-
公开(公告)号：US20180035552A1
公开(公告)日：2018-02-01
申请号：US15549407
申请日：2016-01-28
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Hideaki Tahara , Kazuyoshi Ohara , Munsoku O , Arinobu Nakamura
摘要： Provided is a substrate unit that has a simple structure and is able to prevent water that has entered the inside from reaching a mounting surface of the substrate. The substrate unit includes: a substrate, a first casing member that supports the substrate, and a second casing member that is integrated into one piece with the first casing member and is provided on a mounting surface side of the substrate, wherein the second casing member is provided with a protruding portion that protrudes into a housing space that is defined by the first casing member and the second casing member and houses the substrate, and intersects a plane that extends along the mounting surface of the substrate.
-
公开(公告)号：US20180027645A1
公开(公告)日：2018-01-25
申请号：US15549312
申请日：2016-01-29
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
发明人： Hideaki Tahara , Kazuyoshi Ohara , Munsoku O , Arinobu Nakamura
CPC分类号： H05K1/0203 , H01L23/13 , H01L23/36 , H01L23/367 , H01L23/49861 , H05K1/02 , H05K1/183 , H05K7/205 , H05K7/20509
摘要： Provided is a substrate unit that has an excellent heat dissipation capability. A substrate unit includes: a substrate having a conductive pattern formed on one surface thereof, the substrate being provided with an opening; a conductive member that includes a main portion that is fixed to the other surface of the substrate, and to which at least one terminal of an electronic component is electrically connected via the opening that is formed in the substrate; and a heat dissipation member with which an extension portion that extends from the main portion of the conductive member is in contact.
-
公开(公告)号：US20190141844A1
公开(公告)日：2019-05-09
申请号：US16306070
申请日：2017-05-31
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
发明人： Koki Uchida , Munsoku O
摘要： A board unit includes a case accommodating a circuit board. A power terminal connects a lead-out part of a bus bar with a connection terminal of an electric wire. A cover covers the power terminal and has a lateral wall overlapping a peripheral wall part. The lateral surface of the peripheral wall part and the lateral wall includes an engagement protrusion and an engagement recess to be engaged with the engagement protrusion. The lateral wall of the cover includes a latch piece at a position offset from the engagement protrusion or the engagement recess in a longitudinal direction and a latch portion to be latched with the latch piece which restricts displacement of the lateral wall of the cover in a direction away from the lateral surface of the peripheral wall part of the case.
-
公开(公告)号：US10681826B2
公开(公告)日：2020-06-09
申请号：US15549407
申请日：2016-01-28
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Hideaki Tahara , Kazuyoshi Ohara , Munsoku O , Arinobu Nakamura
摘要： Provided is a substrate unit that has a simple structure and is able to prevent water that has entered the inside from reaching a mounting surface of the substrate. The substrate unit includes: a substrate, a first casing member that supports the substrate, and a second casing member that is integrated into one piece with the first casing member and is provided on a mounting surface side of the substrate, wherein the second casing member is provided with a protruding portion that protrudes into a housing space that is defined by the first casing member and the second casing member and houses the substrate, and intersects a plane that extends along the mounting surface of the substrate.
-
公开(公告)号：US10561031B2
公开(公告)日：2020-02-11
申请号：US16306070
申请日：2017-05-31
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
发明人： Koki Uchida , Munsoku O
摘要： A board unit includes a case accommodating a circuit board. A power terminal connects a lead-out part of a bus bar with a connection terminal of an electric wire. A cover covers the power terminal and has a lateral wall overlapping a peripheral wall part. The lateral surface of the peripheral wall part and the lateral wall includes an engagement protrusion and an engagement recess to be engaged with the engagement protrusion. The lateral wall of the cover includes a latch piece at a position offset from the engagement protrusion or the engagement recess in a longitudinal direction and a latch portion to be latched with the latch piece which restricts displacement of the lateral wall of the cover in a direction away from the lateral surface of the peripheral wall part of the case.
-
6.发明授权公开(公告)号：US10806058B2
公开(公告)日：2020-10-13
申请号：US16300105
申请日：2017-05-10
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
发明人： Shungo Hiratani , Kazuyoshi Ohara , Munsoku O
IPC分类号： H05K7/20 , H01L25/18 , H02G3/16 , H05K5/00 , H05K5/03 , B60R16/023 , H05K7/06 , H01L25/07 , H01L23/40
摘要： Provided is a power distribution board including: a bus bar; and a heat dissipation member that is disposed on one side of the bus bar via an adhesive layer, wherein the bus bar includes a recess that is open to the adhesive layer side, and that is filled with a constituent material of the adhesive layer.
-
公开(公告)号：US10439379B2
公开(公告)日：2019-10-08
申请号：US16062997
申请日：2017-06-07
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Hideaki Tahara , Arinobu Nakamura , Kazuyoshi Ohara , Munsoku O
IPC分类号： H02G3/16 , H05K7/06 , H01R25/16 , H05K5/02 , B60R16/023 , H05K1/00 , H05K5/00 , H01R12/71 , H01R12/70 , H01R12/72 , H02G3/08
摘要： A substrate unit includes a circuit board, a connector portion installed at the front end portion of the upper side of the circuit board, a busbar connected to the circuit board and fixed to the lower side of the circuit board, a bottom portion including a recessed portion overlapping the front end portion of the circuit board and arranged on the lower side of the busbar, and a bonding layer fixing the busbar to the bottom portion. The busbar includes a non-bonding region that faces the recessed portion. A bonding region includes the bonding layer surrounding three sides other than a front side, namely a left side, a right side, and a rear side, of the non-bonding region. Notches are located on a left side and a right side of the front end portion and overlap extension lines of boundary between the non-bonding and the bonding region.
-
公开(公告)号：US20180027675A1
公开(公告)日：2018-01-25
申请号：US15547081
申请日：2016-01-28
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Hideaki Tahara , Kazuyoshi Ohara , Munsoku O , Arinobu Nakamura
CPC分类号： H05K5/0217 , H05K5/0026 , H05K5/0056 , H05K5/0213 , H05K5/0247
摘要： A case is provided with a drainage channel that smoothly drains water while also being able to suppress the intrusion of water into a housing space. The case includes a first case body in which a channel extending from a region serving as the housing space is formed. The channel includes a first channel portion having one end side connected to a first outlet and another end side connected to a second outlet, and a second channel portion connects the first channel portion and the housing space. Out of the opening edges of the second channel portion that face the first channel portion, a second-side opening edge, which is the edge on the second outlet side of the first channel portion, is located nearer to the housing space than a first-side opening edge, which is the edge on the first outlet side of the first channel portion, is.
-
公开(公告)号：US10555428B2
公开(公告)日：2020-02-04
申请号：US16302839
申请日：2017-05-10
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
摘要： The present disclosure provides a board unit including a circuit board, a connector portion mounted on the circuit board, and a case housing the circuit board. The case includes a lower case having an upper opening; an upper cover covers the upper opening, and an opening portion is formed in a side wall of the case, through which the connector portion extends inside and outside the side wall. The upper cover includes an inner circumferential surface that forms at least a portion of the opening portion and a predetermined gap with an outer circumferential surface of the connector portion. A groove portion is formed continuously along the inner circumferential surface, is open in the inner circumferential surface and is in communication with the gap. A size of the gap and a size of the groove portion are configured to form a water film by water droplets entering the case.
-
公开(公告)号：US20190208658A1
公开(公告)日：2019-07-04
申请号：US16302839
申请日：2017-05-10
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
摘要： The present disclosure provides a board unit including a circuit board, a connector portion mounted on the circuit board, and a case housing the circuit board. The case includes a lower case having an upper opening; an upper cover covers the upper opening, and an opening portion is formed in a side wall of the case, through which the connector portion extends inside and outside the side wall. The upper cover includes an inner circumferential surface that forms at least a portion of the opening portion and a predetermined gap with an outer circumferential surface of the connector portion. A groove portion is formed continuously along the inner circumferential surface, is open in the inner circumferential surface and is in communication with the gap. A size of the gap and a size of the groove portion are configured to form a water film by water droplets entering the case.
-
-
-
-
-
-
-
-
-
搜索结果
15 条记录 (耗时 0.088 秒)