公开(公告)号：US20230265576A1

公开(公告)日：2023-08-24

申请号：US18005171

申请日：2021-06-30

Applicant: BASF SE

Inventor： Charlotte EMNET ,  Verena STREMPEL ,  Lucas Benjamin HENDERSON ,  Alexander FLUEGEL ,  Robert BRAENDLE ,  Sathana KITAYAPORN ,  Nadine ENGELHARDT

IPC: C25D3/38

CPC classification number: C25D3/38

Abstract: Described herein is an acidic aqueous composition for copper electroplating including

(a) copper ions;
(b) bromide ions; and
(c) at least one additive of formula S1






where
XS1 is selected from the group consisting of a linear, branched or cyclic C1-C12 alkanediyl;
RS1 is a monovalent

(a) poly(oxy(C3 to C6)alkylene)-block-poly(oxyethylene) group, or
(b) a poly(oxyethylene)-block-poly(oxy(C3 to C6)alkylene)-block-poly(oxyethylene) group;


RS2, RS3, RS4

(a) are selected from the group consisting of H, RS1, RS40, or
(b) RS3 and an adjacent group RS4 or, if n>2, two adjacent groups RS4 may together form a divalent group XS3;


RS40 is selected from the group consisting of (a) linear or branched C1-C20 alkyl, and (b) linear or branched C1-C20 alkenyl;
XS3 is selected from the group consisting of a linear, branched or cyclic C1-C12 alkanediyl; and
n is an integer of from 1 to 6.