公开(公告)号：US20180242461A1

公开(公告)日：2018-08-23

申请号：US15543652

申请日：2016-01-11

Applicant: Automotive Lighting Reutlingen GmbH

Inventor： Narcis Barqueros ,  Martin Gottheil ,  Michael Hiegler ,  Uwe Bormann

IPC: H05K3/30 ,  H05K3/34 ,  F21S41/20 ,  F21S41/141 ,  F21S41/19 ,  H05K1/18 ,  B23K1/00

CPC classification number: H05K3/305 ,  B23K1/0016 ,  B23K2101/40 ,  F21S41/141 ,  F21S41/19 ,  F21S41/285 ,  F21Y2115/10 ,  H05K1/0269 ,  H05K1/181 ,  H05K3/303 ,  H05K3/341 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/166 ,  Y02P70/613

Abstract: A method for placing an SMD semiconductor light source component and a component of an illumination device for a motor vehicle. The SMD semiconductor light source component is operated so as to generate light, and the emission characteristics of the SMD semiconductor light source component are determined. In a subsequent step, the SMD semiconductor light source component and the component are positioned relative to one another in accordance with the emission characteristics.

公开(公告)号：US20190353318A1

公开(公告)日：2019-11-21

申请号：US16071683

申请日：2017-01-25

Applicant: Automotive Lighting Reutlingen GmbH

Inventor： Narcis Barqueros ,  Martin Gottheil ,  Michael Hiegler ,  Uwe Bormann

IPC: F21S41/141 ,  F21S41/39

Abstract: A method for machining a holding device for a light module of a lighting device of a motor vehicle. An SMD semiconductor light source component arranged on the holding device is operated for light generation. An emission characteristic of a light-emitting surface of the SMD semiconductor light source component is determined. A mechanical feature with regard to the holding device is specified depending upon the emission characteristic. An optical element which co-operates optically with the SMD semiconductor light source component is specified depending upon the mechanical feature with regard to the SMD semiconductor light source component.