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1.发明授权公开(公告)号：US08339802B2
公开(公告)日：2012-12-25
申请号：US12393818
申请日：2009-02-26
IPC分类号： H05K7/00
CPC分类号： H05K1/165 , H01F27/2804 , H01L23/495 , H01L23/645 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/0603 , H01L2224/2919 , H01L2224/32057 , H01L2224/45144 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48799 , H01L2224/49111 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/85399 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/00015 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19103 , H01L2924/30107 , H05K1/181 , H05K3/284 , H05K2201/086 , H05K2201/10515 , H05K2203/049 , H01L2924/0665 , H01L2924/00 , H01L2924/00012 , H01L2224/8381
摘要： A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core.
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公开(公告)号：US06457836B1
公开(公告)日：2002-10-01
申请号：US10071381
申请日：2002-02-08
IPC分类号： G02B508
CPC分类号： G02B5/08
摘要： A reflective element, such as a mirror, includes a substrate and a reflective layer formed thereon. The substrate comprises at least one thixotropic metal alloy, which is injected into a mold to form the shape desired for the reflective element. The reflective element may also include an interface layer comprising a thermoset material, such as an epoxy resin, formed between the substrate and the reflective layer to increase the smoothness of the substrate.
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公开(公告)号：US5773322A
公开(公告)日：1998-06-30
申请号：US884095
申请日：1997-06-27
申请人： John David Weld
发明人： John David Weld
IPC分类号： B29C39/10 , B29D99/00 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/28 , H01L23/495 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/49517 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2919 , H01L2224/29298 , H01L2224/32245 , H01L2224/80904 , H01L2224/8319 , H01L2224/838 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12032 , H01L2924/14 , H01L2924/15747 , H01L2924/181
摘要： A molded encapsulated electronic component containing a silicon device, chip, or integrated circuit characterized by ease of fabrication and minimum possibility of breakage or dislocation, included a lead frame bearing a compressed, thin elastomeric, anisotropic, electrically conductive compliant interconnect on which the silicon integrated circuit is positioned--all mounted within an all-enveloping plastic.
摘要翻译： 包含硅器件，芯片或集成电路的模制封装的电子部件，其特征在于易于制造和最小的断裂或脱位的可能性，包括承载压缩，薄弹性，各向异性，导电顺应性互连的引线框架，其上集成了硅 电路定位 - 全部安装在全包装塑料内。
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4.发明授权Encapsulated, integrated power magnetic device and method of manufacture therefor 失效封装的集成电力磁性装置及其制造方法
公开(公告)号：US5659462A
公开(公告)日：1997-08-19
申请号：US640583
申请日：1996-04-12
CPC分类号： H01F41/08 , B23Q3/00 , H01F41/0206 , H02M3/00 , H02M3/335 , H01F2019/085 , Y10T29/49073 , Y10T29/49075 , Y10T29/49078 , Y10T29/53196 , Y10T29/53265
摘要： A power magnetic device, a method of manufacture therefor and a power converter. The power magnetic device includes: (1) an isolation transformer having a primary winding and a secondary winding, (2) a switch coupled to the primary winding, (3) a rectifier coupled to the secondary winding and (4) an encapsulant substantially surrounding the isolation transformer, the switch and the rectifier to join the isolation transformer, the switch and the rectifier into an integrated package, the integrated package having: (a) a first power input coupled to a first end of the primary winding, (b) a second power input coupled to the switch, (c) first and second power outputs coupled to the rectifier circuit and (d) a control input coupled to the switch, the control input allowing the switch to be controlled to couple the primary winding to a source of electrical power, the power magnetic device thereby capable of employing the isolation transformer and the rectifier to convert electrical power into DC electrical power.
摘要翻译： 电力磁性装置及其制造方法和功率转换器。 功率磁性装置包括：（1）具有初级绕组和次级绕组的隔离变压器，（2）耦合到初级绕组的开关，（3）耦合到次级绕组的整流器和（4）基本上围绕 所述隔离变压器，所述开关和所述整流器将所述隔离变压器，所述开关和所述整流器连接成集成封装，所述集成封装具有：（a）耦合到所述初级绕组的第一端的第一功率输入，（b） 耦合到所述开关的第二功率输入，（c）耦合到所述整流器电路的第一和第二功率输出和（d）耦合到所述开关的控制输入，所述控制输入允许所述开关被控制以将所述初级绕组耦合到 电力源，因此功率磁性装置能够采用隔离变压器和整流器将电力转换成直流电力。
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公开(公告)号：US20100087036A1
公开(公告)日：2010-04-08
申请号：US12244672
申请日：2008-10-02
IPC分类号： H01L21/00
CPC分类号： H01L23/645 , H01L23/3107 , H01L23/49541 , H01L23/49589 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/16 , H01L2224/05554 , H01L2224/45144 , H01L2224/48247 , H01L2224/48465 , H01L2224/49113 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/1306 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19103 , H01L2924/00 , H01L2224/45147 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A module having a discrete passive element and a semiconductor device, and method of forming the same. In one embodiment, the module includes a patterned leadframe, a discrete passive element mounted on an upper surface of the leadframe, and a thermally conductive, electrically insulating material formed on an upper surface of the discrete passive element. The module also includes a semiconductor device bonded to an upper surface of the thermally conductive, electrically insulating material.
摘要翻译： 具有分立无源元件和半导体器件的模块及其形成方法。 在一个实施例中，模块包括图案化引线框架，安装在引线框架的上表面上的分立无源元件以及形成在分立无源元件的上表面上的导热电绝缘材料。 该模块还包括结合到导热电绝缘材料的上表面的半导体器件。
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公开(公告)号：US20100084750A1
公开(公告)日：2010-04-08
申请号：US12244669
申请日：2008-10-02
IPC分类号： H01L23/495
CPC分类号： H01L23/495 , H01F17/0006 , H01F27/22 , H01L23/4952 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L51/529 , H01L2224/04042 , H01L2224/05554 , H01L2224/05555 , H01L2224/05556 , H01L2224/05599 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48799 , H01L2224/49 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/1306 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00 , H01L2924/00012
摘要： A module having a discrete passive element and a semiconductor device, and method of forming the same. In one embodiment, the module includes a patterned leadframe, a discrete passive element mounted on an upper surface of the leadframe, and a thermally conductive, electrically insulating material formed on an upper surface of the discrete passive element. The module also includes a semiconductor device bonded to an upper surface of the thermally conductive, electrically insulating material.
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公开(公告)号：US06633719B2
公开(公告)日：2003-10-14
申请号：US09886767
申请日：2001-06-21
IPC分类号： G02B600
CPC分类号： G02B6/3644 , G02B6/3652 , G02B6/3672 , G02B6/3676 , G02B6/3692 , G02B6/3822
摘要： A fiber array faceplate for receiving, precisely positioning and immobilizing bare optical fiber. The faceplate includes a plate arrangement of at least two mutually parallel plates each having an array of fixed apertures. At least one of the plates is movable in translational motion such that the at least two plates collectively define an array of adjustable-size apertures that can open wide enough to readily receive bare optical fiber and then decrease in size to immobilize the received optical fiber.
摘要翻译： 用于接收，精确定位和固定裸光纤的光纤阵列面板。 面板包括至少两个相互平行的板的板装置，每个板具有固定孔的阵列。 板中的至少一个可以平移运动地移动，使得至少两个板共同限定可调节尺寸的孔的阵列，其可以足够宽地敞开以容易地接收裸光纤，然后减小尺寸以固定接收的光纤。
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8.发明授权公开(公告)号：US06393187B1
公开(公告)日：2002-05-21
申请号：US09631417
申请日：2000-08-03
申请人： Jon W. Engelberth , John David Weld
发明人： Jon W. Engelberth , John David Weld
IPC分类号： G02B604
CPC分类号： G02B6/3672 , G02B6/3512 , G02B6/3556 , G02B6/3644 , G02B6/3652 , Y10S385/901
摘要： In accordance with the invention, an optical fiber array comprises a substrate providing a planar array of optical fibers. The optical fibers are parallel to an array axis, but the fiber ends present smooth, polished surfaces angled from the array axis to minimize return loss of light directed along the axis. Three embodiments are described. The first is a series of 1×n strip arrays each mounted at an angle to the array axis to form a saw tooth configuration faceplate. The holes in each strip are also angled to compensate for the angled mount. A second embodiment uses an angled planar faceplate having tapered holes. A third embodiment uses an angled faceplate planar with double-tapered holes to obtain the angled end surfaces. In each embodiment, the fiber ends are substantially coplanar with the faceplate surface but the ends are angled with respect to the array axis.
摘要翻译： 根据本发明，光纤阵列包括提供光纤的平面阵列的基板。 光纤平行于阵列轴线，但是光纤末端呈现与阵列轴线成角度的光滑的抛光表面，以最小化沿轴线定向的光的回波损耗。 描述三个实施例。 第一个是一系列1xn条阵列，每个阵列与阵列轴线成一定角度，以形成锯齿配置面板。 每个条带中的孔也成角度以补偿角度的安装。 第二实施例使用具有锥形孔的倾斜平面面板。 第三实施例使用具有双锥形孔的平面倾斜面板以获得成角度的端面。 在每个实施例中，光纤端部与面板表面基本共面，但是端部相对于阵列轴线成一定角度。
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公开(公告)号：US06281433B1
公开(公告)日：2001-08-28
申请号：US09366241
申请日：1999-08-03
IPC分类号： H05K900
CPC分类号： H05K9/0015 , H05K7/1425
摘要： A faceplate for network switching apparatus is formed of a multi-layered structure having a first material layer and a second material layer. An outer portion of the faceplate is formed of the first material layer. The first material layer is an anti static material. An inner portion of the faceplate is formed of the second material layer. The second material layer is formed of an electromagnetic interference (EMI) shielding material. The first material layer and the second material layer are formed of polymeric materials which are rigid after extrusion. In an alternative embodiment, a gasket is coextruded with the first material layer and the second material layer. The gasket protrudes laterally from the inner portion of the faceplate along the length thereof. The gasket is formed of a third material layer. The third material layer is an EMI shielding material. The third material layer is formed of a polymeric material which is flexible after extrusion.
摘要翻译： 用于网络交换设备的面板由具有第一材料层和第二材料层的多层结构形成。 面板的外部由第一材料层形成。 第一材料层是防静电材料。 面板的内部由第二材料层形成。 第二材料层由电磁干扰（EMI）屏蔽材料形成。 第一材料层和第二材料层由挤出后刚性的聚合材料形成。 在替代实施例中，垫圈与第一材料层和第二材料层共挤出。 垫圈沿着其长度从面板的内部横向突出。 垫圈由第三材料层形成。 第三材料层是EMI屏蔽材料。 第三材料层由挤出后是柔性的聚合材料形成。
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公开(公告)号：US06255587B1
公开(公告)日：2001-07-03
申请号：US08978097
申请日：1997-11-25
IPC分类号： H01L2328
CPC分类号： H01R43/007 , B29C45/14467 , B29C45/14639 , H01R12/52 , H01R12/7076
摘要： Electronic devices include at least two electronic components in electrical contact by a connector, the components being at least partially encased by a molded resin. Preferably, the connector is a compression connector and the molded resin maintains a compressive force on the connector to ensure that reliable contact is maintained.
摘要翻译： 电子设备包括通过连接器电接触的至少两个电子部件，所述部件至少部分地被模制树脂封装。 优选地，连接器是压缩连接器，并且模制树脂在连接器上保持压缩力，以确保保持可靠的接触。
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