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公开(公告)号：US12002741B2
公开(公告)日：2024-06-04
申请号：US17536298
申请日：2021-11-29
发明人： Michael Leary , Ah Ron Lee , Chris Chung , YongIk Choi , Domingo Figueredo
IPC分类号： H01L23/498 , H01L21/48 , H01L23/00
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/49838 , H01L23/49822 , H01L24/16 , H01L2224/16227
摘要： In some aspects, the disclosure is directed a module for improving mechanical, electrical, or thermal performance. In some embodiments, the module includes a bottom surface, a side surface, a first solder bump disposed on the bottom surface, and a second solder bump disposed on the bottom surface. In some embodiments, the bottom surface extends in a first lateral direction and a second lateral direction perpendicular to the first lateral direction. In some embodiments, the side surface extends in a vertical direction perpendicular to the first lateral direction and the second lateral direction. In some embodiments, the second solder bump is adjacent to the side surface. In some embodiments, the first solder bump has a first length in the first lateral direction. In some embodiments, the second solder bump has a second length in the first lateral direction. In some embodiments, the first length is greater than the second length.
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公开(公告)号：US20220165685A1
公开(公告)日：2022-05-26
申请号：US17667645
申请日：2022-02-09
发明人： YongIk Choi , Chris Chung , Michael Leary , Domingo Figueredo , Chang Kyu Choi , Sarah Haney , Li Sun
IPC分类号： H01L23/00 , H01L23/13 , H01L21/48 , H01L23/498
摘要： A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.
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公开(公告)号：US12113032B2
公开(公告)日：2024-10-08
申请号：US17667645
申请日：2022-02-09
发明人： YongIk Choi , Chris Chung , Michael Leary , Domingo Figueredo , Chang Kyu Choi , Sarah Haney , Li Sun
IPC分类号： H01L23/00 , H01L21/48 , H01L23/13 , H01L23/498
CPC分类号： H01L23/562 , H01L21/4857 , H01L23/13 , H01L23/49816 , H01L23/49822 , H01L23/49838
摘要： A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.
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公开(公告)号：US11276650B2
公开(公告)日：2022-03-15
申请号：US16670564
申请日：2019-10-31
发明人： YongIk Choi , Chris Chung , Michael Leary , Domingo Figueredo , Chang Kyu Choi , Sarah Haney , Li Sun
IPC分类号： H01L23/00 , H01L23/13 , H01L21/48 , H01L23/498
摘要： A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.
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公开(公告)号：US20210134735A1
公开(公告)日：2021-05-06
申请号：US16670564
申请日：2019-10-31
发明人： YongIk Choi , Chris Chung , Michael Leary , Domingo Figueredo , Chang Kyu Choi , Sarah Haney , Li Sun
IPC分类号： H01L23/00 , H01L23/13 , H01L23/498 , H01L21/48
摘要： A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.
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