POLYBUTYLENE TEREPHTHALATE THERMOFORMING PROCESS

    公开(公告)号:US20220176611A1

    公开(公告)日:2022-06-09

    申请号:US17601533

    申请日:2020-04-08

    Applicant: BASF SE

    Abstract: The invention relates to the use of a thermoplastic polymer having a melting point below 220° C. as additive in polybutylene terephthalate molding compositions for reducing the necking upon elongation of sheets or films of the polybutylene terephthalate molding composition, preferably wherein the polybutylene terephthalate molding composition comprises a) 50 to 95 wt % of polybutylene terephthalate as component A, b) 5 to 50 wt % of the thermoplastic polymer having a melting point below 220° C., as component B, c) 0 to 45 wt % of filler as component C, d) 0 to 20 wt % of further additives as component D, wherein the total of components A to D is 100 wt %.

    POLYESTER FOR PROFILE EXTRUSION AND/OR PIPE EXTRUSION

    公开(公告)号:US20190203037A1

    公开(公告)日:2019-07-04

    申请号:US16330501

    申请日:2017-08-28

    Applicant: BASF SE

    Abstract: Thermoplastic molding compositions containing A) from 29 to 99.99% by weight of a polyester, B) from 0.01 to 10% by weight of an ionomer composed of at least one copolymer of B1) from 30 to 99.9% by weight of ethylene B2) from 0 to 60% by weight of 1-octene or 1-butene or propylene or a mixture of these and B3) from 0.01 to 70% by weight of functional monomers, where the functional monomers are selected from the group of the carboxylic acid groups, carboxylic anhydride groups, carboxylic ester groups and mixtures of these, where component B) has been neutralized to an extent of at least 20% with alkali metal ions, based on 100% by weight of A) and B), and C) from 0 to 70% by weight of other additional substances, where the sum of the % by weight values for A) to C) is 100%, for use in the production of cable sheathing or optical-conductor sheathing via blow molding, profile extrusion, and/or pipe extrusion.

    Polyester molding compounds with low TOC emission

    公开(公告)号:US09815980B2

    公开(公告)日:2017-11-14

    申请号:US14894543

    申请日:2014-05-27

    Applicant: BASF SE

    CPC classification number: C08L67/02 C08L2205/06 C08L33/02

    Abstract: 1. Thermoplastic molding composition comprising A) from 30 to 99.99% by weight of a polyester composed of from 50 to 100% by weight of at least one polyalkylene terephthalate A1), based on A), and from 0 to 50% by weight of a polyester A2), differing from A1), B) from 0.01 to 2% by weight of an acrylic acid polymer, composed of B1) from 70 to 100% by weight of acrylic acid, B2) from 0 to 30% by weight of at least one other ethylenically unsaturated monomer copolymerizable with acrylic acid, selected from the group of monoethylenically unsaturated carboxylic acids, and C) from 0 to 70% by weight of other additional substances, where the total of the percentages by weight of components A) to C) is 100%.

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