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公开(公告)号：US4810420A
公开(公告)日：1989-03-07
申请号：US914296
申请日：1986-10-02
CPC分类号： H05K1/092 , H01B1/16 , H05K1/0306 , H05K3/46
摘要： An improved copper via-fill ink for forming post-ups in a thick dielectric layer separating two patterned layers of copper conductor in a multilayer circuit assembly is provided. The via-fill ink comprises copper powder, a suitable organic vehicle and a glass frit consisting of a devitrifying glass and a vitreous glass. The devitrifying glass is a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass and the vitreous glass is a barium-calcium-borosilicate glass.
摘要翻译： 提供了一种改进的铜通孔填充油墨，用于在多层电路组件中分离铜导体的两个图案化层的厚介电层中形成后补。 通孔填充油墨包括铜粉，合适的有机载体和由失透玻璃和玻璃状玻璃组成的玻璃料。 失透玻璃是锌 - 镁 - 钡 - 铝 - 锆 - 磷硅酸盐玻璃，玻璃状玻璃是钡 - 钙 - 硼硅酸盐玻璃。
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公开(公告)号：US4479890A
公开(公告)日：1984-10-30
申请号：US432973
申请日：1982-10-05
申请人： Ashok N. Prabhu , Simon M. Boardman
发明人： Ashok N. Prabhu , Simon M. Boardman
IPC分类号： H01C7/00 , H01C17/065 , H01B1/06
CPC分类号： H01C17/0652 , H01C7/005
摘要： An improved ink composition suitable for the formation of thick film resistor inks which can be terminated directly to copper foil conductors. The subject compositions comprise an epoxy resin, conductive carbon particles, a suitable solvent and particulate alumina, wherein the alumina is present in an amount at least equal to the resin content on a weight basis.
摘要翻译： 适用于形成可以直接终止于铜箔导体的厚膜电阻油墨的改进的油墨组合物。 主题组合物包括环氧树脂，导电碳颗粒，合适的溶剂和颗粒氧化铝，其中氧化铝以至少等于树脂含量的量以重量计存在。
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公开(公告)号：US5035939A
公开(公告)日：1991-07-30
申请号：US477393
申请日：1990-02-09
CPC分类号： H05K3/0041 , H05K3/4061 , H05K1/0306 , H05K1/092 , H05K2201/0166 , H05K2203/0384 , H05K2203/0582 , H05K2203/308 , H05K3/002 , H05K3/4644 , H05K3/4667 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/24926 , Y10T428/31678
摘要： In the manufacture of printed circuit boards, a first photoresist post is patterned on the substrate where via holes are to be made. A dielectric layer is put down, a second photoresist layer patterned so as to have openings over and in alignment with the photoresist posts, and the dielectric removed from the via holes. Barrier layers to reduce interaction between layers of copper, dielectric and photoresist during filling of the via holes with a conductor via fill ink are also described.
摘要翻译： 在印刷电路板的制造中，在要制造通孔的基板上图案化第一光致抗蚀剂柱。 介电层被放下，图案化的第二光致抗蚀剂层具有在光致抗蚀剂柱上方并与其对准的开口，并且从通孔去除电介质。 还描述了阻挡层，以减少在用导体通过填充油墨填充通孔期间铜，电介质和光致抗蚀剂层之间的相互作用。
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公开(公告)号：US5082804A
公开(公告)日：1992-01-21
申请号：US450937
申请日：1989-12-15
申请人： Ashok N. Prabhu , Kenneth W. Hang
发明人： Ashok N. Prabhu , Kenneth W. Hang
CPC分类号： H05K1/097 , C03C10/0036 , C03C8/04 , C03C8/18 , H05K1/0306 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： Low-expansion devitrifying glass compositions exhibiting a negative-slope temperature coefficient of expansion over a temperature range from about 125.degree. C. to about 500.degree. C. are useful for the fabrication of thick film copper via-fill inks for multilayer printed-circuit boards.
摘要翻译： 在约125℃至约500℃的温度范围内呈现负斜率温度膨胀系数的低膨胀失透玻璃组合物可用于制造用于多层印刷电路板的厚膜铜经填充油墨 。
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公开(公告)号：USRE34982E
公开(公告)日：1995-06-27
申请号：US179480
申请日：1994-01-04
申请人： Ashok N. Prabhu , Kenneth W. Hang
发明人： Ashok N. Prabhu , Kenneth W. Hang
CPC分类号： H05K1/097 , C03C10/0036 , C03C8/04 , C03C8/18 , H05K1/0306 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： Low-expansion devitrifying glass compositions exhibiting a negative-slope temperature coefficient of expansion over a temperature range from about 125.degree. C. to about 500.degree. C. are useful for the fabrication of thick film copper via-fill inks of multilayer printed-circuit boards.
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公开(公告)号：US4880567A
公开(公告)日：1989-11-14
申请号：US281605
申请日：1988-12-09
CPC分类号： H05K1/092 , C03C3/062 , C03C3/097 , C04B41/009 , C04B41/5127 , C04B41/88 , H01B1/16 , C04B2111/00844
摘要： Improved copper conductor inks useful in the fabrication of multilevel circuits are disclosed. The inks comprise copper powder, a devitrifying glass frit selected from a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit and mixtures thereof, an adhesion promoting oxide, and a suitable organic vehicle. These inks are particularly adapted for applications where superior adhesion between the copper conductor ink and the underlying substrate or dielectric film is required.
摘要翻译： 公开了用于制造多电平电路的改进的铜导体油墨。 油墨包括铜粉，选自锌 - 钙 - 铝 - 硅酸盐玻璃料，锌 - 镁 - 钡 - 硅酸铝玻璃料及其混合物的失透玻璃料，增粘氧化物和合适的有机载体。 这些油墨特别适用于需要铜导体油墨和下面的基材或电介质膜之间的优良粘附性的应用。
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公开(公告)号：US4863517A
公开(公告)日：1989-09-05
申请号：US255301
申请日：1988-10-11
申请人： Kenneth W. Hang , Ashok N. Prabhu
发明人： Kenneth W. Hang , Ashok N. Prabhu
摘要： A novel devitrifying frit is disclosed which has a coefficient of expansion essentially the same as that of silicon. The subject frits have a high softening temperature and excellent reheat stability which make them useful in ink formulations for forming dielectric layers in multilayer circuitry. The frits are also suitable for use as a substrate material for direct mounting of silicon chips or for use in thick film via-fill inks.
摘要翻译： 公开了一种新颖的失透玻璃料，其具有与硅的膨胀系数基本相同的膨胀系数。 本发明的玻璃料具有高的软化温度和优异的再加热稳定性，使得它们可用于在多层电路中形成介电层的油墨配方中。 玻璃料也适合用作直接安装硅芯片或用于厚膜通孔填充油墨的基材。
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公开(公告)号：US4788163A
公开(公告)日：1988-11-29
申请号：US87547
申请日：1987-08-20
申请人： Kenneth W. Hang , Ashok N. Prabhu
发明人： Kenneth W. Hang , Ashok N. Prabhu
IPC分类号： C03C3/066 , C03C3/085 , C03C3/097 , C03C8/08 , C03C8/14 , C03C8/16 , C03C14/00 , C04B41/88 , H05K1/09 , C03C8/04
摘要： A novel devitrifying frit is disclosed which has a coefficient of expansion essentially the same as that of silicon. The subject frits have a high softening temperature and excellent reheat stability which make them useful in ink formulations for forming dielectric layers in multilayer circuitry. The frits are also suitable for use as a substrate material for direct mounting of silicon chips or for use in thick film via-fill inks.
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公开(公告)号：US4369254A
公开(公告)日：1983-01-18
申请号：US280916
申请日：1981-07-06
申请人： Ashok N. Prabhu , Kenneth W. Hang
发明人： Ashok N. Prabhu , Kenneth W. Hang
CPC分类号： H01L27/013 , C03C8/24 , H05K3/4685 , Y10S428/901 , Y10T428/24917 , Y10T428/24926 , Y10T428/252 , Y10T428/258
摘要： Novel thick-film crossover dielectric inks useful in constructing multilayer circuits on suitable substrates are provided. The subject inks comprise a barium magnesium borosilicate glass powder, a pinhole reducing component comprising silicon dioxide, an alkaline earth aluminum borosilicate glass having a high softening point or mixtures thereof and a suitable organic vehicle.
摘要翻译： 提供了可用于在合适基板上构造多层电路的新型厚膜交叉电介质油墨。 主题油墨包括钡镁硼硅酸盐玻璃粉末，包含二氧化硅的针孔还原组分，具有高软化点的碱土金属硼硅酸盐玻璃或其混合物和合适的有机载体。
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公开(公告)号：US4808770A
公开(公告)日：1989-02-28
申请号：US087583
申请日：1987-08-20
CPC分类号： H05K1/092 , C03C10/0045 , C03C8/08 , H01B1/16
摘要： Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a devitrifying glass frit which does not begin to flow until the furnace temperature is above about 700.degree. C., and a suitable organic vehicle. Devitrifying glass frits with these properties include a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit and mixtures thereof. The inks are advantageous in that they form copper conductor layers having excellent properties without the inclusion of traditional flux materials such as bismuth oxide.
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