Thick film copper conductor inks
    1.
    发明授权
    Thick film copper conductor inks 失效
    厚膜铜导体油墨

    公开(公告)号:US4880567A

    公开(公告)日:1989-11-14

    申请号:US281605

    申请日:1988-12-09

    摘要: Improved copper conductor inks useful in the fabrication of multilevel circuits are disclosed. The inks comprise copper powder, a devitrifying glass frit selected from a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit and mixtures thereof, an adhesion promoting oxide, and a suitable organic vehicle. These inks are particularly adapted for applications where superior adhesion between the copper conductor ink and the underlying substrate or dielectric film is required.

    摘要翻译: 公开了用于制造多电平电路的改进的铜导体油墨。 油墨包括铜粉,选自锌 - 钙 - 铝 - 硅酸盐玻璃料,锌 - 镁 - 钡 - 硅酸铝玻璃料及其混合物的失透玻璃料,增粘氧化物和合适的有机载体。 这些油墨特别适用于需要铜导体油墨和下面的基材或电介质膜之间的优良粘附性的应用。

    Thick-film copper conductor inks
    2.
    发明授权
    Thick-film copper conductor inks 失效
    厚膜铜导体油墨

    公开(公告)号:US4874550A

    公开(公告)日:1989-10-17

    申请号:US278987

    申请日:1988-12-02

    摘要: Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a devitrifying glass frit which does not begin to flow until the furnace temperature is above about 700.degree. C., and a suitable organic vehicle. Devitrifying glass frits with these properties include a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit and mixtures thereof. The inks are advantageous in that they form copper conductor layers having excellent properties without the inclusion of traditional flux materials such as bismuth oxide.

    摘要翻译: 提供了用于制造多电平电路的改进的铜导体油墨。 这些油墨包括铜粉,一种不透气的玻璃料,直到炉温高于约700℃才开始流动,而且有合适的有机载体。 具有这些特性的透明玻璃料包括锌 - 钙 - 铝 - 硅酸盐玻璃料,锌 - 镁 - 钡 - 铝 - 硅酸盐玻璃料,锌 - 镁 - 钡 - 铝 - 锆 - 磷硅酸盐玻璃料及其混合物。 这些油墨的优点在于,它们形成具有优异性能的铜导体层,而不包括传统的助焊剂材料如氧化铋。

    Thick film copper conductor inks
    5.
    发明授权
    Thick film copper conductor inks 失效
    厚膜铜导体油墨

    公开(公告)号:US4733018A

    公开(公告)日:1988-03-22

    申请号:US914304

    申请日:1986-10-02

    CPC分类号: H05K1/092

    摘要: Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a novel zinc-aluminum-lead-borosilicate glass frit, bismuth oxide and a suitable organic vehicle. The inks are advantageous in that the films formed therefrom are oxidation resistant and have a reduced tendency for flux components to leach into adjacent dielectric films.

    摘要翻译: 提供了用于制造多电平电路的改进的铜导体油墨。 油墨包括铜粉,新型的锌 - 铝铅 - 硼硅酸盐玻璃料,氧化铋和合适的有机载体。 油墨的优点在于由其形成的膜是抗氧化的并且具有减少焊剂组分浸出到相邻介电膜中的倾向。

    Via fill ink composition for integrated circuits
    8.
    发明授权
    Via fill ink composition for integrated circuits 失效
    通过填充墨水组合物用于集成电路

    公开(公告)号:US4863517A

    公开(公告)日:1989-09-05

    申请号:US255301

    申请日:1988-10-11

    IPC分类号: C03C8/08 H05K1/09

    CPC分类号: C03C8/08 H05K1/092

    摘要: A novel devitrifying frit is disclosed which has a coefficient of expansion essentially the same as that of silicon. The subject frits have a high softening temperature and excellent reheat stability which make them useful in ink formulations for forming dielectric layers in multilayer circuitry. The frits are also suitable for use as a substrate material for direct mounting of silicon chips or for use in thick film via-fill inks.

    摘要翻译: 公开了一种新颖的失透玻璃料,其具有与硅的膨胀系数基本相同的膨胀系数。 本发明的玻璃料具有高的软化温度和优异的再加热稳定性,使得它们可用于在多层电路中形成介电层的油墨配方中。 玻璃料也适合用作直接安装硅芯片或用于厚膜通孔填充油墨的基材。

    Thick film copper via-fill inks
    9.
    发明授权
    Thick film copper via-fill inks 失效
    厚膜铜经填充油墨

    公开(公告)号:US4810420A

    公开(公告)日:1989-03-07

    申请号:US914296

    申请日:1986-10-02

    摘要: An improved copper via-fill ink for forming post-ups in a thick dielectric layer separating two patterned layers of copper conductor in a multilayer circuit assembly is provided. The via-fill ink comprises copper powder, a suitable organic vehicle and a glass frit consisting of a devitrifying glass and a vitreous glass. The devitrifying glass is a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass and the vitreous glass is a barium-calcium-borosilicate glass.

    摘要翻译: 提供了一种改进的铜通孔填充油墨,用于在多层电路组件中分离铜导体的两个图案化层的厚介电层中形成后补。 通孔填充油墨包括铜粉,合适的有机载体和由失透玻璃和玻璃状玻璃组成的玻璃料。 失透玻璃是锌 - 镁 - 钡 - 铝 - 锆 - 磷硅酸盐玻璃,玻璃状玻璃是钡 - 钙 - 硼硅酸盐玻璃。