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公开(公告)号：US20240038743A1
公开(公告)日：2024-02-01
申请号：US17875647
申请日：2022-07-28
发明人： Dingyou Zhang , Li Sun
CPC分类号： H01L25/162 , H05K1/183 , H05K1/181 , H01L21/563 , H01L23/49833 , H01L24/16 , H01L24/48 , H01L24/32 , H01L24/73 , H01L24/13 , H01L23/3135 , H05K2201/10015 , H05K2201/1003 , H01L2924/15321 , H01L2924/3025 , H01L2924/2027 , H01L2924/182 , H01L2224/13147 , H01L2224/13155 , H01L2924/19042 , H01L2924/19041 , H01L2224/16227 , H01L2224/16238 , H01L2224/48229 , H01L2224/32145 , H01L2224/32227 , H01L2224/32238 , H01L2224/16148 , H01L2224/13005 , H01L2224/73265 , H01L2224/73253 , H01L2224/73215
摘要： A module is described. The module includes two dies which are stacked over a top insulating layer of a PCB. When both dies are be connected to the PCB through a copper pillar, the top die has a taller interconnect and the bottom die has a shorter interconnect. To further reduce a height of the module, the bottom die and/or the top die may be placed into a cavity of the PCB and a bulk silicon layer of the top die may be grinded away.
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公开(公告)号：US20220165685A1
公开(公告)日：2022-05-26
申请号：US17667645
申请日：2022-02-09
发明人： YongIk Choi , Chris Chung , Michael Leary , Domingo Figueredo , Chang Kyu Choi , Sarah Haney , Li Sun
IPC分类号： H01L23/00 , H01L23/13 , H01L21/48 , H01L23/498
摘要： A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.
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公开(公告)号：US20240121884A1
公开(公告)日：2024-04-11
申请号：US17961235
申请日：2022-10-06
发明人： Hongya Xu , Valter Pasku , Martin Handtmann , Lueder Elbrecht , Li Sun
IPC分类号： H05K1/02 , H01L23/498 , H01L23/552
CPC分类号： H05K1/0222 , H01L23/49827 , H01L23/552
摘要： One way to stop electromagnetic fields from leaking outside of a module is an electric wall. Embodiments of the present disclosure are directed to emulating an electric wall with through vias. The through vias may be arranged around cavities in the printed circuit board. The density of the through vias may be selected based on an expected wavelength of the electromagnetic fields. The printed circuit board may then self-isolate components within the cavities from the electromagnetic fields.
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公开(公告)号：US11276650B2
公开(公告)日：2022-03-15
申请号：US16670564
申请日：2019-10-31
发明人： YongIk Choi , Chris Chung , Michael Leary , Domingo Figueredo , Chang Kyu Choi , Sarah Haney , Li Sun
IPC分类号： H01L23/00 , H01L23/13 , H01L21/48 , H01L23/498
摘要： A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.
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公开(公告)号：US20210134735A1
公开(公告)日：2021-05-06
申请号：US16670564
申请日：2019-10-31
发明人： YongIk Choi , Chris Chung , Michael Leary , Domingo Figueredo , Chang Kyu Choi , Sarah Haney , Li Sun
IPC分类号： H01L23/00 , H01L23/13 , H01L23/498 , H01L21/48
摘要： A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.
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公开(公告)号：US20240363503A1
公开(公告)日：2024-10-31
申请号：US18309308
申请日：2023-04-28
发明人： Dingyou Zhang , Li Sun
IPC分类号： H01L23/495 , H01L23/00 , H01L23/498
CPC分类号： H01L23/49575 , H01L23/4952 , H01L23/49827 , H01L24/09 , H01L24/49 , H01L2224/0903 , H01L2224/09102 , H01L2224/4903 , H01L2224/49107 , H01L2224/49421
摘要： The present invention relates to semiconductor devices and integrated circuit packaging. In a specific embodiment, a semiconductor device comprising a double-sided fanout die package is provided. On one surface of a main circuit board for the semiconductor device, regular single-sided flip-chip dies and tall SMT components are coupled, along with one or more double-sided fanout dies, which are stacked with corresponding sub-sized circuit boards that are also coupled to the same surface, with a smaller height than the tallest surface mount device. A portion of the metal routing and grounding connections in the main circuit board for one or more double-sided fanout dies can be transferred to the sub-sized circuit boards, thereby reducing the area of the main circuit board without increasing the number of circuit board layers. There are other embodiments as well.
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7.发明公开公开(公告)号：US20240170384A1
公开(公告)日：2024-05-23
申请号：US17989559
申请日：2022-11-17
发明人： Li Sun , Chang Kyu Choi , Sarah Haney
IPC分类号： H01L23/498 , H01L23/31 , H01L23/552
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/49811 , H01L23/49866 , H01L23/552
摘要： DSM-LGA using substrates with different surface finish options include copper posts for electrical communication. The copper posts include a height-to-width ratio that cannot be achieved in traditional copper posts, as well as a taper ratio that forms a more rectangular cross section as opposed to traditional copper posts. Additionally, by using copper, the copper posts include a relatively high thermal conductivity (as compared to solder), thus allowing the copper posts to dissipate thermal energy generated by integrated circuits and other processors. Copper posts can take the form of a single, cylindrical post. Alternatively, copper posts can be merged to form a variety of copper structures used for various applications, including I/O, grounding/isolation, and substrate support.
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公开(公告)号：US10827617B2
公开(公告)日：2020-11-03
申请号：US16260429
申请日：2019-01-29
发明人： Dingyou Zhang , Nitesh Kumbhat , Li Sun , Sarah Haney , Chang Kyu Choi
摘要： An electronic device includes a printed circuit board (PCB) defining a cavity, a first component pad of the PCB positioned outside the cavity, and a second component pad of the PCB positioned on a bottom surface of the cavity. The first component pad has a first thickness, and the second component pad has a second thickness that is less than the first thickness of the first component pad. An electronic component, such as a surface mounted technology (SMT) component, is mounted to the second component pad within the cavity.
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公开(公告)号：US20200245465A1
公开(公告)日：2020-07-30
申请号：US16260429
申请日：2019-01-29
发明人： Dingyou Zhang , Nitesh Kumbhat , Li Sun , Sarah Haney , Chang Kyu Choi
摘要： An electronic device includes a printed circuit board (PCB) defining a cavity, a first component pad of the PCB positioned outside the cavity, and a second component pad of the PCB positioned on a bottom surface of the cavity. The first component pad has a first thickness, and the second component pad has a second thickness that is less than the first thickness of the first component pad. An electronic component, such as a surface mounted technology (SMT) component, is mounted to the second component pad within the cavity.
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公开(公告)号：US20230343704A1
公开(公告)日：2023-10-26
申请号：US17727586
申请日：2022-04-22
发明人： Dingyou Zhang , Christopher Paul Wade , Li Sun , Chris Chung
IPC分类号： H01L23/528 , H01L25/18 , H01L23/498 , H01L23/00 , H01L21/48 , H01L23/31
CPC分类号： H01L23/5283 , H01L25/18 , H01L23/49816 , H01L24/17 , H01L24/11 , H01L24/27 , H01L24/30 , H01L21/4857 , H01L23/3128 , H01L2924/15311 , H01L2224/92125 , H01L2224/73204 , H01L2224/17104
摘要： An apparatus includes a first substrate comprising one or more first interconnection layers, wherein a first die is coupled to a first side of the first substrate, and a second substrate comprising one or more second interconnection layers. The second die may be coupled to a first side of the second substrate, and a third die is coupled to a second side of the second substrate. The first substrate and the second substrate may be stacked together.
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