Test circuit
    5.
    发明授权
    Test circuit 有权
    测试电路

    公开(公告)号:US07855561B2

    公开(公告)日:2010-12-21

    申请号:US12318235

    申请日:2008-12-23

    申请人: Kenichi Itoh

    发明人: Kenichi Itoh

    IPC分类号: G01R31/08

    CPC分类号: G01R31/31935 G06F11/273

    摘要: A test circuit according to the present invention includes: a synthesis circuit that synthesizes a first test result signal output from a first test target circuit in response to a test instruction, and a second test result signal output from a second test target circuit in response to the test instruction; an inter-block delay generation circuit that delays the second test result signal with respect to the first test result signal; and a test result holding circuit that holds a synthesized test result signal every predetermined timing, the synthesized test result signal being output from the synthesis circuit.

    摘要翻译: 根据本发明的测试电路包括:合成电路,其响应于测试指令合成从第一测试目标电路输出的第一测试结果信号,以及响应于第二测试目标电路输出的第二测试结果信号 测试指令; 块间​​延迟产生电路,其相对于第一测试结果信号延迟第二测试结果信号; 以及每个预定定时保持合成测试结果信号的测试结果保持电路,合成测试结果信号从合成电路输出。

    Sintered Body, Sputtering Target and Molding Die, and Process for Producing Sintered Body Employing the Same
    6.
    发明申请
    Sintered Body, Sputtering Target and Molding Die, and Process for Producing Sintered Body Employing the Same 有权
    烧结体,溅射靶和成型模,以及使用该烧结体的烧结体的制造方法

    公开(公告)号:US20080274351A1

    公开(公告)日:2008-11-06

    申请号:US11815163

    申请日:2006-01-27

    IPC分类号: C04B38/06

    摘要: To provide a large sputtering target excellent in discharge characteristics during sputtering and in characteristics of a thin film thereby obtainable. Further, a process for producing a sintered body is provided, whereby a large green body excellent in shape accuracy can be obtained by means of cold isostatic pressing directly without preforming, and a sintered body capable of providing the above-mentioned excellent sputtering target, can be produced efficiently at a low cost.The sputtering target is produced by using a sintered body having the content of carbon contained as an impurity reduced to less than 0.005 wt %. Such a sintered body is obtainable by molding a raw material powder by cold isostatic pressing directly without adding a binder containing an organic substance or a molding aid, followed by firing. Further, it becomes possible to produce such a sintered body by using a molding die having such a construction that at the time of pressure compression, pressing is applied to a filled raw material powder only in a substantially uniaxial direction, and at the time of reducing the pressure after the completion of pressing, the pressure can be released substantially isotropically with respect to the green body. Further, a large target having the thickness of an erosion region made thick, can be easily produced in good yield, and efficiency in the use of the target can be improved.

    摘要翻译: 提供溅射时放电特性优异的溅射靶和由此得到的薄膜特性。 此外,提供一种制造烧结体的方法,由此通过直接进行预均匀的冷等静压,可以获得形状精度优异的大型生坯,并且能够提供上述优异的溅射靶的烧结体 以低成本高效生产。 通过使用具有作为杂质的含有量的碳含量降低至小于0.005重量%的烧结体来制造溅射靶。 这样的烧结体可以通过直接通过冷等静压成型原料粉末而不添加含有有机物的粘合剂或成型助剂,然后进行烧成而获得。 此外,通过使用具有这样的结构的成型模具,可以制造这样的烧结体,该成型模具在压缩压缩时仅在基本上单轴方向上对填充的原料粉末施加压力,并且在还原时 压制完成后的压力,可以相对于生坯基本上各向同性地释放压力。 此外,可以容易地以良好的产率制造具有厚的侵蚀区域的厚度的大的靶,并且可以提高靶的使用效率。

    Cylindrical sputtering target
    8.
    发明授权
    Cylindrical sputtering target 有权
    圆柱形溅射靶

    公开(公告)号:US08828198B2

    公开(公告)日:2014-09-09

    申请号:US12667151

    申请日:2008-07-01

    IPC分类号: C23C14/34

    CPC分类号: C23C14/3407 C23C14/3414

    摘要: To provide a cylindrical sputtering target, whereby cracking during sputtering can be remarkably reduced.A cylindrical sputtering target, wherein a cylindrical target material made of ITO or AZO has a relative density of at least 90%; the angle between the grinding direction on its outer circumferential surface and a straight line parallel with its cylindrical axis (out of such angles, θ represents an angle between 0° and 90°) satisfies 45° πR/L (where R is an outside diameter of the cylindrical target material, and L is the length of the cylindrical target material); and the surface roughness Ra of the outer circumferential surface of the cylindrical target material is at most 3 μm.

    摘要翻译: 为了提供圆柱形溅射靶,可以显着地减少溅射过程中的裂纹。 一种圆柱形溅射靶,其中由ITO或AZO制成的圆柱形目标材料具有至少90%的相对密度; 其外圆周表面上的研磨方向与平行于其圆柱轴线的直线之间的角度(在这些角度之间,θ表示0°至90°之间的角度)满足45°<θ;θn; 90°或tan R&L(其中R是圆柱形靶材料的外径,L是圆柱形靶材料的长度); 圆筒状靶材的外周面的表面粗糙度Ra为3μm以下。

    CYLINDRICAL SPUTTERING TARGET, AND METHOD FOR MANUFACTURING SAME
    9.
    发明申请
    CYLINDRICAL SPUTTERING TARGET, AND METHOD FOR MANUFACTURING SAME 有权
    圆柱喷丸头及其制造方法

    公开(公告)号:US20110240467A1

    公开(公告)日:2011-10-06

    申请号:US13120863

    申请日:2009-09-18

    IPC分类号: C23C14/34 B31B1/62

    摘要: Provided is a cylindrical sputtering target which attains a high production yield in a film-forming process even when a film is formed by sputtering with a long cylindrical sputtering target constituted by a plurality of cylindrical target materials.A multi-divided cylindrical sputtering target formed by bonding a cylindrical base and a plurality of cylindrical target materials together with a bonding material has a divided portion where adjacent cylindrical target materials are arranged with a gap therebetween, while outer peripheral faces of the adjacent cylindrical target materials have a step of 0.5 mm or less therebetween in the divided portion. Such a target is obtained by fixing the cylindrical target materials with reference to the outer peripheral faces of the cylindrical target materials when arranging the cylindrical target materials with reference to the cylindrical base.

    摘要翻译: 提供了一种圆柱形溅射靶,即使在用由多个圆柱形目标材料构成的长圆柱形溅射靶通过溅射形成膜时,在成膜过程中也能获得高生产率。 通过将圆柱形基底和多个圆柱形目标材料与接合材料一起接合而形成的多分割圆柱形溅射靶具有分开的部分,其中相邻的圆柱形靶材料间隔开间隔,而相邻圆柱形靶材的外周面 在分割部分中,材料的间隔为0.5mm以下。 这样的目标是通过相对于圆筒状的基体配置圆筒状靶材时,相对于圆筒状靶材的外周面固定圆筒状的靶材。

    CYLINDRICAL SPUTTERING TARGET AND PROCESS FOR PRODUCING THE SAME
    10.
    发明申请
    CYLINDRICAL SPUTTERING TARGET AND PROCESS FOR PRODUCING THE SAME 审中-公开
    圆柱喷溅目标及其生产方法

    公开(公告)号:US20110100808A1

    公开(公告)日:2011-05-05

    申请号:US12997043

    申请日:2009-06-09

    IPC分类号: C23C14/06 C23C14/34 B29C71/00

    摘要: Provided is a cylindrical ceramic sputtering target, which significantly reduces the occurrence of a crack, a chip, extraordinary discharge and a nodule.By filling a molten bonding material in a cavity defined by a cylindrical ceramic target material and a cylindrical base material, starting cooling the molten bonding material from its one end toward its other end in a cylindrical axial direction in sequence, and further filling the molten bonding material in the cavity during cooling, a cylindrical ceramic sputtering target is manufactured so as to be characterized in that as observed by an X-ray radiograph of the bonding material, the total area of portions where no bonding material exists is 10 cm2 or less per 50 cm2 of X-ray radiograph area, and the maximum area of the portions where no bonding material exists is 9 cm2 or less.

    摘要翻译: 提供了一种圆柱形陶瓷溅射靶,其显着减少了裂纹,芯片,异常放电和结节的发生。 通过将熔融接合材料填充在由圆柱形陶瓷靶材料和圆柱形基材限定的空腔中,依次从圆柱形轴向从其一端朝向另一端开始冷却熔融粘合材料,并进一步填充熔融粘合 在冷却期间的空腔中的材料,制造圆柱形陶瓷溅射靶,其特征在于,通过接合材料的X射线照片观察,不存在接合材料的部分的总面积为10cm 2以下 50cm 2的X射线摄影区域,不存在接合材料的部分的最大面积为9cm 2以下。