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公开(公告)号：US20250051949A1
公开(公告)日：2025-02-13
申请号：US18720906
申请日：2022-12-20
Applicant: BASF SE
Inventor： Charlotte EMNET , Lucas Benjamin HENDERSON , Alexander FLUEGEL , Sathana KITAYAPORN , Nadine ENGELHARDT
Abstract: Described herein is a composition for depositing copper on a semiconductor substrate, the composition including
(a) copper ions;
(b) a grain refiner of formula G1a or G1b or salts thereof; (c) a complexing agent; and
(d) optionally a buffer or a base to adjust the pH to a pH of from 7 to 13;
wherein
RG1 is selected from one or more H, C1 to C4 carboxyl, C1 to C4 alkyl, C1 to C6 alkoxy, halogen, and CN;
RG2 is selected from one or more H, C1 to C4 carboxyl, C1 to C4 alkyl, C1 to C6 alkoxy, halogen, and CN; and
XG1 is selected from C1 to 6 alkanediyl or a group —XG11—C(O)—O—XG12—;
XG11 is selected from a chemical bond or C1 to C4 alkandiyl;
XG12 is selected from a chemical bond or C1 to C4 alkandiyl; and wherein RG1 or RG2, comprises at least one C1 to C4 carboxyl group, or group XG1 is —XG11—C(O)—O—)—XG12—; wherein the pH of the composition is from 7 to 13.-
公开(公告)号：US20200347503A1
公开(公告)日：2020-11-05
申请号：US16762717
申请日：2018-11-19
Applicant: BASF SE
Inventor： Nadine ENGELHARDT , Dieter MAYER , Marco ARNOLD , Alexander FLUEGEL , Charlotte EMNET , Lucas Benjamin HENDERSON
Abstract: A cobalt electrodeposition composition comprising cobalt ions, and particular leveling agents comprising X1—CO—O—R11, X1—SO2—O—R11, X1—PO(OR11)2, X1—SO—O—R11 functional groups, wherein X1 is a divalent group selected from (i) a chemical bond (ii) aryl, (iii) C1 to C12 alkandiyl, which may be interrupted by O atoms, (iv) an arylalkyl group —X11—X12—, (v) an alkylaryl group —X12—X11—, and (vi) —(O—C2H3R12)mO—, R11 is selected from H and C1 to C4 alkyl. R12 is selected from H and C1 to C4 alkyl, X12 is a divalent aryl group, X11 is a divalent C1 to C15 alkandiyl group.
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Patent Agency Ranking
公开(公告)号：US20230265576A1
公开(公告)日：2023-08-24
申请号：US18005171
申请日：2021-06-30
Applicant: BASF SE
Inventor： Charlotte EMNET , Verena STREMPEL , Lucas Benjamin HENDERSON , Alexander FLUEGEL , Robert BRAENDLE , Sathana KITAYAPORN , Nadine ENGELHARDT
IPC: C25D3/38
CPC classification number: C25D3/38
Abstract: Described herein is an acidic aqueous composition for copper electroplating including
(a) copper ions;
(b) bromide ions; and
(c) at least one additive of formula S1
where
XS1 is selected from the group consisting of a linear, branched or cyclic C1-C12 alkanediyl;
RS1 is a monovalent
(a) poly(oxy(C3 to C6)alkylene)-block-poly(oxyethylene) group, or
(b) a poly(oxyethylene)-block-poly(oxy(C3 to C6)alkylene)-block-poly(oxyethylene) group;
RS2, RS3, RS4
(a) are selected from the group consisting of H, RS1, RS40, or
(b) RS3 and an adjacent group RS4 or, if n>2, two adjacent groups RS4 may together form a divalent group XS3;
RS40 is selected from the group consisting of (a) linear or branched C1-C20 alkyl, and (b) linear or branched C1-C20 alkenyl;
XS3 is selected from the group consisting of a linear, branched or cyclic C1-C12 alkanediyl; and
n is an integer of from 1 to 6.-
公开(公告)号：US20220298664A1
公开(公告)日：2022-09-22
申请号：US17805144
申请日：2022-06-02
Applicant: BASF SE
Inventor： Nadine ENGELHARDT , Dieter MAYER , Marco ARNOLD , Alexander FLUEGEL , Charlotte EMNET , Lucas Benjamin HENDERSON
Abstract: Described herein is a cobalt electrodeposition composition including cobalt ions, and particular leveling agents including X1—CO—O—R11, X1—SO2—O—R11, X1—PO(OR11)2, X1—SO—O—R11 functional groups, where X1 is a divalent group selected from (i) a chemical bond (ii) aryl, (iii) C1 to C12 alkandiyl, which may be interrupted by O atoms, (iv) an arylalkyl group —X11—X12—, (v) an alkylaryl group —X12—X11— and (vi) —(O—C2H3R12)mO—, R11 is selected from H and C1 to C4 alkyl. R12 is selected from H and C1 to C4 alkyl, X12 is a divalent aryl group, and X11 is a divalent C1 to C15 alkandiyl group.
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公开(公告)号：US20250051950A1
公开(公告)日：2025-02-13
申请号：US18721238
申请日：2022-12-20
Applicant: BASF SE
Inventor： Charlotte EMNET , Lucas Benjamin HENDERSON , Alexander FLUEGEL , Sathana KITAYAPORN , Nadine ENGELHARDT
IPC: C25D3/38 , C25D5/02 , C25D7/12 , H01L21/768 , H01L23/532
Abstract: Disclosed herein is a composition for depositing copper on a semiconductor substrate, the composition including (a) copper ions; (b) an additive of formula S1 (c) a complexing agent; and (d) optionally a buffer or base to adjust the pH to a pH of from 7 to 13; where the pH of the composition is from 7 to 13 and where the composition is free of any cyanide.
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公开(公告)号：US20220324885A1
公开(公告)日：2022-10-13
申请号：US17626836
申请日：2020-07-03
Applicant: BASF SE
Inventor： Szilard CSIHONY , Jean-Pierre Berkan LINDNER , Daniel LOEFFLER , Yeni BURK , Ingolf HENNIG , Lucas Benjamin HENDERSON , Birgit GERKE , Rui DE OLIVEIRA , Volodymyr BOYKO , Frank PIRRUNG
Abstract: A composition comprising a monomer of the general formula (M1) wherein M is a metal or semimetal of main group 3 or 4 of the periodic table; XM1, XM2 are each O; RM1, RM2 are the same or different and are each an —CRaRb—Ar—O—Rc; Ar is a C6 to C30 carbocyclic ring system; Ra, Rb are the same or different and are each H or C1 to C6 alkyl; Rc is C1-C22-alkyl, benzyl or phenyl; q according to the valency and charge of M is 0 or 1; XM3, XM4 are the same or different and are each O, C6 to C10 aryl, or —CH2—; RM3, RM4 are the same or different and are each RM1, H, C1-C22 alkyl, or a polymer selected from a polyalkylene, a polysiloxane, or a polyether.
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公开(公告)号：US20210395513A1
公开(公告)日：2021-12-23
申请号：US17281230
申请日：2019-09-26
Applicant: BASF SE
Inventor： Jean-Pierre Berkan LINDNER , Szilard CSIHONY , Daniel LOEFFLER , Yeni BURK , Birgit GERKE , Frank PIRRUNG , Lucas Benjamin HENDERSON , Volodymyr BOYKO , Rui DE OLIVEIRA , Ingolf HENNIG , Miran YU
Abstract: A resin composition, comprising (a) at least one epoxy resin, and (b) at least one siloxane-type curing agent of formula C22 or C31 (C22) (C31) wherein the resin composition does essentially not contain any fluoride or bromide.
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