Fluid ejection device
    2.
    发明授权
    Fluid ejection device 有权
    流体喷射装置

    公开(公告)号:US07431434B2

    公开(公告)日:2008-10-07

    申请号:US11140802

    申请日:2005-05-31

    IPC分类号: B41J2/05

    摘要: A fluid ejection device includes a fluid chamber, a fluid restriction communicated with the fluid chamber, and a fluid channel communicated with the fluid restriction, wherein a width of the fluid restriction is in a range of approximately 8 microns to approximately 16 microns, and a length of the fluid restriction is in a range of approximately 5 microns to approximately 20 microns.

    摘要翻译: 流体喷射装置包括流体室,与流体室连通的流体限制器,以及与流体限制器连通的流体通道,其中流体限制件的宽度在大约8微米至大约16微米的范围内, 流体限制的长度在约5微米至约20微米的范围内。

    Pasteurization system and method
    3.
    发明申请
    Pasteurization system and method 有权
    巴氏灭菌系统及方法

    公开(公告)号:US20110023728A1

    公开(公告)日:2011-02-03

    申请号:US12462206

    申请日:2009-07-29

    IPC分类号: A23L3/00 A23C3/02 A23L3/005

    摘要: A pasteurization system includes a liquid inlet configured to receive a liquid to be pasteurized. The system also includes a pump coupled to the liquid inlet for pressurizing the liquid. Further, the system includes a counter flow heat exchanger coupled to the liquid inlet and the pump, the counterflow heat exchanger configured to heat the liquid to a predetermined temperature for at least a predetermined time and configured to exchange heat between a flow of liquid in a first direction in a first channel with the flow of liquid in a second direction opposite the first direction in a second channel. A heating section that heats the liquid flow is integrated into the heat exchanger and heats at least a portion of the first channel or the second channel.

    摘要翻译: 巴氏灭菌系统包括构造成接收待巴氏消毒的液体的液体入口。 该系统还包括耦合到液体入口以对液体加压的泵。 此外,该系统包括耦合到液体入口和泵的逆流热交换器,逆流热交换器被配置为将液体加热至预定温度至少预定时间并且构造成在液体流中的热交换 第一通道中的第一方向,在第二通道中具有与第一方向相反的第二方向的液体流。 加热液体流的加热部分集成到热交换器中,并加热第一通道或第二通道的至少一部分。

    Fluid ejection device
    6.
    发明申请
    Fluid ejection device 有权
    流体喷射装置

    公开(公告)号:US20060268067A1

    公开(公告)日:2006-11-30

    申请号:US11140802

    申请日:2005-05-31

    IPC分类号: B41J2/05

    摘要: A fluid ejection device includes a fluid chamber, a fluid restriction communicated with the fluid chamber, and a fluid channel communicated with the fluid restriction, wherein a width of the fluid restriction is in a range of approximately 8 microns to approximately 16 microns, and a length of the fluid restriction is in a range of approximately 5 microns to approximately 20 microns.

    摘要翻译: 流体喷射装置包括流体室,与流体室连通的流体限制器,以及与流体限制器连通的流体通道,其中流体限制件的宽度在大约8微米至大约16微米的范围内, 流体限制的长度在约5微米至约20微米的范围内。

    Managing bubbles in a fluid-delivery device
    7.
    发明授权
    Managing bubbles in a fluid-delivery device 有权
    管理流体输送装置中的气泡

    公开(公告)号:US07093930B2

    公开(公告)日:2006-08-22

    申请号:US10666749

    申请日:2003-09-18

    IPC分类号: B41J2/19

    摘要: Methods and systems for managing bubbles in a micro electro mechanical systems device are described. One exemplary system includes a fluid-feed channel configured to supply fluid to a plurality of ejection chambers, individual ejection chambers comprising a resistor configured to eject fluid from the individual ejection chamber. The system further includes a processor configured to cause an individual resistor to be energized at a first intensity sufficient to eject fluid from a respective ejection chamber, the processor further configured to cause the resistor to be energized at a second lower intensity which heats the resistor but does not cause fluid to be ejected from the respective ejection chamber, and wherein the processor can energize, at the second lower intensity level, individual resistors in a pattern designed to detach a bubble from a surface defining a portion of the fluid-feed channel.

    摘要翻译: 描述了用于在微机电系统装置中管理气泡的方法和系统。 一个示例性系统包括被配置为向多个喷射室供应流体的流体供给通道,各个喷射室包括被配置为从各个喷射室喷出流体的电阻器。 该系统还包括处理器,其被配置为使得单个电阻器以足以从相应喷射室排出流体的第一强度通电,所述处理器还被配置为使得电阻器以第二较低强度通电,所述第二较低强度加热所述电阻器但是 不会导致流体从相应的喷射室喷出,并且其中处理器可以以第二较低强度水平激励设计成从限定流体供给通道的一部分的表面分离气泡的图案中的各个电阻器。

    Managing bubbles in a fluid-delivery device
    8.
    发明申请
    Managing bubbles in a fluid-delivery device 有权
    管理流体输送装置中的气泡

    公开(公告)号:US20050062816A1

    公开(公告)日:2005-03-24

    申请号:US10666749

    申请日:2003-09-18

    摘要: Methods and systems for managing bubbles in a micro electro mechanical systems device are described. One exemplary system includes a fluid-feed channel configured to supply fluid to a plurality of ejection chambers, individual ejection chambers comprising a resistor configured to eject fluid from the individual ejection chamber. The system further includes a processor configured to cause an individual resistor to be energized at a first intensity sufficient to eject fluid from a respective ejection chamber, the processor further configured to cause the resistor to be energized at a second lower intensity which heats the resistor but does not cause fluid to be ejected from the respective ejection chamber, and wherein the processor can energize, at the second lower intensity level, individual resistors in a pattern designed to detach a bubble from a surface defining a portion of the fluid-feed channel.

    摘要翻译: 描述了用于在微机电系统装置中管理气泡的方法和系统。 一个示例性系统包括被配置为向多个喷射室供应流体的流体供给通道,各个喷射室包括被配置为从各个喷射室喷出流体的电阻器。 该系统还包括处理器,其被配置为使得单个电阻器以足以从相应喷射室排出流体的第一强度通电,所述处理器还被配置为使得电阻器以第二较低强度通电,所述第二较低强度加热所述电阻器但是 不会导致流体从相应的喷射室喷出,并且其中处理器可以以第二较低强度水平激励设计成从限定流体供给通道的一部分的表面分离气泡的图案中的各个电阻器。

    System for priming a fluid dispenser by expanding gas bubbles
    9.
    发明授权
    System for priming a fluid dispenser by expanding gas bubbles 有权
    通过膨胀气泡来灌注流体分配器的系统

    公开(公告)号:US08864296B2

    公开(公告)日:2014-10-21

    申请号:US12238752

    申请日:2008-09-26

    摘要: A fluid-dispensing head includes a plenum configured to house fluid; at least one dispensing head orifice in fluid communication with the ink plenum; and at least one heating element configured to heat fluid in the head such that gas bubbles disposed within the fluid increase in surface area.

    摘要翻译: 流体分配头包括构造成容纳流体的增压室; 至少一个与所述油墨通气室流体连通的分配头孔; 以及至少一个加热元件,其构造成加热头部中的流体,使得设置在流体内的气泡的表面积增加。