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公开(公告)号：US08441093B2
公开(公告)日：2013-05-14
申请号：US13088242
申请日：2011-04-15
IPC分类号： H01L31/058 , H01L29/06 , H01L35/28
摘要： A thermopile sensor array is provided. The thermopile sensor array may include multiple pixels formed by multiple thermopiles arranged on a single common shared support membrane. A separation between the edge of the shared support membrane and the outermost thermopile(s) may be included to provide additional thermal isolation between the thermopile and an underlying silicon substrate.
摘要翻译： 提供热电堆传感器阵列。 热电堆传感器阵列可以包括由布置在单个公共共享支撑膜上的多个热电堆形成的多个像素。 可以包括共享支撑膜的边缘和最外面的热电堆之间的分离，以在热电堆和下面的硅衬底之间提供额外的热隔离。
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公开(公告)号：US08758650B2
公开(公告)日：2014-06-24
申请号：US13542300
申请日：2012-07-05
申请人： Radu M. Marinescu , Arthur J. Barlow , Grigore D Huminic , Jin Han Ju , Hermann Karagoezoglu , Michael Ersoni
发明人： Radu M. Marinescu , Arthur J. Barlow , Grigore D Huminic , Jin Han Ju , Hermann Karagoezoglu , Michael Ersoni
CPC分类号： G01J5/0853 , G01J5/046 , G01J5/12
摘要： Graphene-based thermopiles are provided. The graphene-based thermopiles may include thermocouples having one or more graphene strips that may be polarized to adjust their Seebeck coefficients. The polarized graphene strips may have larger Seebeck coefficients than the materials conventionally used in thermopile devices. As a result, the graphene-based thermopiles may generate large output voltages using fewer thermocouples than conventional thermopile devices.
摘要翻译： 提供了基于石墨烯的热电堆。 基于石墨烯的热电堆可以包括具有一个或多个石墨烯带的热电偶，其可以被极化以调整其塞贝克系数。 极化石墨烯带可能具有比常规用于热电堆设备的材料更大的塞贝克系数。 结果，基于石墨烯的热电堆可以使用比常规热电堆设备更少的热电偶来产生大的输出电压。
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3.发明申请SEMICONDUCTOR LASER CHIP PACKAGE WITH ENCAPSULATED RECESS MOLDED ON SUBSTRATE AND METHOD FOR FORMING SAME 有权半导体激光芯片封装，底片上封装的封装及其形成方法公开(公告)号：US20120213239A1
公开(公告)日：2012-08-23
申请号：US13411275
申请日：2012-03-02
申请人： Jin Han Ju , Robert Burman , Jerry Deleon
发明人： Jin Han Ju , Robert Burman , Jerry Deleon
IPC分类号： H01S5/30 , H01L21/782
CPC分类号： H01S5/02276 , H01L33/486 , H01L33/64 , H01L2224/48091 , H01L2224/73265 , H01L2924/3011 , H01S5/02228 , H01S5/02236 , H01S5/02252 , H01L2924/00014 , H01L2924/00
摘要： A laminate leadless carrier package having a semiconductor chip mounted at the edge of a recess region in a substrate supporting the chip, the substrate having a plurality of conductive and dielectric layers, a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate. An encapsulation covers the laser chip, the wire bond, and at least a portion of the top surface of the substrate including the recess region. The encapsulation is an optically transparent molding compound. The package is arranged to be mounted as a side-looker and/or a top-looker.
摘要翻译： 一种层压无引线载体封装，其具有安装在支撑芯片的衬底中的凹陷区域的边缘处的半导体芯片，所述衬底具有多个导电和电介质层，耦合到光电芯片的引线键合和位于 衬底的顶表面。 封装覆盖激光芯片，引线接合以及包括凹部区域的基板的顶表面的至少一部分。 封装是光学透明的模塑料。 该包装被设置为作为侧面观察器和/或顶部观察器安装。
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4.发明授权Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same 有权具有模制在基板上的封装凹槽的半导体激光芯片封装及其形成方法公开(公告)号：US08791492B2
公开(公告)日：2014-07-29
申请号：US13411275
申请日：2012-03-02
申请人： Jin Han Ju , Robert Burman , Jerry Deleon
发明人： Jin Han Ju , Robert Burman , Jerry Deleon
IPC分类号： H01L33/00
CPC分类号： H01S5/02276 , H01L33/486 , H01L33/64 , H01L2224/48091 , H01L2224/73265 , H01L2924/3011 , H01S5/02228 , H01S5/02236 , H01S5/02252 , H01L2924/00014 , H01L2924/00
摘要： A laminate leadless carrier package having a semiconductor chip mounted at the edge of a recess region in a substrate supporting the chip, the substrate having a plurality of conductive and dielectric layers, a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate. An encapsulation covers the laser chip, the wire bond, and at least a portion of the top surface of the substrate including the recess region. The encapsulation is an optically transparent molding compound. The package is arranged to be mounted as a side-looker and/or a top-looker.
摘要翻译： 一种层压无引线载体封装，其具有安装在支撑芯片的衬底中的凹陷区域的边缘处的半导体芯片，所述衬底具有多个导电和电介质层，耦合到光电芯片的引线键合和位于 衬底的顶表面。 封装覆盖激光芯片，引线接合以及包括凹部区域的基板的顶表面的至少一部分。 封装是光学透明的模塑料。 该包装被设置为作为侧面观察器和/或顶部观察器安装。
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