Abstract:
Thermoplastic polyamide particles comprise at least one polyamide and at least one particulate inorganic filler having a density of at least 2.5 g/cm3, the thermoplastic polyamide particles having a density of at least 1.65 g/cm3, preferably at least 1.9 g/cm3, and an ellipsoidal or approximately ellipsoidal shape with a largest diameter of 1 to 100 mm, preferably 2 to 10 mm, more preferably 3 to 8 mm, or they comprise at least one polyamide and at least one inorganic filler, which is a particulate BaSO4 filler, having a D50-value of the particle size distribution of at least 10 μm and/or a D90-value of at least 15 μm, preferably at least 40 μm.
Abstract:
The invention relates to the use of a thermoplastic molding composition which comprises at least one polybiphenyl ether sulfone polymer, to produce moldings for conveying gas.