Encapsulated package for power magnetic devices and method of
manufacture therefor
    1.
    发明授权
    Encapsulated package for power magnetic devices and method of manufacture therefor 失效
    用于电力磁性装置的封装封装及其制造方法

    公开(公告)号:US5787569A

    公开(公告)日:1998-08-04

    申请号:US604637

    申请日:1996-02-21

    IPC分类号: H01F27/02 H01F41/02

    摘要: An encapsulated package for a power magnetic device and a method of manufacture therefor. The power magnetic device has a magnetic core subject to magnetostriction when placed under stress. The package includes: (1) compliant material disposed about at least a portion of the magnetic core and (2) an encapsulant substantially surrounding the compliant material and the magnetic core, the compliant material providing a medium for absorbing stress between the encapsulant and the magnetic core, the compliant material reducing the magnetostriction upon the magnetic core caused by the stress from the encapsulant. In one embodiment, the encapsulant includes a vent to an environment surrounding the package. The vent provides pressure relief for the compliant material, allowing the compliant material to substantially eliminate the magnetostrictive effects.

    摘要翻译: 一种用于功率磁性器件的封装封装及其制造方法。 功率磁性器件具有受应力作用时磁致伸缩的磁芯。 包装包括:(1)围绕磁芯的至少一部分设置的顺应性材料和(2)基本上围绕柔性材料和磁芯的密封剂,柔性材料提供用于吸收密封剂和磁性之间的应力的介质 芯,柔性材料减少了由于密封剂的应力引起的磁芯上的磁致伸缩。 在一个实施例中,密封剂包括通向包装周围的环境的通风口。 排气孔为柔性材料提供压力释放,允许柔性材料基本上消除磁致伸缩效应。

    Apparatus and method for connecting a plurality of electrical circuits borne upon a plurality of substrates
    2.
    发明授权
    Apparatus and method for connecting a plurality of electrical circuits borne upon a plurality of substrates 失效
    用于连接承载在多个基板上的多个电路的装置和方法

    公开(公告)号:US06354845B1

    公开(公告)日:2002-03-12

    申请号:US09584988

    申请日:2000-06-01

    IPC分类号: H01R1200

    摘要: An apparatus for connecting a plurality of electrical circuits borne upon a plurality of substrates is disclosed. A first substrate of the plurality of substrates has a first aperture having a first diametral displacement and a first inner wall. A portion of the first inner wall is electrically connected with a first circuit borne upon the first substrate. The apparatus comprises a sheet of electrically conductive material arranged to a displacement from an axis in a substantially helical orientation about the axis. The material has a spring characteristic when the helical orientation establishes the displacement at a spring displacement. The spring characteristic urges the conductive material to a greater displacement from the axis than the spring displacement and permits insertion of the apparatus in the first aperture. The spring characteristic and the first diametral dimension cooperate to seat the apparatus in the first aperture to establish electrical connection with the first circuit. The method comprises the steps of: (a) spirally winding a sheet of electrically conductive material to an insertion diametral displacement generally equal to or slightly greater than the first diametral displacement; and (b) urging the spirally wound sheet into the first aperture.

    摘要翻译: 公开了一种用于连接承载在多个基板上的多个电路的装置。 多个基板的第一基板具有第一直径位移的第一孔和第一内壁。 第一内壁的一部分与承载在第一基板上的第一电路电连接。 该装置包括导电材料片,布置成围绕轴线以大致螺旋方向从轴线移位。 当螺旋方向确定弹簧位移时的位移时,该材料具有弹簧特性。 弹簧特性促使导电材料从轴线移动到比弹簧位移更大的位移,并允许将装置插入第一孔中。 弹簧特性和第一直径尺寸协调将装置安置在第一孔中以与第一电路建立电连接。 该方法包括以下步骤:(a)将一片导电材料螺旋卷绕到通常等于或略大于第一直径位移的插入直径位移; 和(b)将螺旋卷绕的片材推动到第一孔中。