Abstract:
A heat sink comprises a heat sink body, which in some embodiments is a plastic heat sink body, and a thermally conductive layer disposed over the heat sink body. In some embodiments the thermally conductive layer comprises a copper layer. A light emitting diode (LED)-based lamp comprises the aforementioned heat sink and an LED module including one or more LED devices in which the LED module is secured with and in thermal communication with the heat sink. Some such LED-based lamps may have an A-line bulb configuration or an MR or PAR configuration. Disclosed method embodiments comprise forming a heat sink body and disposing a thermally conductive layer on the heat sink body. The forming may comprise molding the heat sink body, which may be plastic. In some method embodiments the heat sink body includes fins and the disposing includes disposing the thermally conductive layer over the fins.
Abstract:
A heat sink comprises a heat sink body, a reflective layer disposed over the heat sink body that has reflectivity greater than 90% for light in the visible spectrum, and a light transmissive protective layer disposed over the reflective layer that is light transmissive for light in the visible spectrum. The heat sink body may comprise a structural heat sink body and a thermally conductive layer disposed over the structural heat sink body where the thermally conductive layer has higher thermal conductivity than the structural heat sink body and the reflective layer is disposed over the thermally conductive layer. A light emitting diode (LED)-based lamp comprises the aforesaid heat sink and an LED module secured with and in thermal communication with the heat sink. The LED-based lamp may have an A-line bulb configuration, or may comprise a directional lamp in which the heat sink defines a hollow light-collecting reflector.
Abstract:
A heat sink comprises a heat sink body, which in some embodiments is a plastic heat sink body, and a thermally conductive layer disposed over the heat sink body. In some embodiments the thermally conductive layer comprises a copper layer. A light emitting diode (LED)-based lamp comprises the aforementioned heat sink and an LED module including one or more LED devices in which the LED module is secured with and in thermal communication with the heat sink. Some such LED-based lamps may have an A-line bulb configuration or an MR or PAR configuration. Disclosed method embodiments comprise forming a heat sink body and disposing a thermally conductive layer on the heat sink body. The forming may comprise molding the heat sink body, which may be plastic. In some method embodiments the heat sink body includes fins and the disposing includes disposing the thermally conductive layer over the fins.
Abstract:
According to a first embodiment, a light emitting diode (LED) light engine is described. The light emitting diode includes one or more LED devices disposed on a front side of an LED light engine substrate. A heat sink having a mating receptacle for the LED light engine is also provided. The LED light engine substrate and the mating receptacle of the heat sink define a tapered fitting by which the LED light engine is retained in the mating receptacle of the heat sink.
Abstract:
According to a first embodiment, a light emitting diode (LED) light engine is described. The light emitting diode includes one or more LED devices disposed on a front side of an LED light engine substrate. A heat sink having a mating receptacle for the LED light engine is also provided. The LED light engine substrate and the mating receptacle of the heat sink define a tapered fitting by which the LED light engine is retained in the mating receptacle of the heat sink.
Abstract:
A heat sink includes a thermally conductive layer comprising at least one of fullerenes and nanotubes disposed in a polymeric host. The thermally conductive layer may be disposed on a heat sink body, which may be thermally insulating and/or plastic, and may include surface area enhancing heat radiating structures, such as fins, with the thermally conductive layer being disposed over at least the surface area enhancing heat radiating structures. A light emitting diode (LED)-based lamp embodiment includes the heat sink and an LED module including one or more LED devices secured with and in thermal communication with the heat sink. A method embodiment includes forming the heat sink body and disposing the thermally conductive layer on the heat sink body. The disposing may comprise spray coating. An external energy field may be applied during spray coating to impart a non-random orientation to nanotubes in the polymeric host.
Abstract:
A heat sink comprises a heat sink body, a reflective layer disposed over the heat sink body that has reflectivity greater than 90% for light in the visible spectrum, and a light transmissive protective layer disposed over the reflective layer that is light transmissive for light in the visible spectrum. The heat sink body may comprise a structural heat sink body and a thermally conductive layer disposed over the structural heat sink body where the thermally conductive layer has higher thermal conductivity than the structural heat sink body and the reflective layer is disposed over the thermally conductive layer. A light emitting diode (LED)-based lamp comprises the aforesaid heat sink and an LED module secured with and in thermal communication with the heat sink. The LED-based lamp may have an A-line bulb configuration, or may comprise a directional lamp in which the heat sink defines a hollow light-collecting reflector.
Abstract:
A metal halide lamp (10) includes a light-transmissive envelope (12) which encloses a metal halide pool (30) for generating a discharge when spaced apart electrodes (20, 22) within the envelope are supplied with an electric current. A multi-layer coating (40) is deposited on a surface (42) of the envelope. The coating includes several layers of at least two materials of different refractive index, which, in combination, reflect radiation in the UV region of the electromagnetic spectrum. Rather than optimizing the coating for a normal (i.e., 0°) angle of incidence on the coating, the multi-layer coating is optimized at an angle which is selected to be within 10° of the mean angle (α) of incidence of the UV radiation on the arctube surface, thereby increasing the amount of UV radiation which is returned to the metal halide pool. The coating is preferably optimized for high reflectivity in the UV-region of the spectrum and high transmission in the visible region of the spectrum to maximize useful light output while reflecting UV light back to the metal halide pool for improved heating of the pool.
Abstract:
A light emitting apparatus comprises: an LED-based light source; a spherical, spheroidal, or toroidal diffuser generating a Lambertian light intensity distribution output at any point on the diffuser surface responsive to illumination inside the diffuser; and a base including a base connector. The LED based light source, the diffuser, and the base are secured together as a unitary LED lamp installable in a lighting socket by connecting the base connector with the lighting socket. The diffuser is shaped and arranged respective to the LED based light source in the unitary LED lamp to conform with an isolux surface of the LED based light source. The base is operatively connected with the LED based light source in the unitary LED lamp to electrically power the LED based light source using electrical power received at the base connector.
Abstract:
A lighting apparatus includes a bilaterally symmetrical light engine comprising first and second light emitting diode (LED) devices or planar LED device arrays facing opposite directions, and an envelope including phosphor spaced apart from and surrounding the bilaterally symmetrical light engine. The phosphor is effective to convert light emitted by the light engine to emission light. The bilaterally symmetrical light engine may be configured to emit light having a bilaterally symmetrical intensity distribution that is uniform except at emission angles within 10° of the symmetry plane of the bilaterally symmetrical light engine. Each of the first and second LED devices or planar LED device arrays may comprise at least one hemispherically emitting LED device including an LED chip and an encapsulant encapsulating the LED chip and shaped to refract light emitted by the LED chip into a uniform distribution over a hemispherical solid angle.