摘要:
A multiple input multiple output (MIMO) RF transceiver system includes a plurality of RF transceiver ICs, a crystal, and master oscillation coupling. Each of the plurality of RF transceiver ICs includes crystal oscillator circuitry. Crystal oscillator circuitry of the first RF transceiver IC and a crystal are operable to produce a master oscillation. Master oscillation coupling couples the master oscillation produced by the first RF transceiver IC to the at least one other RF transceiver IC. In one embodiment, the master oscillation is passed from the first RF transceiver IC to each other transceiver RF ICs. In another embodiment, the master oscillation is used to produce a slave oscillation at a second RF transceiver IC and subsequent RF transceiver ICs produce there own slave oscillation based upon a slave oscillation received from a prior RF transceiver IC.
摘要:
The present invention provides adjusting of a radio frequency (RF) receiver that includes processing that begins by enabling an initial setting of the RF receiver, wherein the initial setting is based on a bandwidth of a channel of a plurality of channels. The processing continues by receiving an RF signal containing a preamble of a frame via one of the plurality of channels. The processing continues by converting the RF signal to a baseband signal based on the initial setting. The processing continues by determining channel type of the one of the plurality of channels based on the baseband signal. The processing continues by determining whether the channel type corresponds to the bandwidth of the initial setting. The processing continues by, when the channel type does not correspond to the bandwidth of the initial setting, adjusting setting of the RF receiver based on the channel type.
摘要:
Analog signal paths are utilized between a baseband processor and a radio front end to support high throughput communications for a multiple in multiple out radio transceiver that support communications over two or more antennas. Specifically, analog differential I and Q path communication signals are exchanged between a radio front end core and a baseband processor to maximize throughput capacity for high data rate signals. Along the same lines, the impedances of traces and the interface are matched to reduce I/Q imbalance.
摘要:
Analog signal paths are utilized between a baseband processor and a radio front end to support high throughput communications for a multiple in multiple out radio transceiver that support communications over two or more antennas. Specifically, analog differential I and Q path communication signals are exchanged between a radio front end core and a baseband processor to maximize throughput capacity for high data rate signals. Along the same lines, the impedances of traces and the interface are matched to reduce I/Q imbalance.
摘要:
Analog signal paths are utilized between a baseband processor and a radio front end to support high throughput communications for a multiple in multiple out radio transceiver that support communications over two or more antennas. Specifically, analog differential I and Q path communication signals are exchanged between a radio front end core and a baseband processor to maximize throughput capacity for high data rate signals. Along the same lines, the impedances of traces and the interface are matched to reduce I/Q imbalance.
摘要:
Analog signal paths are utilized between a baseband processor and a radio front end to support high throughput communications for a multiple in multiple out radio transceiver that support communications over two or more antennas. Specifically, analog differential I and Q path communication signals are exchanged between a radio front end core and a baseband processor to maximize throughput capacity for high data rate signals. Along the same lines, the impedances of traces and the interface are matched to reduce I/Q imbalance.
摘要:
Analog signal paths are utilized between a baseband processor and a radio front end to support high throughput communications for a multiple in multiple out radio transceiver that support communications over two or more antennas. Specifically, analog differential I and Q path communication signals are exchanged between a radio front end core and a baseband processor to maximize throughput capacity for high data rate signals. Along the same lines, the impedances of traces and the interface are matched to reduce I/Q imbalance.
摘要:
Analog signal paths are utilized between a baseband processor and a radio front end to support high throughput communications for a multiple in multiple out radio transceiver that support communications over two or more antennas. Specifically, analog differential I and Q path communication signals are exchanged between a radio front end core and a baseband processor to maximize throughput capacity for high data rate signals. Along the same lines, the impedances of traces and the interface are matched to reduce I/Q imbalance.
摘要:
Disclosed herein are systems, apparatuses, and methods for locating wireless-enabled components, and applications thereof. Such an apparatus includes a wireless-enabled component (WEC), which may be a functional block of an integrated circuit (IC), an IC, or a device that includes an IC. The WEC includes a functional module (e.g., a processing resource or a memory resource) and an antenna element coupled to the functional module. The antenna element is configured to (i) transmit a search signal to locate a proximally situated WEC and (ii) transmit a communication signal to communicate with the proximally situated WEC. The antenna element may be a phased array, an electrically steered phased array, a mechanically steered phased array, a directional antenna, a mechanically steered directional antenna, an RF antenna, an optical antenna, and/or any combination thereof.
摘要:
Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.