected layers together with the expected images of said two selected layers.
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