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24 条记录 (耗时 0.029 秒)

    Encapsulated package for power magnetic devices and method of manufacture therefor
    1.
    发明授权
    Encapsulated package for power magnetic devices and method of manufacture therefor 失效
    用于电力磁性装置的封装封装及其制造方法

    公开(公告)号：US5787569A

    公开(公告)日：1998-08-04

    申请号：US604637

    申请日：1996-02-21

    申请人： Ashraf Wagih Lotfi ,  John David Weld ,  Karl Erich Wolf ,  William Lonzo Woods

    发明人： Ashraf Wagih Lotfi ,  John David Weld ,  Karl Erich Wolf ,  William Lonzo Woods

    IPC分类号： H01F27/02 ,  H01F41/02

    CPC分类号： H01F27/022 ,  Y10T29/435 ,  Y10T29/4902 ,  Y10T29/49144 ,  Y10T29/49171

    摘要： An encapsulated package for a power magnetic device and a method of manufacture therefor. The power magnetic device has a magnetic core subject to magnetostriction when placed under stress. The package includes: (1) compliant material disposed about at least a portion of the magnetic core and (2) an encapsulant substantially surrounding the compliant material and the magnetic core, the compliant material providing a medium for absorbing stress between the encapsulant and the magnetic core, the compliant material reducing the magnetostriction upon the magnetic core caused by the stress from the encapsulant. In one embodiment, the encapsulant includes a vent to an environment surrounding the package. The vent provides pressure relief for the compliant material, allowing the compliant material to substantially eliminate the magnetostrictive effects.

    摘要翻译： 一种用于功率磁性器件的封装封装及其制造方法。 功率磁性器件具有受应力作用时磁致伸缩的磁芯。 包装包括：（1）围绕磁芯的至少一部分设置的顺应性材料和（2）基本上围绕柔性材料和磁芯的密封剂，柔性材料提供用于吸收密封剂和磁性之间的应力的介质 芯，柔性材料减少了由于密封剂的应力引起的磁芯上的磁致伸缩。 在一个实施例中，密封剂包括通向包装周围的环境的通风口。 排气孔为柔性材料提供压力释放，允许柔性材料基本上消除磁致伸缩效应。

    Encapsulated, integrated power magnetic device and method of manufacture therefor
    2.
    发明授权
    Encapsulated, integrated power magnetic device and method of manufacture therefor 失效
    封装的集成电力磁性装置及其制造方法

    公开(公告)号：US5659462A

    公开(公告)日：1997-08-19

    申请号：US640583

    申请日：1996-04-12

    申请人： Shiaw-Jong Steve Chen ,  Ashraf Wagih Lotfi ,  Robert Joseph Roessler ,  John David Weld

    发明人： Shiaw-Jong Steve Chen ,  Ashraf Wagih Lotfi ,  Robert Joseph Roessler ,  John David Weld

    IPC分类号： B23Q3/00 ,  H01F41/02 ,  H01F41/08 ,  H02M3/00 ,  H02M3/335 ,  H02M7/521

    CPC分类号： H01F41/08 ,  B23Q3/00 ,  H01F41/0206 ,  H02M3/00 ,  H02M3/335 ,  H01F2019/085 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T29/49078 ,  Y10T29/53196 ,  Y10T29/53265

    摘要： A power magnetic device, a method of manufacture therefor and a power converter. The power magnetic device includes: (1) an isolation transformer having a primary winding and a secondary winding, (2) a switch coupled to the primary winding, (3) a rectifier coupled to the secondary winding and (4) an encapsulant substantially surrounding the isolation transformer, the switch and the rectifier to join the isolation transformer, the switch and the rectifier into an integrated package, the integrated package having: (a) a first power input coupled to a first end of the primary winding, (b) a second power input coupled to the switch, (c) first and second power outputs coupled to the rectifier circuit and (d) a control input coupled to the switch, the control input allowing the switch to be controlled to couple the primary winding to a source of electrical power, the power magnetic device thereby capable of employing the isolation transformer and the rectifier to convert electrical power into DC electrical power.

    摘要翻译： 电力磁性装置及其制造方法和功率转换器。 功率磁性装置包括：（1）具有初级绕组和次级绕组的隔离变压器，（2）耦合到初级绕组的开关，（3）耦合到次级绕组的整流器和（4）基本上围绕 所述隔离变压器，所述开关和所述整流器将所述隔离变压器，所述开关和所述整流器连接成集成封装，所述集成封装具有：（a）耦合到所述初级绕组的第一端的第一功率输入，（b） 耦合到所述开关的第二功率输入，（c）耦合到所述整流器电路的第一和第二功率输出和（d）耦合到所述开关的控制输入，所述控制输入允许所述开关被控制以将所述初级绕组耦合到 电力源，因此功率磁性装置能够采用隔离变压器和整流器将电力转换成直流电力。

    Mirror and a method of making the same
    5.
    发明授权
    Mirror and a method of making the same 有权

    公开(公告)号：US06457836B1

    公开(公告)日：2002-10-01

    申请号：US10071381

    申请日：2002-02-08

    申请人： Edwin Arthur Chandross ,  John David Weld

    发明人： Edwin Arthur Chandross ,  John David Weld

    IPC分类号： G02B508

    CPC分类号： G02B5/08

    摘要： A reflective element, such as a mirror, includes a substrate and a reflective layer formed thereon. The substrate comprises at least one thixotropic metal alloy, which is injected into a mold to form the shape desired for the reflective element. The reflective element may also include an interface layer comprising a thermoset material, such as an epoxy resin, formed between the substrate and the reflective layer to increase the smoothness of the substrate.

    Optical system having improved fiber-device coupling
    8.
    发明授权
    Optical system having improved fiber-device coupling 失效
    具有改进的光纤耦合的光学系统

    公开(公告)号：US06588942B1

    公开(公告)日：2003-07-08

    申请号：US09544030

    申请日：2000-04-06

    申请人： John David Weld ,  Whitney White

    发明人： John David Weld ,  Whitney White

    IPC分类号： G02B636

    CPC分类号： G02B6/4228 ,  G02B6/4204 ,  G02B6/4255 ,  G02B6/4263 ,  G02B6/4292

    摘要： A system containing an improved adapter for passively aligning an active device such as a transceiver with an optical fiber having a 100 to 250 &mgr;m core is provided, such that the resulting coupling is within alignment tolerances, and provides desired coupling efficiencies and bit rates. In one embodiment, the system contains a packaged active device having a window or a lens, an optical fiber having a core of a diameter ranging from 100 to 250 &mgr;m, and a fiber connector attached to an end of the optical fiber such that a fiber endface is provided. The system further contains an adapter comprising a first receptacle that secures the fiber connector and a second receptacle that secures the packaged device, wherein the exterior of the device package, in combination with the second receptacle, itself provides passive alignment within the adapter.

    摘要翻译： 提供了一种包含改进的适配器的系统，用于被动地对准诸如收发器的有源器件与具有100至250mum芯的光纤，使得所得到的耦合在对准公差内，并且提供期望的耦合效率和比特率。 在一个实施例中，该系统包含具有窗口或透镜的封装有源器件，具有直径范围为100至250μm的芯的光纤和连接到光纤端部的光纤连接器，使得光纤 提供端面。 该系统还包括适配器，该适配器包括固定光纤连接器的第一插座和固定封装的装置的第二插座，其中，装置封装的外部与第二插座组合本身在适配器内提供被动对准。

    Method for protecting electronic circuit components
    9.
    发明授权
    Method for protecting electronic circuit components 失效
    电子电路部件保护方法

    公开(公告)号：US5689878A

    公开(公告)日：1997-11-25

    申请号：US633331

    申请日：1996-04-17

    申请人： Donald William Dahringer ,  Philip Hubbauer ,  William Roger Lambert ,  Alan Michael Lyons ,  Lloyd Shepherd ,  John David Weld

    发明人： Donald William Dahringer ,  Philip Hubbauer ,  William Roger Lambert ,  Alan Michael Lyons ,  Lloyd Shepherd ,  John David Weld

    IPC分类号： H05K5/02 ,  H05K1/02 ,  H05K3/28 ,  H05K9/00 ,  G05K5/06 ,  H01L21/56 ,  G05K9/00

    CPC分类号： H05K3/284 ,  H05K9/0039 ,  H05K1/0218 ,  H05K3/281 ,  Y10T29/49146 ,  Y10T29/49178 ,  Y10T428/1338 ,  Y10T428/1355

    摘要： An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

    摘要翻译： 一种用于保护电子产品的有源电子元件免受环境和电磁干扰（EMI）的组件。 描述了一种方法，其中通过在电子产品（例如印刷电路板）周围提供金属化的柔性外壳并随后密封金属化柔性外壳来形成组件，使得可分离的连接器可以容易地接近而不违反密封件的完整性 。 金属化柔性外壳包括提供扩散阻挡特性的多层聚合物材料和提供扩散阻挡性能和EMI屏蔽能力的金属层。 图案化多层片材以优化扩散阻挡性能和EMI屏蔽能力。 此外，多层片材能够实现高效，高批量生产。 因此，电子产品可以设置有具有环境保护能力和EMI屏蔽能力的组件，其可靠和成本有效的大批量生产。