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公开(公告)号：US12113032B2
公开(公告)日：2024-10-08
申请号：US17667645
申请日：2022-02-09
发明人： YongIk Choi , Chris Chung , Michael Leary , Domingo Figueredo , Chang Kyu Choi , Sarah Haney , Li Sun
IPC分类号： H01L23/00 , H01L21/48 , H01L23/13 , H01L23/498
CPC分类号： H01L23/562 , H01L21/4857 , H01L23/13 , H01L23/49816 , H01L23/49822 , H01L23/49838
摘要： A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.
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2.发明公开公开(公告)号：US20240170384A1
公开(公告)日：2024-05-23
申请号：US17989559
申请日：2022-11-17
发明人： Li Sun , Chang Kyu Choi , Sarah Haney
IPC分类号： H01L23/498 , H01L23/31 , H01L23/552
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/49811 , H01L23/49866 , H01L23/552
摘要： DSM-LGA using substrates with different surface finish options include copper posts for electrical communication. The copper posts include a height-to-width ratio that cannot be achieved in traditional copper posts, as well as a taper ratio that forms a more rectangular cross section as opposed to traditional copper posts. Additionally, by using copper, the copper posts include a relatively high thermal conductivity (as compared to solder), thus allowing the copper posts to dissipate thermal energy generated by integrated circuits and other processors. Copper posts can take the form of a single, cylindrical post. Alternatively, copper posts can be merged to form a variety of copper structures used for various applications, including I/O, grounding/isolation, and substrate support.
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公开(公告)号：US10827617B2
公开(公告)日：2020-11-03
申请号：US16260429
申请日：2019-01-29
发明人： Dingyou Zhang , Nitesh Kumbhat , Li Sun , Sarah Haney , Chang Kyu Choi
摘要： An electronic device includes a printed circuit board (PCB) defining a cavity, a first component pad of the PCB positioned outside the cavity, and a second component pad of the PCB positioned on a bottom surface of the cavity. The first component pad has a first thickness, and the second component pad has a second thickness that is less than the first thickness of the first component pad. An electronic component, such as a surface mounted technology (SMT) component, is mounted to the second component pad within the cavity.
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公开(公告)号：US20200245465A1
公开(公告)日：2020-07-30
申请号：US16260429
申请日：2019-01-29
发明人： Dingyou Zhang , Nitesh Kumbhat , Li Sun , Sarah Haney , Chang Kyu Choi
摘要： An electronic device includes a printed circuit board (PCB) defining a cavity, a first component pad of the PCB positioned outside the cavity, and a second component pad of the PCB positioned on a bottom surface of the cavity. The first component pad has a first thickness, and the second component pad has a second thickness that is less than the first thickness of the first component pad. An electronic component, such as a surface mounted technology (SMT) component, is mounted to the second component pad within the cavity.
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公开(公告)号：US11276650B2
公开(公告)日：2022-03-15
申请号：US16670564
申请日：2019-10-31
发明人： YongIk Choi , Chris Chung , Michael Leary , Domingo Figueredo , Chang Kyu Choi , Sarah Haney , Li Sun
IPC分类号： H01L23/00 , H01L23/13 , H01L21/48 , H01L23/498
摘要： A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.
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公开(公告)号：US20210134735A1
公开(公告)日：2021-05-06
申请号：US16670564
申请日：2019-10-31
发明人： YongIk Choi , Chris Chung , Michael Leary , Domingo Figueredo , Chang Kyu Choi , Sarah Haney , Li Sun
IPC分类号： H01L23/00 , H01L23/13 , H01L23/498 , H01L21/48
摘要： A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.
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公开(公告)号：US20220165685A1
公开(公告)日：2022-05-26
申请号：US17667645
申请日：2022-02-09
发明人： YongIk Choi , Chris Chung , Michael Leary , Domingo Figueredo , Chang Kyu Choi , Sarah Haney , Li Sun
IPC分类号： H01L23/00 , H01L23/13 , H01L21/48 , H01L23/498
摘要： A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.
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